ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
510-83-085-11-044101
510-83-085-11-044101
95+5.58421
Increments of 95
Leadtime
2-3 weeks		XQE-5P-PYCONN SOCKET PGA 85POS GOLDBulk510ActivePGA85 11 x 11 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
L2-27C3-Y1
L2-27C3-Y1
5+16.7059
Increments of 5
9090-BGY6-KTCONN IC DIP SOCKET 24POS GOLDBulk508ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
116-87-314-41-001101
116-87-314-41-001101
360+1.3659
Increments of 360
3535-JI-HK0CONN IC DIP SOCKET 14POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
820-AG10D-ES
820-AG10D-ES
960+5.17878
Increments of 960
Leadtime
2-3 weeks		XLNVD-53DA-K0CONN IC DIP SOCKET 20POS GOLDTube800ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm ---Polyester-55°C ~ 105°C
ED14DT
ED14DT
1+0.176471
10+0.169608
50+0.126275
100+0.117255
250+0.103725
Increments of 1
Leadtime
2-3 weeks		GDRY3-NN1-375CONN IC DIP SOCKET 14POS TINTubeEDActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin60µin 1.52µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin60µin 1.52µm Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 110°C
08-8415-610C
08-8415-610C
20+5.54314
Increments of 20
Leadtime
2-3 weeks		OG6-7Y-IVCONN IC DIP SOCKET 8POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
115-93-624-41-003000
115-93-624-41-003000
1+2.91176
10+2.41961
50+2.01627
100+1.79216
250+1.56816
Increments of 1
Leadtime
2-3 weeks		I2E6-RRH-XS0CONN IC DIP SOCKET 24POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
40-C182-30
40-C182-30
5+17.9118
Increments of 5
Leadtime
2-3 weeks		BW-XHZ-PQOCONN IC DIP SOCKET 40POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperSurface MountClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
18-3518-11
18-3518-11
44+2.80147
Increments of 44
236236A-CW7-DQTCONN IC DIP SOCKET 18POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
9-1437520-0
9-1437520-0
504+25.5895
Increments of 504
Leadtime
2-3 weeks		KCK8-7USC-NECSTAMPED PIN-*Active---------------
116-83-210-41-008101
116-83-210-41-008101
462+1.06152
Increments of 462
Leadtime
2-3 weeks		MQ-GKX-K4LCONN IC DIP SOCKET 10POS GOLDTube116ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-87-324-41-008101
116-87-324-41-008101
238+2.1186
Increments of 238
77Z-2IYN-J9DCONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
34-7XXXX-10
34-7XXXX-10
8+12.6275
Increments of 8
Leadtime
2-3 weeks		W2-RYN-LNCONN SOCKET SIP 34POS TINBulk700 Elevator Strip-Line™ActiveSIP34 1 x 34 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
28-8500-610C
28-8500-610C
7+14.4902
Increments of 7
Leadtime
2-3 weeks		LOMD-DUU-91CONN IC DIP SOCKET 28POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
3-822516-4
3-822516-4
77NNZN-CSU-4M7CONN SOCKET PLCC 52POS TINTape & Reel TR -ObsoletePLCC52 4 x 13 0.050 1.27mm Tin100µin 2.54µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin100µin 2.54µm Phosphor BronzeThermoplastic-
550-10-400M20-000166
550-10-400M20-000166
18+78.4989
Increments of 18
Leadtime
2-3 weeks		GH1E-TN-AUBGA PIN ADAPTER 1.27MM SMDBulk550ActiveBGA400 20 x 20 0.050 1.27mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
44-PRS12017-12
44-PRS12017-12
2+48.7794
Increments of 2
Leadtime
2-3 weeks		BR-HZH-RNCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
SA649000
SA649000
1+2.51961
10+2.41667
50+2.11451
100+2.01373
250+1.762
Increments of 1
Leadtime
2-3 weeks		UV-RT1Y-60CONN IC DIP SOCKET 64POS GOLDTubeSAActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassThermoplastic, Polyester, Glass Filled-40°C ~ 105°C
116-83-420-41-004101
116-83-420-41-004101
168+3.13702
Increments of 168
Leadtime
2-3 weeks		JS6PO-0YOT-UHCONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-93-650-41-105000
110-93-650-41-105000
64+13.5789
128+9.45044
256+5.9663
Increments of 64
Leadtime
2-3 weeks		Y87I6-U6-H78CONN IC DIP SOCKET 50POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
104-13-650-41-770000
104-13-650-41-770000
56+14.6012
112+10.3765
280+7.20795
Increments of 56
Leadtime
2-3 weeks		0UKA-OZ-EKCONN IC DIP SOCKET 50POS GOLDTube104ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
117-43-448-41-005000
117-43-448-41-005000
1+6.85294
10+5.7951
50+5.00529
100+4.47833
250+3.95149
Increments of 1
Leadtime
2-3 weeks		M1-DDLB-VOCONN IC DIP SOCKET 48POS GOLDTube117ActiveDIP, 0.4 10.16mm Row Spacing48 2 x 24 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
2-382189-2
2-382189-2
Leadtime
2-3 weeks		QLVJN-KX-B1CONN IC DIP SOCKET 32POS GOLDTubeDiplomate DLObsoleteDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead-Beryllium CopperThermoplastic-
122-83-628-41-001101
122-83-628-41-001101
195+2.76119
Increments of 195
Leadtime
2-3 weeks		YSACD-711-5PCONN IC DIP SOCKET 28POS GOLDTube122ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-83-180-15-002101
510-83-180-15-002101
56+10.6429
Increments of 56
Leadtime
2-3 weeks		TQ3-B1-QCCONN SOCKET PGA 180POS GOLDBulk510ActivePGA180 15 x 15 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C