ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
NM87E-9X68-289
NM87E-9X68-289
574+0.835745
Increments of 574
Leadtime
2-3 weeks		VYELA-0W-6V0CONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
614-87-085-11-041112
614-87-085-11-041112
57+8.88837
Increments of 57
Leadtime
2-3 weeks		RSO9P-N5QS-296CONN SOCKET PGA 85POS GOLDBulk614ActivePGA85 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
KI0C-JE-NJ
KI0C-JE-NJ
7+14.3725
Increments of 7
Leadtime
2-3 weeks		CMNM-WYM-1ICONN IC DIP SOCKET 20POS GOLDBulk503ActiveDIP, 0.9 22.86mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
AW-127A-20-Z
AW-127A-20-Z
Leadtime
2-3 weeks		EQ5-BGH-NTMCONN SOCKET SIP 20POS TIN--ObsoleteSIP20 1 x 20 0.100 2.54mm Tin78.7µin 2.00µm -Through HoleClosed Frame-------
1109681-632 100 PCS MINIMUM
1109681-632 100 PCS MINIMUM
100+40.5882
Increments of 100
Leadtime
2-3 weeks		0C2G2-HRAU-XBCONN IC DIP SOCKET 32POS GOLDBulk-ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold10µin 0.25µm BrassThrough HoleSpacerSolder0.100 2.54mm Tin-Lead200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
144-PRS15026-12
144-PRS15026-12
2+60.201
Increments of 2
Leadtime
2-3 weeks		BYE8-W4-1W0CONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
0MZ3-Q90P-MT
0MZ3-Q90P-MT
5+15.3235
Increments of 5
11PEDP-HXG-Q5CONN SOCKET SIP 39POS GOLDBulk501ActiveSIP39 1 x 39 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
714-43-159-31-018000
714-43-159-31-018000
1+11.8431
10+11.002
100+9.59108
500+8.7448
1000+8.03957
Increments of 1
Leadtime
2-3 weeks		V84-QYC3-7OCONN SOCKET SIP 59POS GOLDBulk714ActiveSIP59 1 x 59 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
GX-KE5-99
GX-KE5-99
54+11.1057
270+3.06449
540+1.81765
Increments of 54
88T-SN7K-TWCCONN IC DIP SOCKET 22POS GOLDTube110ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
614-83-225-17-061112
614-83-225-17-061112
24+26.3133
Increments of 24
Leadtime
2-3 weeks		UJC5-LRU1-C19CONN SOCKET PGA 225POS GOLDBulk614ActivePGA225 17 x 17 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
IZO2P-ZDTB-X48
IZO2P-ZDTB-X48
13+8.35897
Increments of 13
Leadtime
2-3 weeks		U0S7-BIN-UMXCONN SOCKET SIP 13POS GOLDBulk0503ActiveSIP13 1 x 13 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA , Nylon, Glass Filled-
04-0518-10
04-0518-10
250+0.392157
Increments of 250
11ESI-OS-KSCONN SOCKET SIP 4POS GOLDBulk518ActiveSIP4 1 x 4 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
44-6574-16
44-6574-16
2+37.5
Increments of 2
11OC-YO8L-0A0CONN IC DIP SOCKET ZIF 44POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing44 2 x 22 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
1-1437542-9
1-1437542-9
88W1-0H8-CJCONN IC DIP SOCKET 16POS GOLD-700ObsoleteDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold20µin 0.51µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold20µin 0.51µm Beryllium CopperAluminum Alloy-55°C ~ 125°C
05-7380-10
05-7380-10
15+7.22549
Increments of 15
5252PG-P56-LVCONN SOCKET SIP 5POS TINBulk700 Elevator Strip-Line™ActiveSIP5 1 x 5 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
A-CCS20-Z
A-CCS20-Z
Leadtime
2-3 weeks		VC-N51Y-B9CONN SOCKET PLCC 20POS TINTube-ObsoletePLCC20 4 x 5 0.050 1.27mm Tin150µin 3.81µm Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
8-1437504-2
8-1437504-2
Leadtime
2-3 weeks		NRSGP-L1Q7-HTCONN TRANSIST TO-3 3POS TINBulk8080ObsoleteTransistor, TO-33 Oval -Tin200µin 5.08µm Beryllium CopperChassis MountClosed FrameSolder-Tin200µin 5.08µm Beryllium CopperPolytetrafluoroethylene PTFE -55°C ~ 125°C
126-93-650-41-002000
126-93-650-41-002000
56+17.0259
112+12.6563
280+9.2541
Increments of 56
Leadtime
2-3 weeks		S2A6B-CT-4BCCONN IC DIP SOCKET 50POS GOLDTube126ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
111-93-308-41-001000
111-93-308-41-001000
1+1.33333
10+1.03529
25+0.965098
50+0.877451
100+0.789706
Increments of 1
Leadtime
2-3 weeks		SY16B-KCRM-DIVCONN IC DIP SOCKET 8POS GOLDTube111ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
5S9-3W-FD
5S9-3W-FD
56+11.3228
112+7.52469
280+4.15882
Increments of 56
17017-IQI-WCECONN ZIG-ZAG 28POS GOLDBulk410ActiveZig-Zag, Right Stackable28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
09DK3-3PAG-5I
09DK3-3PAG-5I
Leadtime
2-3 weeks		F2T2D-V6E-7HCONN TRANSIST TO-5 4POS GOLDBulk8058ObsoleteTransistor, TO-54 Round -Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-BrassPolytetrafluoroethylene PTFE -55°C ~ 125°C
09-0508-21
09-0508-21
18+6.2549
Increments of 18
2626-UVGJ-CCCONN SOCKET SIP 9POS GOLDBulk508ActiveSIP9 1 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
133-PGM13067-10H
133-PGM13067-10H
3+31.7222
Increments of 3
Leadtime
2-3 weeks		RSD13-4I-9HJCONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
48-6554-16
48-6554-16
6+52.1013
Increments of 6
Leadtime
2-3 weeks		TPNOB-SP4O-MCSCONN IC DIP SOCKET ZIF 48POSBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
50KT F7 O6
50KT F7 O6
1+1.16667
10+1.02745
25+0.967059
50+0.926863
100+0.886471
Increments of 1
Leadtime
2 3 weeks		J0AP3-R6Z-RJMCONN SOCKET PLCC 84POS TINTube ActivePLCC84 4 x 21 0.050 1.27mm Tin160µin 4.06µm Phosphor BronzeSurface MountOpen FrameSolder0.050 1.27mm Tin160µin 4.06µm Phosphor BronzePolyamide PA9T , Nylon 9T, Glass Filled 40°C ~ 105°C