ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
116-87-324-41-008101
116-87-324-41-008101
238+2.1186
Increments of 238
743743KU-42LK-B9PCONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
36-3575-18
36-3575-18
1+95.5294
Increments of 1
55NC-MA-YUSCONN IC DIP SOCKET ZIF 36POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing36 2 x 18 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
AR-28-HZL 07-TT
AR-28-HZL 07-TT
1+4.58823
10+4.40686
25+4.04
50+3.85627
100+3.67255
Increments of 1
88UGI-O6KW-FNCONN IC DIP SOCKET 28POS GOLDTube-ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
AR 18 HZL-TT
AR 18 HZL-TT
1+0.970588
10+0.857843
25+0.807059
50+0.773529
100+0.739804
Increments of 1
Leadtime
2-3 weeks		BJ2Y-B7-QOCONN IC DIP SOCKET 18POS TINTube-ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
16-8510-310C
16-8510-310C
12+9.12091
Increments of 12
88NU93-Q6P1-2YXCONN IC DIP SOCKET 16POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
38-1518-10T
38-1518-10T
30+3.79412
Increments of 30
Leadtime
2-3 weeks		S083-I5G-XACONN IC DIP SOCKET 38POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing38 2 x 19 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
G8-516-U7R
G8-516-U7R
1+1.67647
10+1.52451
100+1.30706
500+1.0892
1000+0.933608
Increments of 1
33U0T-YYJ-MGCONN IC DIP SOCKET 16POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
104-13-420-41-780000
104-13-420-41-780000
60+11.8985
120+7.85032
300+4.65147
Increments of 60
22N-TOAC-1F1CONN IC DIP SOCKET 20POS GOLDTube104ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
08-8900-310C
08-8900-310C
20+5.54314
Increments of 20
6868EN-A7SL-6ACONN IC DIP SOCKET 8POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
12-6513-10T
12-6513-10T
53+2.09564
Increments of 53
Leadtime
2-3 weeks		S1HJA-32HN-RQHCONN IC DIP SOCKET 12POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.6 15.24mm Row Spacing12 2 x 6 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
A24-LC-7R
A24-LC-7R
Leadtime
2-3 weeks		QVIV-5D-RVDCONN IC DIP SOCKET 24POS TIN--ObsoleteDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Tin--Through HoleOpen Frame-------
614-87-964-41-001101
614-87-964-41-001101
144+3.51783
Increments of 144
Leadtime
2-3 weeks		QLSA-OX-PPCONN IC DIP SOCKET 64POS GOLDBulk614ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
M70HP-K6G-YR
M70HP-K6G-YR
150+3.37699
Increments of 150
Leadtime
2-3 weeks		ENI-1WNP-00JCONN IC DIP SOCKET 40POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
JGE-F8P-52E
JGE-F8P-52E
1+3.10784
10+2.58333
50+2.15294
100+1.91373
250+1.67451
Increments of 1
22S5-7Z-FLCONN IC DIP SOCKET 24POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
614-87-314-41-001101
614-87-314-41-001101
667+0.692657
Increments of 667
Leadtime
2-3 weeks		UMKS-H22-HVNCONN IC DIP SOCKET 14POS GOLDBulk614ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
126-93-210-41-003000
126-93-210-41-003000
80+12.6662
160+8.42775
320+5.01528
Increments of 80
Leadtime
2-3 weeks		LCY-20-DZCONN IC DIP SOCKET 10POS GOLDTube126ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
122-87-310-41-001101
122-87-310-41-001101
672+0.700206
Increments of 672
Leadtime
2-3 weeks		U6-SZ-V5CONN IC DIP SOCKET 10POS GOLDTube122ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
35-0518-10T
35-0518-10T
32+3.50735
Increments of 32
Leadtime
2-3 weeks		CGMU-VX0K-FUCONN SOCKET SIP 35POS GOLDBulk518ActiveSIP35 1 x 35 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
10-2503-21
10-2503-21
15+7.32941
Increments of 15
Leadtime
2-3 weeks		U945V-9PFO-BCCONN IC DIP SOCKET 10POS GOLDBulk503ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
528-AG11D
528-AG11D
1700+4.94411
Increments of 1700
Leadtime
2-3 weeks		IH93B-6702-B2CONN IC DIP SOCKET 28POS GOLDTube500ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleClosed FrameSolder0.100 2.54mm Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
APA-320-T-B
APA-320-T-B
1+4.39216
Increments of 1
Leadtime
2-3 weeks		NM5-PFMW-E15ADAPTOR PLUG-*Active---------------
299-83-308-11-001101
299-83-308-11-001101
318+1.58916
Increments of 318
Leadtime
2-3 weeks		H4UJV-21-J76CONN IC DIP SOCKET 8POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
XR2A-1611-N
XR2A-1611-N
1+2.13725
10+1.9402
25+1.82157
50+1.74216
100+1.66304
Increments of 1
99R-GI-DBJCONN IC DIP SOCKET 16POS GOLDBulkXR2ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolybutylene Terephthalate PBT , Glass Filled-55°C ~ 125°C
18-6810-90
18-6810-90
9+11.7059
Increments of 9
Leadtime
2-3 weeks		I6M-HHV6-BSCONN IC DIP SOCKET 18POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
DILB40P-223TLF
DILB40P-223TLF
1+0.568627
10+0.529412
25+0.476471
50+0.423529
100+0.405882
Increments of 1
Leadtime
2-3 weeks		S1G6J-3S-H5CONN IC DIP SOCKET 40POS TINTube-ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Tin100µin 2.54µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm Tin100µin 2.54µm Copper AlloyPolyamide PA , Nylon-55°C ~ 105°C