ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
11-0501-31
11-0501-31
12+9.05882
Increments of 12
Leadtime
2-3 weeks		ZV-EPPO-DKCONN SOCKET SIP 11POS GOLDBulk501ActiveSIP11 1 x 11 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
123-87-624-41-001101
123-87-624-41-001101
476+1.77402
Increments of 476
Leadtime
2-3 weeks		JJO-SBP1-2SCONN IC DIP SOCKET 24POS GOLDTube123ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-83-108-12-051101
510-83-108-12-051101
85+6.74048
Increments of 85
Leadtime
2-3 weeks		COV-CSF-AWSCONN SOCKET PGA 108POS GOLDBulk510ActivePGA108 12 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
114-87-310-41-117101
114-87-310-41-117101
1148+0.36398
Increments of 1148
Leadtime
2-3 weeks		R83B-PX3V-UQCONN IC DIP SOCKET 10POS GOLDTube114ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
25-0518-10
25-0518-10
47+2.36024
Increments of 47
Leadtime
2-3 weeks		LH-T6N-0E9CONN SOCKET SIP 25POS GOLDBulk518ActiveSIP25 1 x 25 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
116-87-306-41-002101
116-87-306-41-002101
994+0.449745
Increments of 994
Leadtime
2-3 weeks		LA6H-VUHY-2OWCONN IC DIP SOCKET 6POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
123-83-318-41-001101
123-83-318-41-001101
299+1.68625
Increments of 299
77X4R-DDY-JLCONN IC DIP SOCKET 18POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
06-3513-11
06-3513-11
120+1.2549
Increments of 120
Leadtime
2-3 weeks		HPCQ4-JQAZ-KF9CONN IC DIP SOCKET 6POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
110-93-964-41-001000
110-93-964-41-001000
1+5.82353
10+4.81863
50+4.01569
100+3.61412
250+3.33302
Increments of 1
Leadtime
2-3 weeks		MH2-M9-OHCONN IC DIP SOCKET 64POS GOLDTube110ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
09DK3-3PAG-5I
09DK3-3PAG-5I
Leadtime
2-3 weeks		F70G-4Q-GLKCONN TRANSIST TO-5 4POS GOLDBulk8058ObsoleteTransistor, TO-54 Round -Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-BrassPolytetrafluoroethylene PTFE -55°C ~ 125°C
382437-3
382437-3
Leadtime
2-3 weeks		0T-9G9D-TMCONN SOCKET SIP 3POS TINTrayDiplomate DLObsoleteSIP3 1 x 3 0.100 2.54mm Tin-Phosphor BronzeThrough Hole-Solder0.100 2.54mm Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
228-7474-55-1902
228-7474-55-1902
1+38.9804
10+35.1843
25+33.7098
50+31.6029
100+30.5495
Increments of 1
Leadtime
2-3 weeks		0DDUV-2WSJ-7VCONN SOCKET SOIC 28POS GOLDBulkTextool™ActiveSOIC28 2 x 14 -Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin 0.76µm Beryllium CopperPolyethersulfone PES , Glass Filled-55°C ~ 150°C
299-83-612-10-002101
299-83-612-10-002101
170+3.29262
Increments of 170
Leadtime
2-3 weeks		NG5ZK-4L-Q15CONN IC DIP SOCKET 12POS GOLDTube299ActiveDIP, 0.6 15.24mm Row Spacing12 2 x 6 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
42-6571-10
42-6571-10
6+15.7337
Increments of 6
22Y-9EC-3XPCONN IC DIP SOCKET ZIF 42POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
110-87-428-41-001101
110-87-428-41-001101
504+0.891088
Increments of 504
Leadtime
2-3 weeks		NFK-09-KIGCONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.4 10.16mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-648-41-003101
116-83-648-41-003101
120+4.2424
Increments of 120
Leadtime
2-3 weeks		OLSW-Q6C5-41CONN IC DIP SOCKET 48POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
163-PGM15066-10T
163-PGM15066-10T
2+45.951
Increments of 2
Leadtime
2-3 weeks		HB0W-IIC-FTCONN SOCKET PGA TINBulkPGMActivePGA-0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
917-87-108-41-005101
917-87-108-41-005101
490+0.974333
Increments of 490
Leadtime
2-3 weeks		MEY-W6JE-ETCONN TRANSIST TO-5 8POS GOLDBulk917ActiveTransistor, TO-58 Round -GoldFlashBeryllium CopperThrough Hole-Solder-Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
SIP1X20-011BLF
SIP1X20-011BLF
Leadtime
2-3 weeks		QOXH-9S3-4YCONN SOCKET SIP 20POS GOLDBulkSIP1xObsoleteSIP20 1 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled-
48-6511-10
48-6511-10
20+6.10392
Increments of 20
55UFE-HL-00CONN IC DIP SOCKET 48POS TINBulk511ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
614-87-964-31-012101
614-87-964-31-012101
120+4.18096
Increments of 120
Leadtime
2-3 weeks		ZBV3-GO6-8RCONN IC DIP SOCKET 64POS GOLDBulk614ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
A-CCS-052-Z-SM
A-CCS-052-Z-SM
23+1.12489
Increments of 23
Leadtime
2-3 weeks		CR-7GEB-UBBCONN SOCKET PLCC 52POS TINTube-ActivePLCC52 4 x 13 0.050 1.27mm Tin160µin 4.06µm Phosphor BronzeSurface MountOpen FrameSolder0.050 1.27mm Tin160µin 4.06µm Phosphor BronzePolyamide PA9T , Nylon 9T, Glass Filled-40°C ~ 105°C
68-PGM11033-11
68-PGM11033-11
6+15.4167
Increments of 6
Leadtime
2-3 weeks		ML1I-1X3-093CONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
A-CCS68-G-1
A-CCS68-G
Leadtime
2-3 weeks		PQ60F-LQNZ-48CONN SOCKET PLCC 68POS GOLDTube-ObsoletePLCC68 4 x 17 0.050 1.27mm Gold-Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Gold-Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
48-3572-11
48-3572-11
6+24.5294
Increments of 6
Leadtime
2-3 weeks		EF-C66X-PHCONN IC DIP SOCKET ZIF 48POS GLDBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing48 2 x 24 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-