ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
APA-624-T-D
APA-624-T-D
1+4.46078
Increments of 1
Leadtime
2-3 weeks		KF9-JD-V1ADAPTOR PLUG-*Active---------------
848-AG11D-ES
848-AG11D-ES
1000+3.18372
Increments of 1000
Leadtime
2-3 weeks		KPZ9-KP-BAOCONN IC DIP SOCKET 48POS GOLDTube800ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
24-6503-20
24-6503-20
13+8.44118
Increments of 13
Leadtime
2-3 weeks		MKI-WYP-KYCONN IC DIP SOCKET 24POS GOLDBulk503ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
01-0513-10
01-0513-10
500+0.196078
Increments of 500
Leadtime
2-3 weeks		GHRL-4AQT-566CONN SOCKET SIP 1POS GOLDBulk0513ActiveSIP1 1 x 1 -Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
25-71219-10
25-71219-10
9+11.9608
Increments of 9
Leadtime
2-3 weeks		ACM-BZ-EOMCONN SOCKET SIP 25POS TINBulk700 Elevator Strip-Line™ActiveSIP25 1 x 25 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
69802-144LF
69802-144LF
1+1.90196
10+1.72255
25+1.61725
50+1.54686
100+1.47657
Increments of 1
Leadtime
2-3 weeks		FECF-GF-RBCONN SOCKET PLCC 44POS TINTube-ActivePLCC44 4 x 11 0.050 1.27mm Tin150µin 3.81µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm Phosphor BronzePolyphenylene Sulfide PPS -55°C ~ 125°C
APA-640-T-A
APA-640-T-A
1+4.98039
Increments of 1
Leadtime
2-3 weeks		V7RV-5D-OVADAPTOR PLUG-*Active---------------
4842-6004-CP
4842-6004-CP
2160+0.5
Increments of 2160
Leadtime
2-3 weeks		ZBV9I-7Y-DH3CONN IC DIP SOCKET 42POS TINTube4800ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Tin135µin 3.43µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin135µin 3.43µm Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
32-1518-10
32-1518-10
38+2.95588
Increments of 38
Leadtime
2-3 weeks		H6J-EQI-1T5CONN IC DIP SOCKET 32POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing32 2 x 16 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
30-1518-11H
30-1518-11H
17+6.57843
Increments of 17
Leadtime
2-3 weeks		FY7I4-E4-Z1CONN IC DIP SOCKET 30POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing30 2 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
8S-T3QY-QE
8S-T3QY-QE
2000+14.0024
Increments of 2000
Leadtime
2-3 weeks		AA-Y77-986DSL ASSY LGA771 LEADED, 076 GOLD-*Active---------------
16-3501-30
16-3501-30
24+4.96487
Increments of 24
Leadtime
2-3 weeks		ZSKX0-671-71CONN IC DIP SOCKET 16POS TINBulk501ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
XR2E-3205
XR2E-3205
99Q-T8-65CONN SOCKET SIP 32POS GOLDBulkXR2ObsoleteSIP32 1 x 32 0.100 2.54mm Gold-Beryllium Copper--Solder0.100 2.54mm Gold-Beryllium CopperPolybutylene Terephthalate PBT , Glass Filled-55°C ~ 125°C
10-6513-11H
10-6513-11H
29+3.8384
Increments of 29
1515-9N-PX2CONN IC DIP SOCKET 10POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.6 15.24mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
32-820-90C
32-820-90C
9+11.451
Increments of 9
Leadtime
2-3 weeks		BWTUO-XHX8-I4ZCONN IC DIP SOCKET 32POS GOLDBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
50-9513-10H
50-9513-10H
9+12.1961
Increments of 9
Leadtime
2-3 weeks		NG05-AO-KHCONN IC DIP SOCKET 50POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.9 22.86mm Row Spacing50 2 x 25 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
510-87-101-11-001101
510-87-101-11-001101
133+3.99639
Increments of 133
Leadtime
2-3 weeks		FKV-IW-99CONN SOCKET PGA 101POS GOLDBulk510ActivePGA101 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
10-810-90C
10-810-90C
1+8.7451
25+7.60784
100+6.08627
500+5.13529
1000+4.85
Increments of 1
Leadtime
2-3 weeks		W0SN-EYIS-4T0CONN IC DIP SOCKET 10POS GOLDBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
518-77-500M30-001105
518-77-500M30-001105
13+143.961
Increments of 13
Leadtime
2-3 weeks		QC-E9Q-U2CONN SOCKET PGA 500POS GOLDBulk518ActivePGA500 30 x 30 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm GoldFlashBrassFR4 Epoxy Glass-55°C ~ 125°C
ICO-640-SGT
ICO-640-SGT
1+5.2451
Increments of 1
Leadtime
2-3 weeks		DVK2E-MA-NY1CONN IC DIP SOCKET 40POS GOLDBulkICOActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
146-93-306-41-012000
146-93-306-41-012000
67+10.8095
536+1.63825
1005+1.0875
Increments of 67
Leadtime
2-3 weeks		B4LA3-99-HMBCONN IC DIP SOCKET 6POS GOLDTube146ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
17-0508-20
17-0508-20
18+6.12527
Increments of 18
Leadtime
2-3 weeks		KWE2-FES-CNCONN SOCKET SIP 17POS GOLDBulk508ActiveSIP17 1 x 17 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
01-0517-90C
01-0517-90C
278+0.352941
Increments of 278
Leadtime
2-3 weeks		FX7P0-K0Q-TOICONN SOCKET SIP 1POS GOLDBulk0517ActiveSIP1 1 x 1 -Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle-Solder-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
27-0511-10
27-0511-10
21+6.83707
Increments of 21
Leadtime
2-3 weeks		GR1D6-YVKY-PZCONN SOCKET SIP 27POS TINBulk511ActiveSIP27 1 x 27 0.100 2.54mm Tin50µin 1.27µm Phosphor BronzeThrough Hole-Solder0.100 2.54mm Tin50µin 1.27µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
100-032-001
100-032-001
Leadtime
2-3 weeks		UZ-ZKX-TWDCONN IC DIP SOCKET 32POS GOLDBulk100ObsoleteDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold8µin 0.20µm Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100 2.54mm GoldFlashBrassPolyphenylene Sulfide PPS , Glass Filled-65°C ~ 125°C