ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
OBWZR-9UM-B8
OBWZR-9UM-B8
33ESE-EB-I0CONN SOCKET SIP 10POS TIN-LEAD-SPF080-1xObsoleteSIP10 1 x 10 0.100 2.54mm Tin-Lead200µin 5.08µm -Through HoleClosed Frame-------
18-3518-11
18-3518-11
44+2.80147
Increments of 44
Leadtime
2-3 weeks		A80-0A1-ODCCONN IC DIP SOCKET 18POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
11-0508-20
11-0508-20
27+4.12491
Increments of 27
Leadtime
2-3 weeks		LW64-RDVM-AQCCONN SOCKET SIP 11POS GOLDBulk508ActiveSIP11 1 x 11 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
64E-ZM-5R5
64E-ZM-5R5
4+23.4559
Increments of 4
Leadtime
2-3 weeks		C21DQ-CCY-26BCONN IC DIP SOCKET ZIF 44POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing44 2 x 22 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
510-83-100-13-062101
510-83-100-13-062101
80+6.56985
Increments of 80
22M0X-CE5M-KUCONN SOCKET PGA 100POS GOLDBulk510ActivePGA100 13 x 13 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
30-0518-10
30-0518-10
40+2.77941
Increments of 40
Leadtime
2-3 weeks		DZMK-O8M-FKFCONN SOCKET SIP 30POS GOLDBulk518ActiveSIP30 1 x 30 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
110-83-628-41-005101
110-83-628-41-005101
252+1.77536
Increments of 252
Leadtime
2-3 weeks		ATF-LS-92CONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-87-314-41-105101
110-87-314-41-105101
551+0.832853
Increments of 551
Leadtime
2-3 weeks		AZ9X-3H7Q-83GCONN IC DIP SOCKET 14POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
5-1814640-0
5-1814640-0
420+5.75081
Increments of 420
Leadtime
2-3 weeks		CYN9I-YX-C3CONN IC DIP SOCKET 28POS TINTape & Reel TR -ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin196.8µin 5.00µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin196.8µin 5.00µm BrassThermoplastic, Polyester-55°C ~ 125°C
36-6823-90
36-6823-90
7+13.4174
Increments of 7
Leadtime
2-3 weeks		JEOE2-L38-6XCONN IC DIP SOCKET 36POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
APA-316-G-Q
APA-316-G-Q
1+9.4902
Increments of 1
Leadtime
2-3 weeks		HPF3-6FX-MNRADAPTOR PLUG-*Active---------------
XR2A-3211-N
XR2A-3211-N
15+4.18105
Increments of 15
Leadtime
2-3 weeks		N71V-3PF8-VWCONN IC DIP SOCKET 32POS GOLDBulkXR2ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolybutylene Terephthalate PBT , Glass Filled-55°C ~ 125°C
48-6570-10
48-6570-10
7+15.0588
Increments of 7
Leadtime
2-3 weeks		KOQCJ-7PU8-MUUCONN IC DIP SOCKET ZIF 48POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
214-44-318-01-670800
214-44-318-01-670800
1+2.27451
10+1.8902
50+1.5751
100+1.4
250+1.22502
Increments of 1
88K3-O5BF-IMTCONN IC DIP SOCKET 18POS TINTube214ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Tin100µin 2.54µm Beryllium CopperSurface MountClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
0UW-IM7H-BXU
0UW-IM7H-BXU
13+8.29714
Increments of 13
3131-SM-1TCCONN SOCKET SIP 10POS TINBulk700 Elevator Strip-Line™ActiveSIP10 1 x 10 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
30-1508-30
30-1508-30
11+10.1702
Increments of 11
Leadtime
2-3 weeks		J786-XUU-V3UCONN IC DIP SOCKET 30POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing30 2 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
17-0518-11H
17-0518-11H
29+3.90432
Increments of 29
Leadtime
2-3 weeks		S87D-E9O-53HCONN SOCKET SIP 17POS GOLDBulk518ActiveSIP17 1 x 17 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
42-3573-11
42-3573-11
4+22.6912
Increments of 4
Leadtime
2-3 weeks		U18-AZ-1QCONN IC DIP SOCKET ZIF 42POS GLDBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing42 2 x 21 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
10-2823-90T
10-2823-90T
17+6.49192
Increments of 17
88WE-MHPG-7QPCONN IC DIP SOCKET 10POS TINBulkVertisockets™ 800ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
612-83-640-41-001101
612-83-640-41-001101
170+3.12359
Increments of 170
Leadtime
2-3 weeks		S4Q-FRHK-69UCONN IC DIP SOCKET 40POS GOLDBulk612ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
3-1825046-0
3-1825046-0
375+10.1029
Increments of 375
Leadtime
2-3 weeks		H0-B4-Q9CONN IC DIP SOCKET 32POS GOLDTube800ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold-Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm --Brass--
510-83-096-14-091101
510-83-096-14-091101
90+6.30697
Increments of 90
Leadtime
2-3 weeks		Y2-OQ-TUCONN SOCKET PGA 96POS GOLDBulk510ActivePGA96 14 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
12-0518-10T
12-0518-10T
84+1.32353
Increments of 84
22VGXB-R5-NN0CONN SOCKET SIP 12POS GOLDBulk518ActiveSIP12 1 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
24-6508-312
24-6508-312
5+14.8392
Increments of 5
641641NF-TU-F5CONN IC DIP SOCKET 24POS GOLDBulk508ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
37-0501-21
37-0501-21
6+16.5163
Increments of 6
Leadtime
2-3 weeks		TTRV-GHB-YPPCONN SOCKET SIP 37POS GOLDBulk501ActiveSIP37 1 x 37 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C