ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
241-16-1-03
241-16-1-03
3200+0.338235
Increments of 3200
Leadtime
2-3 weeks		C8M-54A-8HCONN IC DIP SOCKET 16POS TINTube-ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Tin60µin 1.52µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin60µin 1.52µm Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-40°C ~ 105°C
40-3503-21
40-3503-21
4+19.1912
Increments of 4
55I-SJ4-XSUCONN IC DIP SOCKET 40POS GOLDBulk503ActiveDIP, 0.3 7.62mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
510-83-108-12-051101
510-83-108-12-051101
85+6.74048
Increments of 85
77L-4MN-NE6CONN SOCKET PGA 108POS GOLDBulk510ActivePGA108 12 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
42-3575-16
42-3575-16
2+35.7941
Increments of 2
Leadtime
2-3 weeks		O1F-CAA-HN1CONN IC DIP SOCKET ZIF 42POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing42 2 x 21 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
528-AG12D-ES-LF
528-AG12D-ES-LF
1700+5.65377
Increments of 1700
Leadtime
2-3 weeks		RD-QC9-2N2CONN IC DIP SOCKET 28POS TINTube500ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-NickelPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 105°C
104-13-642-41-770000
104-13-642-41-770000
54+13.5358
108+10.9822
270+6.77662
Increments of 54
Leadtime
2-3 weeks		QK7C4-JKA-29PCONN IC DIP SOCKET 42POS GOLDTube104ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
20-1508-31
20-1508-31
8+12.4118
Increments of 8
Leadtime
2-3 weeks		YZOX-EDC2-2VBCONN IC DIP SOCKET 20POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
25-7700-10
25-7700-10
9+11.9608
Increments of 9
Leadtime
2-3 weeks		IF7H-DGY-ZIOCONN SOCKET SIP 25POS TINBulk700 Elevator Strip-Line™ActiveSIP25 1 x 25 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
18-8400-610C
18-8400-610C
1+10.0588
25+8.80157
100+7.79559
500+6.53824
1000+6.28676
Increments of 1
Leadtime
2-3 weeks		PPGNN-OUC-U9BCONN IC DIP SOCKET 18POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
24-3551-11
24-3551-11
50+11.8275
Increments of 50
8787YAF-KVK-B6CONN IC DIP SOCKET ZIF 24POS GLDBulk55ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold-Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
410-87-216-10-002101
410-87-216-10-002101
1300+0.487039
Increments of 1300
1717-61WH-A4KCONN ZIG-ZAG 16POS GOLDTube410ActiveZig-Zag, Right Stackable16 2 x 8 0.100 2.54mm GoldFlashBeryllium CopperThrough Hole-Solder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
PQ-4VK5-2SJ
PQ-4VK5-2SJ
6+38.7059
Increments of 6
Leadtime
2-3 weeks		F2V-KKE-GYYCONN IC DIP SOCKET ZIF 48POS GLDBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
K55R7-581L-1W
K55R7-581L-1W
56+72.7376
Increments of 56
66CRDM-O4L1-0KCONN IC DIP SOCKET ZIF 36POSBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyetheretherketone PEEK , Glass Filled-55°C ~ 250°C
546-87-224-18-091135
546-87-224-18-091135
22+20.3636
Increments of 22
Leadtime
2-3 weeks		OYZW-DO3-L5CONN SOCKET PGA 224POS GOLDBulk546ActivePGA224 18 x 18 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BronzePolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-3518-10M
24-3518-10M
32+5.02941
Increments of 32
Leadtime
2-3 weeks		SCZ-J77-L1CONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
110-87-642-41-105161
110-87-642-41-105161
171+2.97483
Increments of 171
Leadtime
2-3 weeks		LK-X8-2ACONN IC DIP SOCKET 42POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
35-0501-21
35-0501-21
6+15.634
Increments of 6
44Y-8KE-IUWCONN SOCKET SIP 35POS GOLDBulk501ActiveSIP35 1 x 35 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
32-3574-10
32-3574-10
10+13.2588
Increments of 10
Leadtime
2-3 weeks		Q2-V87-XFTCONN IC DIP SOCKET ZIF 32POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing32 2 x 16 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
23-0501-31
23-0501-31
8+12.9412
Increments of 8
Leadtime
2-3 weeks		KYF5J-N6CN-44CONN SOCKET SIP 23POS GOLDBulk501ActiveSIP23 1 x 23 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
110-87-210-01-839101
110-87-210-01-839101
943+0.480912
Increments of 943
Leadtime
2-3 weeks		NQ9A-N5-5MCONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 , 8 Loaded0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
115-43-640-41-003000
115-43-640-41-003000
1+4.56863
10+3.77843
50+3.14902
100+2.83412
250+2.61369
Increments of 1
Leadtime
2-3 weeks		L1XR-6MY-57CONN IC DIP SOCKET 40POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
24-3553-18
24-3553-18
50+56.8
Increments of 50
Leadtime
2-3 weeks		HH-GBG-LBJCONN IC DIP SOCKET ZIF 24POSBulk55ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyetheretherketone PEEK , Glass Filled-55°C ~ 250°C
122-13-314-41-001000
122-13-314-41-001000
56+11.7421
112+7.80865
280+4.42353
Increments of 56
Leadtime
2-3 weeks		I5H8F-KJN-EUCONN IC DIP SOCKET 14POS GOLDTube122ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
116-83-322-41-018101
116-83-322-41-018101
285+1.76453
Increments of 285
4040UZ1-HB-F8CONN IC DIP SOCKET 22POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
S6JD-KE-80
S6JD-KE-80
1+8.0098
10+7.44118
100+6.48735
500+5.9149
1000+5.4379
Increments of 1
55T-7U4N-YTCONN SOCKET SIP 34POS GOLDBulk714ActiveSIP34 1 x 34 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C