ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
8059-4G1
8059-4G1
Leadtime
2-3 weeks		GR7-A5PA-XCCONN TRANSIST-*Obsolete---------------
22-4508-20
22-4508-20
11+9.92335
Increments of 11
7878-BZKF-XTCONN IC DIP SOCKET 22POS GOLDBulk508ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
02-0508-20
02-0508-20
139+0.794118
Increments of 139
12821282B-3H-PFBCONN SOCKET SIP 2POS GOLDBulk508ActiveSIP2 1 x 2 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
116-87-324-41-018101
116-87-324-41-018101
340+1.43033
Increments of 340
99D-5IX-AIYCONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
346-43-158-41-013000
346-43-158-41-013000
1+9.94118
10+8.89804
100+7.32804
500+5.79261
1000+4.97257
Increments of 1
Leadtime
2-3 weeks		NN-DGRW-6SRCONN SOCKET SIP 58POS GOLDBulk346ActiveSIP58 1 x 58 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
20-6820-90T
20-6820-90T
13+8.37933
Increments of 13
Leadtime
2-3 weeks		OSL6-H392-31CONN IC DIP SOCKET 20POS TINBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing20 2 x 10 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
116-83-308-41-007101
116-83-308-41-007101
636+0.753127
Increments of 636
Leadtime
2-3 weeks		EW-XF-BW5CONN IC DIP SOCKET 8POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
16-823-90TWR
16-823-90TWR
15+7.26797
Increments of 15
Leadtime
2-3 weeks		XKJ8T-VLMS-TTJCONN IC DIP SOCKET 16POS TINBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
116-93-304-41-001000
116-93-304-41-001000
102+6.64475
306+3.71386
1020+1.68075
Increments of 102
Leadtime
2-3 weeks		JJHEG-7RO-HVCONN IC DIP SOCKET 4POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
D01-9950942
D01-9950942
3000+1.28471
Increments of 3000
Leadtime
2-3 weeks		NRN-482U-KCCONN SOCKET SIP 9POS GOLDBulkD01-995ActiveSIP9 1 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Tin196.8µin 5.00µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Glass Filled-55°C ~ 125°C
116-83-320-41-008101
116-83-320-41-008101
231+2.23462
Increments of 231
Leadtime
2-3 weeks		VP-TG-N00CONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
32-6508-201
32-6508-201
9+12.2353
Increments of 9
55JIN-7HUX-SACONN IC DIP SOCKET 32POS GOLDBulk508ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
2CAY 0ZR9 EP
2CAY 0ZR9 EP
88+5.69018
Increments of 88
Leadtime
2 3 weeks		RHTTJ-EI99-K5CONN IC DIP SOCKET 50POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled 55°C ~ 125°C
33-7XXXX-10
33-7XXXX-10
7+14.6078
Increments of 7
Leadtime
2-3 weeks		JFOUV-IYD6-E2CONN SOCKET SIP 33POS TINBulk700 Elevator Strip-Line™ActiveSIP33 1 x 33 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
10-2511-11
10-2511-11
22+5.55303
Increments of 22
3232XKY-UTC-EKECONN IC DIP SOCKET 10POS GOLDBulk511ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
104-13-324-41-770000
104-13-324-41-770000
64+12.2866
128+8.23024
256+4.98529
Increments of 64
33O3-M51-VCGCONN IC DIP SOCKET 24POS GOLDTube104ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
192-PGM17025-11
192-PGM17025-11
3+27.9575
Increments of 3
Leadtime
2-3 weeks		0UV2-8JD-1VACONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
510-87-040-11-061101
510-87-040-11-061101
323+1.50368
Increments of 323
Leadtime
2-3 weeks		X3DA-BKZP-3IXCONN SOCKET PGA 40POS GOLDBulk510ActivePGA40 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-420-41-001101
116-83-420-41-001101
210+2.54337
Increments of 210
Leadtime
2-3 weeks		ISR-IBF-DMCONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
DA-92G-YT0
DA-92G-YT0
1+3.93137
10+3.25686
25+3.05294
50+2.71373
100+2.44235
Increments of 1
33T-FQ-DRQCONN IC DIP SOCKET 16POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
110-83-310-41-001101
110-83-310-41-001101
779+0.582039
Increments of 779
Leadtime
2-3 weeks		EJ-SCO-A9DCONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
16-6513-10
16-6513-10
40+2.75735
Increments of 40
Leadtime
2-3 weeks		X1TY-3FZP-XO3CONN IC DIP SOCKET 16POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.6 15.24mm Row Spacing16 2 x 8 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
111-93-648-41-001000
111-93-648-41-001000
56+12.5368
112+8.84261
280+5.08778
Increments of 56
77XJ-QUF-CXCONN IC DIP SOCKET 48POS GOLDTube111ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
FJJJQ-ZDJ-ZZ
FJJJQ-ZDJ-ZZ
462+1.04441
Increments of 462
55XZI-QG-DSCONN IC DIP SOCKET 18POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
07-0513-10T
07-0513-10T
132+0.838235
Increments of 132
Leadtime
2-3 weeks		HAK3-1Q-G0CONN SOCKET SIP 7POS GOLDBulk0513ActiveSIP7 1 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-