ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
116-87-624-41-012101
116-87-624-41-012101
289+1.72576
Increments of 289
Leadtime
2-3 weeks		NN54O-LV3-3E1CONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
540-99-084-24-000000
540-99-084-24-000000
Leadtime
2-3 weeks		FCE-FE-K4CONN SOCKET PLCC 84POS TIN-LEADTube540ObsoletePLCC84 4 x 21 0.050 1.27mm Tin-Lead200µin 5.08µm -Through HoleClosed FrameSolder0.050 1.27mm Tin-Lead200µin 5.08µm -Polyphenylene Sulfide PPS -
550-10-478M26-131152
550-10-478M26-131152
14+134.65
Increments of 14
Leadtime
2-3 weeks		C8-EP-0KXBGA SOLDER TAILBulk550ActiveBGA478 26 x 26 0.050 1.27mm Gold10µin 0.25µm BrassThrough HoleOpen FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
8059-2G6
8059-2G6
44KB-2DI-J8CONN TRANSIST-*Obsolete---------------
32-6575-11
32-6575-11
8+17.75
Increments of 8
Leadtime
2-3 weeks		UF-S4-85OCONN IC DIP SOCKET ZIF 32POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
225-PGM15001-10
225-PGM15001-10
6+15.5833
Increments of 6
Leadtime
2-3 weeks		PZ-Z22I-VU5CONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
10-81250-310C
10-81250-310C
17+6.57843
Increments of 17
22P8-VWCH-36CONN IC DIP SOCKET 10POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
D0806-01
D0806-01
Leadtime
2-3 weeks		KTBI-ZB-YNZCONN IC DIP SOCKET 6POS GOLDBulkD0ObsoleteDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin196.8µin 5.00µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Glass Filled-55°C ~ 125°C
U9 WJ7L 8T
U9 WJ7L 8T
Leadtime
2 3 weeks		DL6Q-4MTN-29CONN IC DIP SOCKET 24POS GOLDTubeDiplomate DLObsoleteDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThermoplastic 55°C ~ 125°C
346-43-132-41-013000
346-43-132-41-013000
1+6.27451
10+5.61667
100+4.62529
500+3.65618
1000+3.13859
Increments of 1
Leadtime
2-3 weeks		NSL-C4GE-TW6CONN SOCKET SIP 32POS GOLDBulk346ActiveSIP32 1 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
212-1-06-003
212-1-06-003
8000+0.164706
Increments of 8000
Leadtime
2-3 weeks		KN-K0-LSYCONN IC DIP SOCKET 6POS GOLDTube-ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold-Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolybutylene Terephthalate PBT -40°C ~ 105°C
APA-314-G-J
APA-314-G-J
1+3.08824
Increments of 1
Leadtime
2-3 weeks		DIFV-FHC-XVADAPTOR PLUG-*Active---------------
15-0518-10H
15-0518-10H
65+1.72067
Increments of 65
11IF-VT6A-IH2CONN SOCKET SIP 15POS GOLDBulk518ActiveSIP15 1 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
124-93-628-41-002000
124-93-628-41-002000
56+13.6231
112+10.5233
280+6.76239
Increments of 56
11LVNG-2NR-ZMCONN IC DIP SOCKET 28POS GOLDTube124ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
69802-120LF
69802-120LF
Leadtime
2-3 weeks		0FR-8G5-HSHCONN SOCKET PLCC 20POS TINTube-ObsoletePLCC20 4 x 5 0.050 1.27mm Tin150µin 3.81µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm Phosphor BronzePolyphenylene Sulfide PPS -55°C ~ 125°C
124-93-964-41-002000
124-93-964-41-002000
54+19.8132
108+14.184
270+11.1749
Increments of 54
892892-U81-6UCCONN IC DIP SOCKET 64POS GOLDTube124ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
22-3513-11
22-3513-11
30+4.85294
Increments of 30
Leadtime
2-3 weeks		QO1O-H84-MUNCONN IC DIP SOCKET 22POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
917-87-103-41-053101
917-87-103-41-053101
2400+0.287549
Increments of 2400
22XTG-F3-4RCONN TRANSIST TO-5 3POS GOLDBulk917ActiveTransistor, TO-53 Round -GoldFlashBeryllium CopperThrough Hole-Solder-Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
Z04TB-XB7J-02
Z04TB-XB7J-02
8+12.5098
Increments of 8
Leadtime
2-3 weeks		GEQ-RCLN-M6CONN IC DIP SOCKET 24POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
110-93-964-41-001000
110-93-964-41-001000
1+5.82353
10+4.81863
50+4.01569
100+3.61412
250+3.33302
Increments of 1
Leadtime
2-3 weeks		OP-NWA-XHICONN IC DIP SOCKET 64POS GOLDTube110ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
NY7K-QDCK-JV
NY7K-QDCK-JV
34+3.68397
Increments of 34
Leadtime
2-3 weeks		VS1IJ-R6E-LMCONN IC DIP SOCKET 28POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
116-83-312-41-011101
116-83-312-41-011101
315+1.58497
Increments of 315
77K-YV0-CMCONN IC DIP SOCKET 12POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
29-0518-00
29-0518-00
20+5.5
Increments of 20
Leadtime
2-3 weeks		YIG9-337Z-YACONN SOCKET SIP 29POS GOLDBulk518ActiveSIP29 1 x 29 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
40-1518-11
40-1518-11
21+5.6704
Increments of 21
Leadtime
2-3 weeks		BPAGC-J75-QF0CONN IC DIP SOCKET 40POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
14-3513-11
14-3513-11
50+2.35294
Increments of 50
Leadtime
2-3 weeks		0BMUC-5RAT-AJCONN IC DIP SOCKET 14POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-