ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
14-8870-10
14-8870-10
50+3
Increments of 50
Leadtime
2-3 weeks		O4-913-I05CONN IC DIP SOCKET 14POS TINBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
123-93-628-41-801000
123-93-628-41-801000
168+5.30835
Increments of 168
44V-Y6-FWCONN IC DIP SOCKET 28POS GOLDTube123ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
WPSE YI VTU
WPSE YI VTU
54+16.2767
108+11.9508
270+8.62146
Increments of 54
Leadtime
2 3 weeks		ZASQ-B2-FICONN IC DIP SOCKET 64POS GOLDTube612ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester 55°C ~ 125°C
1109800-18
1109800-18
5+16.7216
Increments of 5
707707A-XLF-8HCONN IC DIP SOCKET 18POS GOLDBulkCorrect-A-Chip® 1109800ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleProgrammableSolder0.100 2.54mm Tin-Lead200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
510-87-144-15-001101
510-87-144-15-001101
98+5.69777
Increments of 98
Leadtime
2-3 weeks		A45G-ND6V-TGCONN SOCKET PGA 144POS GOLDBulk510ActivePGA144 15 x 15 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
122-83-328-41-001101
122-83-328-41-001101
195+2.76119
Increments of 195
Leadtime
2-3 weeks		VJM-4S-7RTCONN IC DIP SOCKET 28POS GOLDTube122ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
B7Y XFN0 RP
B7Y XFN0 RP
126+4.14224
Increments of 126
Leadtime
2 3 weeks		C9WOK-CSG-AQCONN IC DIP SOCKET 20POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled 55°C ~ 125°C
115-87-306-41-001101
115-87-306-41-001101
2070+0.203676
Increments of 2070
Leadtime
2-3 weeks		R3-ZCJA-6OICONN IC DIP SOCKET 6POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
AW127-40 Z-T
AW127-40 Z-T
200+1.74176
Increments of 200
99YRH-7K-B8KSOCKET 40 CONTACTS SINGLE ROW--Active---------------
24-6518-111
24-6518-111
19+5.80185
Increments of 19
Leadtime
2-3 weeks		ME-RNPZ-CLCONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
C8118-04
C8118-04
Leadtime
2-3 weeks		MR-KIT9-KACONN IC DIP SOCKET 18POS TINBulkEdge-Grip™, C81ObsoleteDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
510-83-085-11-044101
510-83-085-11-044101
95+5.58421
Increments of 95
Leadtime
2-3 weeks		MLBW-40B-3ICONN SOCKET PGA 85POS GOLDBulk510ActivePGA85 11 x 11 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-99-636-41-001000
110-99-636-41-001000
55+11.4686
275+3.36392
550+2.06913
Increments of 55
Leadtime
2-3 weeks		ZNSR2-24O6-S8CONN IC DIP SOCKET 36POS TINLEADTube110ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Tin-Lead200µin 5.08µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
T98-IFU-IF
T98-IFU-IF
15+7.32941
Increments of 15
Leadtime
2 3 weeks		RDXCS-PK-PXCONN IC DIP SOCKET 10POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6
115-83-308-41-003101
115-83-308-41-003101
988+0.457971
Increments of 988
6464-FU-N0CONN IC DIP SOCKET 8POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
A-CCS 068-G-T
A-CCS 068-G-T
1+2.33333
10+2.11373
25+1.98431
50+1.89804
100+1.81176
Increments of 1
33ZDIA-1SD7-2QCONN SOCKET PLCC 68POS GOLDTube-ActivePLCC68 4 x 17 0.050 1.27mm Gold-Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Gold-Phosphor BronzePolybutylene Terephthalate PBT -40°C ~ 105°C
4607
4607
1+2.73529
Increments of 1
Leadtime
2-3 weeks		ED-57-F9DCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 Rectangular -Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
32-3551-16
32-3551-16
56+34
Increments of 56
Leadtime
2-3 weeks		HN6I-KT4C-ARBCONN IC DIP SOCKET ZIF 32POSBulk55ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing32 2 x 16 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
517-87-447-20-121111
517-87-447-20-121111
20+23.6083
Increments of 20
Leadtime
2-3 weeks		SHB3-CUMM-ACCONN SOCKET PGA 447POS GOLDBulk517ActivePGA447 20 x 20 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
SIP1X16-014BLF
SIP1X16-014BLF
Leadtime
2-3 weeks		FS6-EC-N3VCONN SOCKET SIP 16POS TINBulkSIP1xObsoleteSIP16 1 x 16 0.100 2.54mm Tin150µin 3.81µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled-
D4MTF-P9-8V7
D4MTF-P9-8V7
240+12.3608
Increments of 240
Leadtime
2-3 weeks		LOQ-8B-11ECONN SOCKET LGA 1156POS GOLDTray-ActiveLGA1156 34 x 34 0.036 0.91mm GoldFlashCopper AlloySurface MountClosed FrameSolder0.039 1.00mm --Copper AlloyThermoplastic-
06-1518-10H
06-1518-10H
162+0.683853
Increments of 162
Leadtime
2-3 weeks		0PY2Q-MAB-RTCONN IC DIP SOCKET 6POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing6 2 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
18-1518-10
18-1518-10
65+1.72067
Increments of 65
Leadtime
2-3 weeks		KTPR-FD-RL8CONN IC DIP SOCKET 18POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
06-71187-10
06-71187-10
15+7.20588
Increments of 15
Leadtime
2-3 weeks		KKQE-I0U-GGICONN SOCKET SIP 6POS TINBulk700 Elevator Strip-Line™ActiveSIP6 1 x 6 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
64-9518-10TE
64-9518-10TE
6+14.683
Increments of 6
Leadtime
2-3 weeks		LKC9-ZNI-S1CONN IC DIP SOCKET 64POS GOLDBulk518ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-