ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
299-93-640-10-002000
299-93-640-10-002000
80+10.4141
Increments of 80
Leadtime
2-3 weeks		E6WG-LW-GKACONN IC DIP SOCKET 40POS GOLDTube299ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
346-43-107-41-013000
346-43-107-41-013000
1+2.7549
10+2.46078
100+2.02657
500+1.60194
1000+1.37516
Increments of 1
Leadtime
2-3 weeks		BEJDW-RV0-L3CONN SOCKET SIP 7POS GOLDBulk346ActiveSIP7 1 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
A 28-LC-TR
A 28-LC-TR
1+0.45098
10+0.426471
25+0.383922
50+0.341176
100+0.326961
Increments of 1
Leadtime
2-3 weeks		GHUN-97X-UHCONN IC DIP SOCKET 28POS TINTube-ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin-Phosphor BronzePolybutylene Terephthalate PBT -55°C ~ 85°C
12-4513-10
12-4513-10
60+1.85294
Increments of 60
Leadtime
2-3 weeks		ZOJ-SCS4-36CONN IC DIP SOCKET 12POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.4 10.16mm Row Spacing12 2 x 6 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
48-3554-18
48-3554-18
6+108.322
Increments of 6
Leadtime
2-3 weeks		NJ-GWP-H2CONN IC DIP SOCKET ZIF 48POSBulk55ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing48 2 x 24 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyetheretherketone PEEK , Glass Filled-55°C ~ 250°C
AR40-HZL 01-TT
AR40-HZL 01-TT
22FD-772-JFCONN IC DIP SOCKET 40POS GOLDTube-ObsoleteDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
20-3508-302
20-3508-302
11+10.0062
Increments of 11
Leadtime
2-3 weeks		CCHN-Q4-3AXCONN IC DIP SOCKET 20POS GOLDBulk508ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
29-0518-00
29-0518-00
20+5.5
Increments of 20
Leadtime
2-3 weeks		P8CDN-5K-D5LCONN SOCKET SIP 29POS GOLDBulk518ActiveSIP29 1 x 29 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
08-7580-10
08-7580-10
30+5.53824
Increments of 30
Leadtime
2-3 weeks		NC7-8Q-4AQCONN SOCKET SIP 8POS TINBulk700 Elevator Strip-Line™ActiveSIP8 1 x 8 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-83-632-41-002101
116-83-632-41-002101
156+3.4868
Increments of 156
Leadtime
2-3 weeks		O9JT9-QW-T9CONN IC DIP SOCKET 32POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
26-6823-90C
26-6823-90C
10+9.70392
Increments of 10
Leadtime
2-3 weeks		WJ9-EGJO-RQCONN IC DIP SOCKET 26POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing26 2 x 13 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
110-87-210-41-001101
110-87-210-41-001101
1+0.578431
10+0.546078
100+0.418333
500+0.363804
1000+0.300137
Increments of 1
Leadtime
2-3 weeks		OXO43-5U4-HUJCONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
34-7394-10
34-7394-10
8+12.6275
Increments of 8
Leadtime
2-3 weeks		V9U0Z-3G-HN5CONN SOCKET SIP 34POS TINBulk700 Elevator Strip-Line™ActiveSIP34 1 x 34 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
38-0501-21
38-0501-21
5+14.9863
Increments of 5
Leadtime
2-3 weeks		RQ-NRT-2ZUCONN SOCKET SIP 38POS GOLDBulk501ActiveSIP38 1 x 38 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
24-C300-31
24-C300-31
6+16.616
Increments of 6
Leadtime
2-3 weeks		F79H-SO-6OCONN IC DIP SOCKET 24POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
510-83-100-13-061101
510-83-100-13-061101
80+6.56985
Increments of 80
77YQ-D3EQ-SHCONN SOCKET PGA 100POS GOLDBulk510ActivePGA100 13 x 13 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
01-0513-10H
01-0513-10H
313+0.313725
Increments of 313
88ECZ-M3K-180CONN SOCKET SIP 1POS GOLDBulk0513ActiveSIP1 1 x 1 -Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
8080-1G1
8080-1G1
1+11.0882
10+10.0784
25+9.82667
50+9.07059
100+8.56676
Increments of 1
Leadtime
2-3 weeks		ICB-QAN-K2UCONN TRANSIST TO-3 4POS GOLDBulk8080ActiveTransistor, TO-34 Round -Gold-Beryllium CopperThrough HoleClosed FrameSolder-Tin-Lead-Beryllium CopperFluoropolymer FP -55°C ~ 125°C
3-1437535-2
3-1437535-2
2040+2.51534
Increments of 2040
44X0-ND0Z-GOF510-AG91D07-ESL=500 SERIES SIP-*Active---------------
DIP328-011BLF
DIP328-011BLF
Leadtime
2-3 weeks		ZAE-Z6-SR8CONN IC DIP SOCKET 28POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-
I9RKA-M7M-RI
I9RKA-M7M-RI
700+1.19228
Increments of 700
Leadtime
2-3 weeks		BB7-QVUX-VDZCONN ZIG-ZAG 24POS GOLDTube410ActiveZig-Zag, Left Stackable24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-3551-18
24-3551-18
50+59.6375
Increments of 50
Leadtime
2-3 weeks		RETM-GBQ-UP5CONN IC DIP SOCKET ZIF 24POSBulk55ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyetheretherketone PEEK , Glass Filled-55°C ~ 250°C
48-3570-16
48-3570-16
6+38.7059
Increments of 6
4141-ZEM-56CONN IC DIP SOCKET ZIF 48POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing48 2 x 24 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
510-87-097-11-041101
510-87-097-11-041101
133+3.83798
Increments of 133
Leadtime
2-3 weeks		Z5HM-UD-P5CONN SOCKET PGA 97POS GOLDBulk510ActivePGA97 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-93-650-41-007000
116-93-650-41-007000
56+14.3046
112+11.1798
280+6.9578
Increments of 56
Leadtime
2-3 weeks		JDM0-U0-P3ICONN IC DIP SOCKET 50POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C