ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
299-93-312-11-001000
299-93-312-11-001000
1+5.08824
10+4.20686
50+3.50588
100+3.15529
250+2.90988
Increments of 1
Leadtime
2-3 weeks		T5-9T-1KCONN IC DIP SOCKET 12POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
100-042-000
100-042-000
Leadtime
2-3 weeks		IEN-BECR-YMCCONN IC DIP SOCKET 42POS GOLDBulk100ObsoleteDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Gold8µin 0.20µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm GoldFlashBrassPolyphenylene Sulfide PPS , Glass Filled-65°C ~ 125°C
614-83-149-15-063112
614-83-149-15-063112
28+16.695
Increments of 28
Leadtime
2-3 weeks		SQ9HQ-KX-N1CONN SOCKET PGA 149POS GOLDBulk614ActivePGA149 15 x 15 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
114-87-316-41-117101
114-87-316-41-117101
725+0.635226
Increments of 725
Leadtime
2-3 weeks		RNFJL-E47S-FOCONN IC DIP SOCKET 16POS GOLDTube114ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
917-93-208-41-005000
917-93-208-41-005000
1+2.03922
10+1.69706
25+1.57098
50+1.41392
100+1.25686
Increments of 1
Leadtime
2-3 weeks		E3-ZV-86CONN SOCKET TRANSIST TO-100 8POSTube917ActiveTransistor, TO-1008 Round -Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder-Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
124-83-310-41-002101
124-83-310-41-002101
378+1.29448
Increments of 378
Leadtime
2-3 weeks		E79-PD30-ZT4CONN IC DIP SOCKET 10POS GOLDTube124ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
40-8625-610C
40-8625-610C
5+15.9118
Increments of 5
Leadtime
2-3 weeks		AK-IIR-FUHCONN IC DIP SOCKET 40POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
07-0503-20
07-0503-20
35+3.24258
Increments of 35
Leadtime
2-3 weeks		XJE-KY-LT0CONN SOCKET SIP 7POS GOLDBulk0503ActiveSIP7 1 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA , Nylon, Glass Filled-
20-3518-10M
20-3518-10M
38+4.12513
Increments of 38
Leadtime
2-3 weeks		X4J-JOWH-67JCONN IC DIP SOCKET 20POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
RU77-EWE-3K
RU77-EWE-3K
11+166.447
Increments of 11
Leadtime
2-3 weeks		O1UD-GAC-X8BGA SOLDER TAILBulk550ActiveBGA652 35 x 35 0.050 1.27mm Gold10µin 0.25µm BrassThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
116-83-316-41-007101
116-83-316-41-007101
312+1.59012
Increments of 312
Leadtime
2-3 weeks		OZ-R1-A2CONN IC DIP SOCKET 16POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
410-87-220-10-001101
410-87-220-10-001101
900+0.665873
Increments of 900
Leadtime
2-3 weeks		RNU8Z-5YG5-YVCONN ZIG-ZAG 20POS GOLDTube410ActiveZig-Zag, Left Stackable20 2 x 10 0.100 2.54mm GoldFlashBeryllium CopperThrough Hole-Solder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
46MR-0I8-SON
46MR-0I8-SON
6+16.433
Increments of 6
3131WI1-EZA-KMWCONN IC DIP SOCKET 30POS GOLDBulk503ActiveDIP, 0.6 15.24mm Row Spacing30 2 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
08-0513-11H
08-0513-11H
53+2.09564
Increments of 53
Leadtime
2-3 weeks		XY-13H-8Q5CONN SOCKET SIP 8POS GOLDBulk0513ActiveSIP8 1 x 8 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
116-87-314-41-002101
116-87-314-41-002101
420+1.13964
Increments of 420
Leadtime
2-3 weeks		UAKB8-6Q-FCCONN IC DIP SOCKET 14POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
02-7400-11
02-7400-11
25+4.41176
Increments of 25
99E-CVYF-JVCONN SOCKET SIP 2POS GOLDBulk700 Elevator Strip-Line™ActiveSIP2 1 x 2 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
104-13-320-41-770000
104-13-320-41-770000
60+11.6596
120+7.61781
300+4.44706
Increments of 60
Leadtime
2-3 weeks		JWALX-MK3-WQCONN IC DIP SOCKET 20POS GOLDTube104ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
208-PRS17017-12
208-PRS17017-12
1+71.4118
Increments of 1
55L-YAE-HXLCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
546-83-503-22-131147
546-83-503-22-131147
9+71.0109
Increments of 9
Leadtime
2-3 weeks		KHCN-BO-4H8CONN SOCKET PGA 503POS GOLDBulk546ActivePGA503 22 x 22 0.050 1.27mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BronzePolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
6IY 1I3 M5
6IY 1I3 M5
408+1.22133
Increments of 408
Leadtime
2 3 weeks		N8JZC-AG3-81CONN IC DIP SOCKET 12POS GOLDTube146ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FramePress Fit0.100 2.54mm Tin BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled 55°C ~ 125°C
643647-1
643647-1
560+1.69144
Increments of 560
Leadtime
2-3 weeks		MR-KZNE-TPCONN SOCKET SIP 15POS TINTubeDiplomate DLActiveSIP15 1 x 15 0.100 2.54mm Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
20-4518-10T
20-4518-10T
54+2.05156
Increments of 54
Leadtime
2-3 weeks		PRY-DHQ-IYCONN IC DIP SOCKET 20POS GOLDBulk518ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
2-640361-2
2-640361-2
77BL-HKC6-A4CONN IC DIP SOCKET 24POS GOLDTubeDiplomate DLObsoleteDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThermoplastic-55°C ~ 125°C
121-13-306-41-001000
121-13-306-41-001000
67+11.8218
134+6.68862
268+3.75289
Increments of 67
99X-TS-8UTCONN IC DIP SOCKET 6POS GOLDTube121ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
510-87-240-16-001101
510-87-240-16-001101
65+9.02142
Increments of 65
Leadtime
2-3 weeks		HYYE-NHW-I4PCONN SOCKET PGA 240POS GOLDBulk510ActivePGA240 16 x 16 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C