ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
14-8320-310C
14-8320-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks
VYV-4XMP-2CCONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
0P-DD-VIB
0P-DD-VIB
1+3.13725
Increments of 1
Leadtime
2-3 weeks
HV7-6GZ-QFHADAPTOR PLUG-*Active---------------
XR2C-2000-HSG
XR2C-2000-HSG
1000+0.138814
Increments of 1000
Leadtime
2-3 weeks
EFNS-GR-29CONN IC SOCKET 20POSBulkXR2ActiveHousing20 1 x 20 0.100 2.54mm --Beryllium Copper-Closed FrameSolder0.100 2.54mm --Beryllium CopperPolybutylene Terephthalate PBT , Glass Filled-55°C ~ 125°C
517-87-565-21-111111
517-87-565-21-111111
18+29.8404
Increments of 18
Leadtime
2-3 weeks
AGML-GJU-2WCONN SOCKET PGA 565POS GOLDBulk517ActivePGA565 21 x 21 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
20-8310-310C
20-8310-310C
10+9.79412
Increments of 10
Leadtime
2-3 weeks
YZKGE-NP1-AGCONN IC DIP SOCKET 20POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
114-87-642-41-134161
114-87-642-41-134161
270+1.76035
Increments of 270
Leadtime
2-3 weeks
AYTYE-H3GC-3ENCONN IC DIP SOCKET 42POS GOLDTube114ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
16-822-90WR
16-822-90WR
12+8.70915
Increments of 12
Leadtime
2-3 weeks
V7A-MLF-11CONN IC DIP SOCKET 16POS GOLDBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
840-AG11D-ESL-LF
840-AG11D-ESL-LF
1+4.61765
10+4.43235
50+3.87824
100+3.69363
250+3.23196
Increments of 1
Leadtime
2-3 weeks
INRUG-25Q-CRICONN IC DIP SOCKET 40POS GOLDTube800ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm GoldFlashCopperPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 105°C
110-83-628-41-005101
110-83-628-41-005101
252+1.77536
Increments of 252
Leadtime
2-3 weeks
FAVU-KFA-XNFCONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
32-0518-11
32-0518-11
26+4.30166
Increments of 26
Leadtime
2-3 weeks
I8-X3-OWCONN SOCKET SIP 32POS GOLDBulk518ActiveSIP32 1 x 32 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
123-43-422-41-001000
123-43-422-41-001000
1+5.05882
10+4.18333
50+3.48627
100+3.13765
250+2.89361
Increments of 1
Leadtime
2-3 weeks
DHXV-WB-U7OCONN IC DIP SOCKET 22POS GOLDTube123ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
28-3518-01
28-3518-01
8+12.3725
Increments of 8
Leadtime
2-3 weeks
TLRE-F5-KVDCONN IC DIP SOCKET 28POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
E3AIF-BS2B-35V
E3AIF-BS2B-35V
25+9.52941
Increments of 25
Leadtime
2-3 weeks
GKYUV-CI-EV3CONN SOCKET SIP 7POS GOLDBulk511ActiveSIP7 1 x 7 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
28-3570-10
28-3570-10
10+11.8804
Increments of 10
Leadtime
2-3 weeks
QJ6Q-XH5-IQCONN IC DIP SOCKET ZIF 28POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
APA-640-G-K
APA-640-G-K
1+12.2941
Increments of 1
Leadtime
2-3 weeks
NL3-7CY-1KKADAPTOR PLUG-*Active---------------
9-1437520-1
9-1437520-1
Leadtime
2-3 weeks
H1M-YTZ-BCSTAMPED PIN-*Obsolete---------------
510-87-040-11-061101
510-87-040-11-061101
323+1.50368
Increments of 323
Leadtime
2-3 weeks
COL2-7YG-5SQCONN SOCKET PGA 40POS GOLDBulk510ActivePGA40 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
517-83-685-19-000111
517-83-685-19-000111
10+49.8824
Increments of 10
Leadtime
2-3 weeks
FHD-B0-PK0CONN SOCKET PGA 685POS GOLDBulk517ActivePGA685 19 x 19 0.050 1.27mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-83-084-11-042101
510-83-084-11-042101
95+5.51858
Increments of 95
Leadtime
2-3 weeks
BR-O06-Y8CONN SOCKET PGA 84POS GOLDBulk510ActivePGA84 11 x 11 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
05-0501-31
05-0501-31
18+6.31972
Increments of 18
Leadtime
2-3 weeks
PXR-ZPZ-WTTCONN SOCKET SIP 5POS GOLDBulk501ActiveSIP5 1 x 5 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
410-93-220-10-001000
410-93-220-10-001000
540+1.49175
Increments of 540
Leadtime
2-3 weeks
EO2DH-XO-WHDCONN ZIG-ZAG 20POS GOLDBulk410ActiveZig-Zag, Left Stackable20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
110-41-324-41-001000
110-41-324-41-001000
15008+0.59902
Increments of 15008
Leadtime
2-3 weeks
LL8T9-IX-CI110 DIP DUAL IN LINE SOCKET-*Active---------------
510-83-085-11-044101
510-83-085-11-044101
95+5.58421
Increments of 95
Leadtime
2-3 weeks
S0K8J-TJF8-GO3CONN SOCKET PGA 85POS GOLDBulk510ActivePGA85 11 x 11 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
120-PLS13015-12
120-PLS13015-12
2+53.2696
Increments of 2
Leadtime
2-3 weeks
J08M2-PYTK-278CONN SOCKET PGA ZIF GOLDBulkPLSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
5Y2-8Q-5AH
5Y2-8Q-5AH
Leadtime
2-3 weeks
EM1-EZ1-IHCONN IC DIP SOCKET 40POS GOLDTubeDiplomate DLObsoleteDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C