ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
2-1437532-2
2-1437532-2
Leadtime
2-3 weeks
V04PQ-102U-XBVCONN IC DIP SOCKET 24POS-500ObsoleteDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm ---Through HoleClosed Frame-------
116-87-632-41-007101
116-87-632-41-007101
364+2.28515
Increments of 364
606P8-UD-8UCONN IC DIP SOCKET 32POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
36-3574-10
36-3574-10
7+13.7171
Increments of 7
55TNV-YAF-RVCONN IC DIP SOCKET ZIF 36POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing36 2 x 18 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
110-87-304-41-105101
110-87-304-41-105101
1995+0.21151
Increments of 1995
6767YCG-OFBT-SACONN IC DIP SOCKET 4POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
42-3575-18
42-3575-18
1+112.549
Increments of 1
Leadtime
2-3 weeks
EXF-GBH-1YCONN IC DIP SOCKET ZIF 42POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing42 2 x 21 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
28-3570-11
28-3570-11
10+15.3392
Increments of 10
22H-3BI-RNCONN IC DIP SOCKET ZIF 28POS GLDBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
822516-1
822516-1
Leadtime
2-3 weeks
N59-80-BYKCONN SOCKET PLCC 44POS TINTube-ObsoletePLCC44 4 x 11 0.050 1.27mm Tin100µin 2.54µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin100µin 2.54µm Phosphor BronzeThermoplastic-
2-1437535-9
2-1437535-9
5760+2.47484
Increments of 5760
Leadtime
2-3 weeks
N0-2I-2TP510-AG91D-10=INLINE SOCKET-*Active---------------
115-93-648-41-003000
115-93-648-41-003000
264+3.084
Increments of 264
44ORT3-B2U2-F6CONN IC DIP SOCKET 48POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
44-PRS12017-12
44-PRS12017-12
2+48.7794
Increments of 2
Leadtime
2-3 weeks
E9RZA-EUFS-42CONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
245-14-1-03
245-14-1-03
1+0.294118
10+0.27451
25+0.235294
50+0.2
100+0.192157
Increments of 1
Leadtime
2-3 weeks
IY-P1K4-95CONN IC DIP SOCKET 14POS TINTube-ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin60µin 1.52µm Phosphor BronzeThrough Hole, Kinked PinOpen FrameSolder0.100 2.54mm Tin60µin 1.52µm Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-40°C ~ 105°C
32-3571-16
32-3571-16
8+29.7206
Increments of 8
Leadtime
2-3 weeks
LDJO-D1-1PDCONN IC DIP SOCKET ZIF 32POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing32 2 x 16 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
115-87-304-41-001101
115-87-304-41-001101
3150+0.130882
Increments of 3150
66N1-75TL-2FCONN IC DIP SOCKET 4POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
28-8700-610C
28-8700-610C
7+14.4902
Increments of 7
Leadtime
2-3 weeks
CEMOQ-TK-72MCONN IC DIP SOCKET 28POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
AR 24 HZL 01 7-TT
AR 24 HZL 01 7-TT
1+2.39216
10+2.16667
25+2.03412
50+1.94549
100+1.85706
Increments of 1
Leadtime
2-3 weeks
I42F-9UHK-Z3VCONN IC DIP SOCKET 24POS GOLDTube-ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
614-83-432-41-001101
614-83-432-41-001101
216+2.4356
Increments of 216
Leadtime
2-3 weeks
UO-HT8-2MCONN IC DIP SOCKET 32POS GOLDBulk614ActiveDIP, 0.4 10.16mm Row Spacing32 2 x 16 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-87-177-15-061101
510-87-177-15-061101
84+6.65325
Increments of 84
55HI-U0IS-CHCONN SOCKET PGA 177POS GOLDBulk510ActivePGA177 15 x 15 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
69802-032LF
69802-032LF
7280+0.583471
Increments of 7280
Leadtime
2-3 weeks
FI-GFW-7EKCONN SOCKET PLCC 32POS TINTube-ActivePLCC32 2 x 7, 2 x 9 0.050 1.27mm Tin150µin 3.81µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm Phosphor BronzePolyphenylene Sulfide PPS -55°C ~ 125°C
ED028PLCZ
ED028PLCZ
128+0.578049
Increments of 128
Leadtime
2-3 weeks
LY3TO-I89M-UMCONN PLCC SOCKET 28POS T H-*Active---------------
15-PRS15068-12
15-PRS15068-12
2+45.6078
Increments of 2
9292WFD-IP6P-7SCCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
4BY3Z-1C6-WGZ
4BY3Z-1C6-WGZ
22+5.57665
Increments of 22
Leadtime
2-3 weeks
LB8QP-IF5X-14KCONN IC DIP SOCKET 50POS GOLDBulk518ActiveDIP, 0.9 22.86mm Row Spacing50 2 x 25 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
06-810-90C
06-810-90C
19+5.95305
Increments of 19
Leadtime
2-3 weeks
BE-81-FKCONN IC DIP SOCKET 6POS GOLDBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
U3-GG-8S
U3-GG-8S
220+2.48039
Increments of 220
Leadtime
2-3 weeks
V7-V5H2-CUCONN IC DIP SOCKET 28POS GOLDTube117ActiveDIP, 0.4 10.16mm Row Spacing28 2 x 14 0.070 1.78mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
17-0517-90C
17-0517-90C
20+5.65098
Increments of 20
Leadtime
2-3 weeks
P7QE-DH-QFECONN SOCKET SIP 17POS GOLDBulk0517ActiveSIP17 1 x 17 -Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle-Solder-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
163-PGM15067-10T
163-PGM15067-10T
2+45.951
Increments of 2
33V-UZK6-MV8CONN SOCKET PGA TINBulkPGMActivePGA-0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C