ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
48-6551-16
48-6551-16
54+47.4501
Increments of 54
88Y-28Q-YYPCONN IC DIP SOCKET ZIF 48POSBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
40-C212-00
40-C212-00
8+13.4314
Increments of 8
77HZ-VA3E-0X0CONN IC DIP SOCKET 40POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperSurface MountClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
21-0508-20
21-0508-20
15+7.50588
Increments of 15
9595RR9-BH82-WVCONN SOCKET SIP 21POS GOLDBulk508ActiveSIP21 1 x 21 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
09-7870-10
09-7870-10
13+8.00905
Increments of 13
Leadtime
2-3 weeks		0JK-ID-APICONN SOCKET SIP 9POS TINBulk700 Elevator Strip-Line™ActiveSIP9 1 x 9 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-87-306-41-002101
116-87-306-41-002101
994+0.449745
Increments of 994
Leadtime
2-3 weeks		AQ-PU2A-MMDCONN IC DIP SOCKET 6POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
122-13-314-41-001000
122-13-314-41-001000
56+11.7421
112+7.80865
280+4.42353
Increments of 56
Leadtime
2-3 weeks		TNSBN-JLX-56JCONN IC DIP SOCKET 14POS GOLDTube122ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
110-93-320-41-605000
110-93-320-41-605000
80+2.55294
160+2.1
320+1.75604
Increments of 80
88K-LCSO-60XCONN IC DIP SOCKET 20POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
I2-NHN-S6
I2-NHN-S6
Leadtime
2-3 weeks		ZI9-55-LECONN SOCKET SIP 11POS TINTubeDiplomate DLObsoleteSIP11 1 x 11 0.100 2.54mm Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
24-8312-310C
24-8312-310C
8+12.7647
Increments of 8
Leadtime
2-3 weeks		LAS-QUI-Q8XCONN IC DIP SOCKET 24POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
2-1571551-6
2-1571551-6
960+2.26671
Increments of 960
Leadtime
2-3 weeks		H0-L7MD-24ACONN IC DIP SOCKET 20POS GOLDTube500ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm GoldFlashCopper AlloyThrough HoleClosed FrameSolder0.100 2.54mm Gold-Copper AlloyPolyester-55°C ~ 125°C
31-0511-11
31-0511-11
5+14.9569
Increments of 5
Leadtime
2-3 weeks		WOY-SKU-LWCONN SOCKET SIP 31POS GOLDBulk511ActiveSIP31 1 x 31 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
22-0501-31
22-0501-31
8+12.451
Increments of 8
Leadtime
2-3 weeks		LEPIC-1EX-2ZCONN SOCKET SIP 22POS GOLDBulk501ActiveSIP22 1 x 22 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
2-1571551-4
2-1571551-4
1200+2.00346
Increments of 1200
89228922-VD-5WOCONN IC DIP SOCKET 16POS GOLDTube500ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm GoldFlashNickelPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
346-43-104-41-013000
346-43-104-41-013000
1+2.32353
10+2.08235
100+1.71471
500+1.35543
1000+1.16354
Increments of 1
Leadtime
2-3 weeks		EF-2TV-OQ4CONN SOCKET SIP 4POS GOLDBulk346ActiveSIP4 1 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
14-4820-90C
14-4820-90C
16+6.98836
Increments of 16
Leadtime
2-3 weeks		UCO0I-NPQX-XTHCONN IC DIP SOCKET 14POS GOLDBulkVertisockets™ 800ActiveDIP, 0.4 10.16mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
14-81010-310C
14-81010-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks		ME9N-VEYG-ETCONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
D01-9501042
D01-9501042
88VA-7V-6LYCONN SOCKET SIP 10POS GOLDBulkD01-950ObsoleteSIP10 1 x 10 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevatedSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Glass Filled-55°C ~ 125°C
228-1290-00-0602J
228-1290-00-0602J
1+19.9118
10+17.9775
25+17.2235
50+16.1471
100+15.6088
Increments of 1
44LQG-RFI-F67CONN IC DIP SOCKET ZIF 28POS GLDBulkTextool™ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing28 2 x 14 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperConnectorClosed FramePress-Fit0.100 2.54mm Gold30µin 0.76µm Beryllium CopperPolysulfone PSU , Glass Filled-55°C ~ 125°C
A48-LC-TR
A48-LC-TR
Leadtime
2-3 weeks		ZPE-2FO-GNCONN IC DIP SOCKET 48POS TINTube-ObsoleteDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin-Phosphor BronzePolybutylene Terephthalate PBT -55°C ~ 85°C
24-3571-16
24-3571-16
11+20.3993
Increments of 11
Leadtime
2-3 weeks		ZN-Y2O-2BLCONN IC DIP SOCKET ZIF 24POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
02-1508-20
02-1508-20
139+0.794118
Increments of 139
Leadtime
2-3 weeks		Z2Y-MY1D-1Z6CONN IC DIP SOCKET 2POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing2 1 x 2 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
06-0513-10
06-0513-10
139+0.794118
Increments of 139
Leadtime
2-3 weeks		DAYZM-AO53-B2CONN SOCKET SIP 6POS GOLDBulk0513ActiveSIP6 1 x 6 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
192-PRS17027-12
192-PRS17027-12
1+69.6863
Increments of 1
Leadtime
2-3 weeks		BQ-1MD1-HCCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
115-83-306-41-001101
115-83-306-41-001101
1380+0.302274
Increments of 1380
Leadtime
2-3 weeks		A2FS-8YWN-NPLCONN IC DIP SOCKET 6POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-87-040-11-061101
510-87-040-11-061101
323+1.50368
Increments of 323
Leadtime
2-3 weeks		E5-XW-ZLBCONN SOCKET PGA 40POS GOLDBulk510ActivePGA40 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C