ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
10-0501-21
10-0501-21
24+7.98816
Increments of 24
Leadtime
2-3 weeks
V7CMG-0UG-IBPCONN SOCKET SIP 10POS GOLDBulk501ActiveSIP10 1 x 10 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
4808-3000-CP
4808-3000-CP
1+0.470588
10+0.441176
25+0.397255
50+0.352941
100+0.338235
Increments of 1
Leadtime
2-3 weeks
Z6PZ-REJ-C55CONN IC DIP SOCKET 8POS TINTube4800ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Tin35µin 0.90µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin35µin 0.90µm Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
117-87-656-41-105101
117-87-656-41-105101
110+4.71257
Increments of 110
Leadtime
2-3 weeks
0MD-NOVT-YTNCONN IC DIP SOCKET 56POS GOLDTube117ActiveDIP, 0.6 15.24mm Row Spacing56 2 x 28 0.070 1.78mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
15-0518-10H
15-0518-10H
65+1.72067
Increments of 65
Leadtime
2-3 weeks
WX-GFQ-KQCONN SOCKET SIP 15POS GOLDBulk518ActiveSIP15 1 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
1051990001
1051990001
2100+0.758549
Increments of 2100
44O-I3-D2FCONN CAM SOCKET 34POS GOLDTape & Reel TR 105199ActiveCamera Socket34 2 x 8, 2 x 9 0.024 0.60mm Gold12µin 0.30µm Copper AlloySurface MountClosed FrameSolder0.024 0.60mm --Copper AlloyPlastic-30°C ~ 85°C
117-87-640-41-105101
117-87-640-41-105101
154+3.54342
Increments of 154
99OW3L-A1-V4CONN IC DIP SOCKET 40POS GOLDTube117ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.070 1.78mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
U4Z-4IKM-G95
U4Z-4IKM-G95
30+5.53824
Increments of 30
Leadtime
2-3 weeks
VZFMV-LJH-L5CONN SOCKET SIP 8POS TINBulk700 Elevator Strip-Line™ActiveSIP8 1 x 8 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
APA-320-T-N
APA-320-T-N
1+3.7549
Increments of 1
4949F6L-U8-6FDADAPTOR PLUG-*Active---------------
514-87-520M31-001148
514-87-520M31-001148
13+102.406
Increments of 13
Leadtime
2-3 weeks
W4YNY-3MT-KXTCONN SOCKET BGA 520POS GOLDBulk514ActiveBGA520 31 x 31 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
816-AG11D
816-AG11D
4800+2.31423
Increments of 4800
Leadtime
2-3 weeks
NOM-A8S-FLLCONN IC DIP SOCKET 16POS GOLDTube800ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm ---Polyester-55°C ~ 105°C
97-0JNZ-5I2
97-0JNZ-5I2
1+3.96078
10+3.79902
50+3.32451
100+3.16608
250+2.77035
Increments of 1
Leadtime
2-3 weeks
EO9K-47C7-I3CONN IC DIP SOCKET 8POS GOLDTube500ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleClosed FrameSolder0.100 2.54mm Gold25µin 0.63µm Copper Alloy--55°C ~ 125°C
210796-4
210796-4
140+12.5452
Increments of 140
88TX-AH-RVOPN FRM PGA 15 15, 144 SKT-*Active---------------
30-7440-10
30-7440-10
8+13.8431
Increments of 8
396396-Y6M0-ML0CONN SOCKET SIP 30POS TINBulk700 Elevator Strip-Line™ActiveSIP30 1 x 30 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
JL-ALJ-IMN
JL-ALJ-IMN
9+11.3725
Increments of 9
Leadtime
2-3 weeks
VHEF-SM7-VLCONN IC DIP SOCKET 14POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperSurface MountClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
D01-9972442
D01-9972442
2400+0.882549
Increments of 2400
Leadtime
2-3 weeks
QZRAP-CFRM-K4HCONN SOCKET SIP 24POS GOLDBulkD01-997ActiveSIP24 1 x 24 0.100 2.54mm GoldFlashBeryllium CopperThrough Hole-Solder0.100 2.54mm Tin196.8µin 5.00µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Glass Filled-55°C ~ 125°C
510-83-256-16-000101
510-83-256-16-000101
39+14.7162
Increments of 39
88JG-F7-MPCONN SOCKET PGA 256POS GOLDBulk510ActivePGA256 16 x 16 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-87-652-41-008101
116-87-652-41-008101
112+4.59016
Increments of 112
Leadtime
2-3 weeks
SA5T-YZR-UK6CONN IC DIP SOCKET 52POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing52 2 x 26 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
04-0501-21
04-0501-21
27+4.10313
Increments of 27
Leadtime
2-3 weeks
QY8IL-AX-P92CONN SOCKET SIP 4POS GOLDBulk501ActiveSIP4 1 x 4 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
5W22-ICP8-DP3
5W22-ICP8-DP3
72+6.80365
Increments of 72
702702VS-JM-32CONN SOCKET PGA 181POS GOLDBulk510ActivePGA181 17 x 17 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-306-41-018101
116-83-306-41-018101
994+0.443275
Increments of 994
Leadtime
2-3 weeks
GFA-1K0-17CONN IC DIP SOCKET 6POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
14-8390-310C
14-8390-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks
JE-NXB-NWRCONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
48-6570-10
48-6570-10
7+15.0588
Increments of 7
Leadtime
2-3 weeks
XE6-9P-4NUCONN IC DIP SOCKET ZIF 48POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
IVN-VP-WB
IVN-VP-WB
29+3.8384
Increments of 29
66PKYO-NY1-0SECONN SOCKET SIP 35POS GOLDBulk518ActiveSIP35 1 x 35 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
44-3574-11
44-3574-11
4+23.4559
Increments of 4
Leadtime
2-3 weeks
VYB-VK-4ICONN IC DIP SOCKET ZIF 44POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing44 2 x 22 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
24-823-90C
24-823-90C
11+9.77985
Increments of 11
Leadtime
2-3 weeks
GXB-T861-6TJCONN IC DIP SOCKET 24POS GOLDBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C