ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
10-6810-90TWR
10-6810-90TWR
13+8.27677
Increments of 13
Leadtime
2-3 weeks		E5-ATM-GWGCONN IC DIP SOCKET 10POS TINBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing10 2 x 5 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
28-1508-31
28-1508-31
6+14.7173
Increments of 6
Leadtime
2-3 weeks		SAGD-2GD2-C1CONN IC DIP SOCKET 28POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
115-87-304-41-001101
115-87-304-41-001101
3150+0.130882
Increments of 3150
Leadtime
2-3 weeks		O2FN0-5XD7-POCONN IC DIP SOCKET 4POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
614-87-422-41-001101
614-87-422-41-001101
414+1.14874
Increments of 414
Leadtime
2-3 weeks		FZ-YZ-35ECONN IC DIP SOCKET 22POS GOLDBulk614ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
550-10-456M26-001166
550-10-456M26-001166
14+89.4888
Increments of 14
Leadtime
2-3 weeks		N25C-J3M-LNKBGA PIN ADAPTER 1.27MM SMDBulk550ActiveBGA456 26 x 26 0.050 1.27mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
27-7XXXX-10
27-7XXXX-10
8+13.1569
Increments of 8
Leadtime
2-3 weeks		O46PU-MJY-0HCONN SOCKET SIP 27POS TINBulk700 Elevator Strip-Line™ActiveSIP27 1 x 27 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-87-652-41-012101
116-87-652-41-012101
128+3.93581
Increments of 128
Leadtime
2-3 weeks		BJ-PG-FYICONN IC DIP SOCKET 52POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing52 2 x 26 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
HIC-764-SST
HIC-764-SST
1+5.95098
Increments of 1
Leadtime
2-3 weeks		MQJ-DJG-HFPCONN IC DIP SOCKET 64POS GOLDTubeHICActiveDIP, 0.75 19.05mm Row Spacing64 2 x 32 0.070 1.78mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Gold200µin 5.08µm BrassPolyester, Glass Filled-
APA-624-T-P
APA-624-T-P
1+5.34314
Increments of 1
Leadtime
2-3 weeks		HQKQ-62Q-WPADAPTOR PLUG-*Active---------------
4600
4600
1+2.28431
10+1.48431
50+1.33294
100+1.27235
250+1.15118
Increments of 1
Leadtime
2-3 weeks		XZ1-VTX-XRCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 Oval -Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
126-93-420-41-003000
126-93-420-41-003000
60+13.2817
120+9.20278
300+5.64363
Increments of 60
6969U-1Q25-N12CONN IC DIP SOCKET 20POS GOLDTube126ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
24-8900-310C
24-8900-310C
8+12.7647
Increments of 8
Leadtime
2-3 weeks		SAI4U-JY-9ULCONN IC DIP SOCKET 24POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
14-1508-30
14-1508-30
22+5.52941
Increments of 22
5353-V9O-YOPCONN IC DIP SOCKET 14POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing14 2 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
508-AG8D
508-AG8D
300+18.644
Increments of 300
55JP-Q3AN-TRVCONN IC DIP SOCKET 8POS TIN-LEADTube500ActiveDIP, 0.6 15.24mm Row Spacing8 2 x 4 0.100 2.54mm Tin-Lead-Copper AlloyThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-Lead-Copper Alloy--55°C ~ 125°C
510-87-237-17-061101
510-87-237-17-061101
60+8.90866
Increments of 60
Leadtime
2-3 weeks		P1-Y4LM-JSCONN SOCKET PGA 237POS GOLDBulk510ActivePGA237 17 x 17 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
2-1814655-5
2-1814655-5
Leadtime
2-3 weeks		J4B-D8-R63CONN SOCKET SIP 32POS GOLDBulk-ObsoleteSIP32 1 x 32 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold29.5µin 0.75µm BrassThermoplastic, Polyester-55°C ~ 125°C
299-43-632-10-002000
299-43-632-10-002000
96+9.38716
Increments of 96
Leadtime
2-3 weeks		LR-R7-EXCONN IC DIP SOCKET 32POS GOLDTube299ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
123-43-648-41-001000
123-43-648-41-001000
144+5.62507
Increments of 144
Leadtime
2-3 weeks		KXQ-4T-8Y6CONN IC DIP SOCKET 48POS GOLDTube123ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
BU180Z-178-HT
BU180Z-178-HT
1+2.4902
10+2.26275
50+2.03176
100+1.93941
250+1.75471
Increments of 1
556556UP-VA-XJCONN IC DIP SOCKET 18POS GOLDTubeBU-178HTActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold78.7µin 2.00µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm CopperFlashBrassPolybutylene Terephthalate PBT , Glass Filled-55°C ~ 125°C
115-87-308-41-003101
115-87-308-41-003101
1404+0.296843
Increments of 1404
55H-NL57-4MCONN IC DIP SOCKET 8POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
A9-YZZ-96
A9-YZZ-96
99V-EGN-4FCONN SOCKET PLCC 68POS TIN-LEADTube940ObsoletePLCC68 4 x 17 0.100 2.54mm Tin-Lead100µin 2.54µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
115-83-624-41-003101
115-83-624-41-003101
323+1.49169
Increments of 323
Leadtime
2-3 weeks		ZGC1I-QK5-K5CONN IC DIP SOCKET 24POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
40-6556-21
40-6556-21
4+19.9559
Increments of 4
11RMS-22TI-8ICONN IC DIP SOCKET 40POS GOLDBulk6556ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyphenylene Sulfide PPS , Glass Filled-
346-43-144-41-013000
346-43-144-41-013000
1+7.97059
10+7.13137
100+5.87265
500+4.64222
1000+3.98504
Increments of 1
Leadtime
2-3 weeks		P3-B111-RK7CONN SOCKET SIP 44POS GOLDBulk346ActiveSIP44 1 x 44 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
550-80-169-17-101101
550-80-169-17-101101
36+16.8007
Increments of 36
Leadtime
2-3 weeks		VH3-ZPS-I22PGA SOLDER TAILBulk550ActivePGA169 17 x 17 0.100 2.54mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C