ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
117-83-652-41-105101
117-83-652-41-105101
88+6.00278
Increments of 88
Leadtime
2-3 weeks		Q2-CL5-PVKCONN IC DIP SOCKET 52POS GOLDTube117ActiveDIP, 0.6 15.24mm Row Spacing52 2 x 26 0.070 1.78mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-87-636-41-011101
116-87-636-41-011101
132+4.097
Increments of 132
22PDQ-QOHO-77GCONN IC DIP SOCKET 36POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-83-324-41-105101
110-83-324-41-105101
238+2.22878
Increments of 238
Leadtime
2-3 weeks		JIG4-QBIJ-JRCONN IC DIP SOCKET 24POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
114-87-314-41-134191
114-87-314-41-134191
1000+0.646402
Increments of 1000
Leadtime
2-3 weeks		OZCYS-4PHO-KLKCONN IC DIP SOCKET 14POS GOLDTape & Reel TR 114ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
APA-314-G-Q
APA-314-G-Q
1+8.29412
Increments of 1
Leadtime
2-3 weeks		VJ8A8-T119-IXADAPTOR PLUG-*Active---------------
EZ801-9W-0K
EZ801-9W-0K
24+5.69404
Increments of 24
Leadtime
2-3 weeks		0TM6-JL64-P1YCONN IC DIP SOCKET 36POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing36 2 x 18 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
101-93-324-41-560000
101-93-324-41-560000
64+11.3483
128+7.54978
512+3.13235
Increments of 64
Leadtime
2-3 weeks		IS9E-IP-72CONN IC DIP SOCKET 24POS GOLDTube101ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
144-PRS12001-16
144-PRS12001-16
1+85.8137
Increments of 1
Leadtime
2-3 weeks		JX2-UK-FOCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Nickel Bronze50µin 1.27µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 200°C
30-0508-21
30-0508-21
6+15.7337
Increments of 6
44S-V4-G9JCONN SOCKET SIP 30POS GOLDBulk508ActiveSIP30 1 x 30 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
32-C300-20
32-C300-20
5+15.1176
Increments of 5
44A45-VH0A-OBCONN IC DIP SOCKET 32POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-83-624-41-006101
116-83-624-41-006101
272+1.83463
Increments of 272
Leadtime
2-3 weeks		MV-EQ-WI1CONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
18-8470-610C
18-8470-610C
10+9.3049
Increments of 10
Leadtime
2-3 weeks		EOE1-FGXS-VKCONN IC DIP SOCKET 18POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
32-3574-18
32-3574-18
10+87.0755
Increments of 10
Leadtime
2-3 weeks		UDISB-KAI2-SDCONN IC DIP SOCKET ZIF 32POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing32 2 x 16 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
02-1518-11
02-1518-11
295+0.333333
Increments of 295
Leadtime
2-3 weeks		L91G1-UYR-QB6CONN IC DIP SOCKET 2POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing2 1 x 2 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
9CV1 O4G Q3
9CV1 O4G Q3
139+0.794118
Increments of 139
77RYUG-0C-MBCONN SOCKET SIP 6POS GOLDBulk0513ActiveSIP6 1 x 6 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled
SIP050-1X21-160BLF
SIP050-1X21-160BLF
Leadtime
2-3 weeks		RCEYE-SJB1-9QYCONN SOCKET SIP 21POS GOLDBulkSIP050-1xObsoleteSIP21 1 x 21 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-
D01-9953242
D01-9953242
1+6.01961
10+5.77255
100+4.76863
500+4.01569
1000+3.51373
Increments of 1
Leadtime
2-3 weeks		O5EV-DZ-YW9CONN SOCKET SIP 32POS GOLDBulkD01-995ActiveSIP32 1 x 32 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Tin196.8µin 5.00µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Glass Filled-55°C ~ 125°C
07-0513-11H
07-0513-11H
60+1.85294
Increments of 60
Leadtime
2-3 weeks		C9-WQFP-T1CONN SOCKET SIP 7POS GOLDBulk0513ActiveSIP7 1 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
36-6553-18
36-6553-18
56+72.7376
Increments of 56
Leadtime
2-3 weeks		KXO-V5J7-KUCONN IC DIP SOCKET ZIF 40POS TINBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
18-8465-310C
18-8465-310C
10+9.12353
Increments of 10
Leadtime
2-3 weeks		PEB8V-R8-Y4CONN IC DIP SOCKET 18POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
48-6570-10
48-6570-10
7+15.0588
Increments of 7
Leadtime
2-3 weeks		BX1O-RD-KHFCONN IC DIP SOCKET ZIF 48POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
16-7500-10
16-7500-10
11+10.2736
Increments of 11
Leadtime
2-3 weeks		BX8W-LT0-XGCONN SOCKET SIP 16POS TINBulk700 Elevator Strip-Line™ActiveSIP16 1 x 16 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
08-3513-00
08-3513-00
90+1.89706
Increments of 90
Leadtime
2-3 weeks		K8-YI-GSCONN IC DIP SOCKET 8POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
48-6503-30
48-6503-30
7+13.5336
Increments of 7
Leadtime
2-3 weeks		CD-DD6-PSTCONN IC DIP SOCKET 48POS GOLDBulk503ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
22-4501-20
22-4501-20
18+6.12527
Increments of 18
Leadtime
2-3 weeks		V6-KFE-WP5CONN IC DIP SOCKET 22POS TINBulk501ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C