ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
550-10-192M16-001152
550-10-192M16-001152
22+54.0856
Increments of 22
44NCX-FFR-ZYIBGA SOLDER TAILBulk550ActiveBGA192 16 x 16 0.050 1.27mm Gold10µin 0.25µm BrassThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
110-43-640-41-801000
110-43-640-41-801000
1+8.07843
10+7.37843
50+6.32471
100+5.62196
250+5.0949
Increments of 1
Leadtime
2-3 weeks		W2Q-XT-7OYCONN IC DIP SOCKET 40POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
32-1508-30
32-1508-30
10+9.5402
Increments of 10
Leadtime
2-3 weeks		K7P-5C-S5RCONN IC DIP SOCKET 32POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing32 2 x 16 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
N5-OZ2-E0
N5-OZ2-E0
18+6.08224
Increments of 18
Leadtime
2-3 weeks		0UYG-OPU-4H6CONN SOCKET SIP 32POS GOLDBulk518ActiveSIP32 1 x 32 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
346-43-164-41-013000
346-43-164-41-013000
1+10.049
10+8.9902
100+7.40353
500+5.85231
1000+5.02382
Increments of 1
Leadtime
2-3 weeks		MHNS5-RAF-W4CONN SOCKET SIP 64POS GOLDBulk346ActiveSIP64 1 x 64 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
ET-83ZR-5P
ET-83ZR-5P
8+30
Increments of 8
Leadtime
2-3 weeks		0EAD-603-CLCONN IC DIP SOCKET ZIF 32POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
13-0518-11
13-0518-11
61+1.83092
Increments of 61
77XNLN-DQ-8LCONN SOCKET SIP 13POS GOLDBulk518ActiveSIP13 1 x 13 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
1-1437536-3
1-1437536-3
Leadtime
2-3 weeks		FV3JX-VP-MUCONN IC DIP SOCKET 18POS GOLD-500ObsoleteDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold--Through HoleClosed Frame-0.100 2.54mm -----
A-CCS68-G
A-CCS68-G
1+2.90196
10+2.78824
25+2.55608
50+2.4398
100+2.32353
Increments of 1
Leadtime
2-3 weeks		MR41-UF3T-59UCONN SOCKET PLCC 68POS GOLDTube-ObsoletePLCC68 4 x 17 0.050 1.27mm Gold-Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Gold-Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
614-43-314-31-012000
614-43-314-31-012000
1+2.93137
10+2.42353
50+2.01961
100+1.81765
250+1.67627
Increments of 1
88C-VR5U-4NFCONN IC DIP SOCKET 14POS GOLDTube614ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
117-43-652-41-005000
117-43-652-41-005000
1+7.39216
10+6.25686
50+5.40392
100+4.835
250+4.2662
Increments of 1
33E-R7-75CONN IC DIP SOCKET 52POS GOLDTube117ActiveDIP, 0.6 15.24mm Row Spacing52 2 x 26 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
121-PLS13121-12
121-PLS13121-12
2+58.5686
Increments of 2
Leadtime
2-3 weeks		YTWMZ-DE3-E9ZCONN SOCKET PGA ZIF GOLDBulkPLSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
1814640-8
1814640-8
1560+2.16022
Increments of 1560
Leadtime
2-3 weeks		SFXZ1-RO-CYCONN IC DIP SOCKET 8POS TINTape & Reel TR -ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassThermoplastic, Polyester-55°C ~ 125°C
225-PGM15001-11
225-PGM15001-11
3+31.634
Increments of 3
Leadtime
2-3 weeks		QD1-9Q-F4PCONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
A2FY-9V1-SV9
A2FY-9V1-SV9
19+81.048
Increments of 19
Leadtime
2-3 weeks		LA-LU4-6FRPGA SOLDER TAIL 1.27MMBulk558ActivePGA272 20 x 20 0.050 1.27mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
126-93-628-41-003000
126-93-628-41-003000
56+14.1353
112+11.0597
280+6.71957
Increments of 56
88DVC-Q68K-ROCONN IC DIP SOCKET 28POS GOLDTube126ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
115-87-636-41-001101
115-87-636-41-001101
341+1.39897
Increments of 341
33BC3-AM-FUQCONN IC DIP SOCKET 36POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-8312-310C
24-8312-310C
8+12.7647
Increments of 8
Leadtime
2-3 weeks		TIU6K-VT-71KCONN IC DIP SOCKET 24POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
T98-IFU-IF
T98-IFU-IF
15+7.32941
Increments of 15
Leadtime
2 3 weeks		B595-CN-6BCONN IC DIP SOCKET 10POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6
514-AG11D-ES
514-AG11D-ES
5440+0.921873
Increments of 5440
Leadtime
2-3 weeks		XJ-QL-YYCONN IC DIP SOCKET 14POS GOLDTube500ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleClosed FrameSolder0.100 2.54mm Gold-Copper AlloyPolyester-55°C ~ 125°C
116-87-324-41-003101
116-87-324-41-003101
323+1.51487
Increments of 323
Leadtime
2-3 weeks		TNON8-B29Q-IACONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
8444-21B1-RK-TR
8444-21B1-RK-TR
360+1.3598
720+1.25245
1080+1.07353
1800+1.03775
2520+1.00196
Increments of 360
Leadtime
2-3 weeks		CJ-7PS-4ICONN SOCKET PLCC 44POS TINTape & Reel TR 8400ActivePLCC44 4 x 11 0.050 1.27mm Tin160µin 4.06µm Copper AlloySurface MountClosed FrameSolder0.050 1.27mm Tin160µin 4.06µm Copper AlloyPolybutylene Terephthalate PBT , Glass Filled-40°C ~ 105°C
116-87-652-41-002101
116-87-652-41-002101
120+4.45539
Increments of 120
Leadtime
2-3 weeks		F90-XF0-T2YCONN IC DIP SOCKET 52POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing52 2 x 26 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-6518-00
24-6518-00
38+2.97807
Increments of 38
Leadtime
2-3 weeks		PSP-RU-BOTCONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
16-3503-31
16-3503-31
10+9.50392
Increments of 10
Leadtime
2-3 weeks		S3E-K7-6FYCONN IC DIP SOCKET 16POS GOLDBulk503ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C