ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
20-6513-11H
20-6513-11H
17+6.44925
Increments of 17
Leadtime
2-3 weeks		R9U-REW0-D7BCONN IC DIP SOCKET 20POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.6 15.24mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
299-83-306-11-001101
299-83-306-11-001101
426+1.19186
Increments of 426
Leadtime
2-3 weeks		Q8ZI-TVSX-ZN3CONN IC DIP SOCKET 6POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
6IY 1I3 M5
6IY 1I3 M5
408+1.22133
Increments of 408
Leadtime
2 3 weeks		IH-WFD-3WCONN IC DIP SOCKET 12POS GOLDTube146ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FramePress Fit0.100 2.54mm Tin BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled 55°C ~ 125°C
36-0518-11
36-0518-11
23+5.15303
Increments of 23
Leadtime
2-3 weeks		Q7-GC57-ZIJCONN SOCKET SIP 36POS GOLDBulk518ActiveSIP36 1 x 36 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
23-0501-20
23-0501-20
10+9.66765
Increments of 10
Leadtime
2-3 weeks		HNIBO-AR-TCXCONN SOCKET SIP 23POS TINBulk501ActiveSIP23 1 x 23 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-93-952-41-008000
116-93-952-41-008000
56+15.4627
112+11.1863
280+7.93456
Increments of 56
77EQ6-C17Z-BEXCONN IC DIP SOCKET 52POS GOLDTube116ActiveDIP, 0.9 22.86mm Row Spacing52 2 x 26 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
G8-516-U7R
G8-516-U7R
1+1.67647
10+1.52451
100+1.30706
500+1.0892
1000+0.933608
Increments of 1
11SY4B-KAA-9MCONN IC DIP SOCKET 16POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
117-87-668-41-105101
117-87-668-41-105101
88+6.02362
Increments of 88
Leadtime
2-3 weeks		UBNX-EY-3QNCONN IC DIP SOCKET 68POS GOLDTube117ActiveDIP, 0.6 15.24mm Row Spacing68 2 x 34 0.070 1.78mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-99-210-41-001000
110-99-210-41-001000
80+10.5264
2560+0.53852
5040+0.434608
Increments of 80
Leadtime
2-3 weeks		HYSS-BCXR-ZHCONN IC DIP SOCKET 10POS TINLEADTube110ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Tin-Lead200µin 5.08µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
117-83-432-41-105101
117-83-432-41-105101
144+3.69397
Increments of 144
Leadtime
2-3 weeks		EO-3RA6-4ICONN IC DIP SOCKET 32POS GOLDTube117ActiveDIP, 0.4 10.16mm Row Spacing32 2 x 16 0.070 1.78mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
25-7650-10
25-7650-10
9+11.9608
Increments of 9
Leadtime
2-3 weeks		N3P-VT2-UQCONN SOCKET SIP 25POS TINBulk700 Elevator Strip-Line™ActiveSIP25 1 x 25 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
YA-D7-NT
YA-D7-NT
67+10.9982
536+1.77352
1005+1.20833
Increments of 67
Leadtime
2-3 weeks		SCG-G9B-IKYCONN IC DIP SOCKET 6POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
20-0513-11
20-0513-11
27+4.14706
Increments of 27
Leadtime
2-3 weeks		PY-YQO-J3CONN SOCKET SIP 20POS GOLDBulk0513ActiveSIP20 1 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
28-3508-212
28-3508-212
5+17.3235
Increments of 5
Leadtime
2-3 weeks		XJA9Y-449Y-5F8CONN IC DIP SOCKET 28POS GOLDBulk508ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
116-87-428-41-012101
116-87-428-41-012101
240+2.1194
Increments of 240
66S-90A-L4CONN IC DIP SOCKET 28POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-316-41-007101
116-83-316-41-007101
312+1.59012
Increments of 312
66AVPW-EV0-J0RCONN IC DIP SOCKET 16POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
APA-422-G-Q
APA-422-G-Q
1+12.4706
Increments of 1
Leadtime
2-3 weeks		VVB-NCGI-FNADAPTOR PLUG-*Active---------------
122-87-420-41-001101
122-87-420-41-001101
336+1.47838
Increments of 336
Leadtime
2-3 weeks		PZTC-Z1JW-B4CONN IC DIP SOCKET 20POS GOLDTube122ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-650-41-007101
116-83-650-41-007101
96+5.23039
Increments of 96
11NUZY-IP-2JLCONN IC DIP SOCKET 50POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
32-6575-10
32-6575-10
8+14.4706
Increments of 8
Leadtime
2-3 weeks		O7NV-2R8F-SUXCONN IC DIP SOCKET ZIF 32POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
48-6554-18
48-6554-18
6+108.322
Increments of 6
Leadtime
2-3 weeks		JRH-TZJ-D9CONN IC DIP SOCKET ZIF 48POSBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyetheretherketone PEEK , Glass Filled-55°C ~ 250°C
03-0503-30
03-0503-30
74+1.5
Increments of 74
Leadtime
2-3 weeks		AESKF-Z7Q-YACONN SOCKET SIP 3POS GOLDBulk0503ActiveSIP3 1 x 3 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA , Nylon, Glass Filled-
OG8R-9YII-M3B
OG8R-9YII-M3B
1+7.97059
10+7.13137
100+5.87265
500+4.64222
1000+3.98504
Increments of 1
22BE-HAY1-QDCONN SOCKET SIP 44POS GOLDBulk346ActiveSIP44 1 x 44 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
8-1437531-6
8-1437531-6
480+4.18607
Increments of 480
Leadtime
2-3 weeks		C3SK-KG-Z3CONN IC DIP SOCKET 20POS TINLEADTube500ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Tin-Lead-Copper AlloyThrough HoleClosed FrameSolder0.100 2.54mm Tin-Lead-Copper Alloy--55°C ~ 105°C
181-PLS15033-12
181-PLS15033-12
2+64.2647
Increments of 2
Leadtime
2-3 weeks		WSCO-1XA-KECONN SOCKET PGA ZIF GOLDBulkPLSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C