ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
4-1571551-5
4-1571551-5
4160+1.54062
Increments of 4160
Leadtime
2-3 weeks		CGQN-GBTW-YGCONN IC DIP SOCKET 18POS GOLDTube500ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold25µin 0.63µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold25µin 0.63µm NickelPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
8080-1G36
8080-1G36
99YSC-M7VC-F41CONN TRANSIST-*Obsolete---------------
614-83-310-41-001101
614-83-310-41-001101
697+0.685078
Increments of 697
Leadtime
2-3 weeks		NUFX-K2-HHCONN IC DIP SOCKET 10POS GOLDBulk614ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
2069189-1
2069189-1
Leadtime
2-3 weeks		U2PPJ-580G-AHCONN SOCKET LGA 1944POS GOLDTray-ObsoleteLGA1944 G34 0.039 1.00mm Gold30µin 0.76µm Copper AlloySurface MountOpen FrameSolder0.039 1.00mm ---Liquid Crystal Polymer LCP -
9-1437504-4
9-1437504-4
646646-FCQH-5VTRANSISTOR SOCKET-*Obsolete---------------
123-87-422-41-001101
123-87-422-41-001101
304+1.62623
Increments of 304
Leadtime
2-3 weeks		OHC-22MC-PACONN IC DIP SOCKET 22POS GOLDTube123ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
AR28-HZL 7 01-TT
AR28-HZL 7 01-TT
Leadtime
2-3 weeks		RD-QP7-VI2CONN IC DIP SOCKET 28POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
146-83-318-41-035101
146-83-318-41-035101
264+1.83196
Increments of 264
Leadtime
2-3 weeks		AB4X-FTUR-8TCONN IC DIP SOCKET 18POS GOLDTube146ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
614-87-428-31-012101
614-87-428-31-012101
280+1.73775
Increments of 280
Leadtime
2-3 weeks		B8-7FX-KOCONN IC DIP SOCKET 28POS GOLDBulk614ActiveDIP, 0.4 10.16mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
514-87-419-19-001154
514-87-419-19-001154
20+28.1784
Increments of 20
Leadtime
2-3 weeks		JD2-JJCY-S5CONN SOCKET PGA 419POS GOLDBulk514ActivePGA419 19 x 19 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
346-93-105-41-013000
346-93-105-41-013000
1+2.39216
10+2.14412
100+1.76598
500+1.396
1000+1.19837
Increments of 1
Leadtime
2-3 weeks		QI-NDMM-WWCONN SOCKET SIP 5POS GOLDBulk346ActiveSIP5 1 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
1M-XF-JT
1M-XF-JT
400+19.0242
Increments of 400
Leadtime
2-3 weeks		TI-EU-E2CONN TRANSIST-*Active---------------
10-2513-10H
10-2513-10H
38+2.91176
Increments of 38
Leadtime
2-3 weeks		ZNH-67IN-SGCONN IC DIP SOCKET 10POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
20-7394-10
20-7394-10
10+9.25
Increments of 10
Leadtime
2-3 weeks		VC-MWU-ZZ0CONN SOCKET SIP 20POS TINBulk700 Elevator Strip-Line™ActiveSIP20 1 x 20 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
APA-422-G-K
APA-422-G-K
1+7.39216
Increments of 1
Leadtime
2-3 weeks		SR2-WK-71ADAPTOR PLUG-*Active---------------
517-83-321-19-121111
517-83-321-19-121111
20+24.398
Increments of 20
Leadtime
2-3 weeks		EA-D8RI-RI9CONN SOCKET PGA 321POS GOLDBulk517ActivePGA321 19 x 19 0.050 1.27mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
DHNYW-7E6-0G4
DHNYW-7E6-0G4
20+5.54314
Increments of 20
Leadtime
2-3 weeks		0FV-C0QJ-03CONN IC DIP SOCKET 8POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
510-87-145-15-001101
510-87-145-15-001101
98+5.73739
Increments of 98
Leadtime
2-3 weeks		R6H1Z-I0J-A5JCONN SOCKET PGA 145POS GOLDBulk510ActivePGA145 15 x 15 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
4732
4732
1+3.31373
10+2.78137
50+2.43353
100+2.31765
250+2.02796
Increments of 1
8585-JR6-UYCOVER PWR TRANS .210 ID TO-3--Active---------------
28-1508-31
28-1508-31
6+14.7173
Increments of 6
101LSY-WM-WDCONN IC DIP SOCKET 28POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
05-0503-20
05-0503-20
47+2.36024
Increments of 47
44TOX-K0-3HACONN SOCKET SIP 5POS GOLDBulk0503ActiveSIP5 1 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA , Nylon, Glass Filled-
116-83-650-41-007101
116-83-650-41-007101
96+5.23039
Increments of 96
Leadtime
2-3 weeks		RL-QH-MMCONN IC DIP SOCKET 50POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
48-6552-16
48-6552-16
54+47.4501
Increments of 54
Leadtime
2-3 weeks		H9FX-QLIY-5NACONN IC DIP SOCKET ZIF 48POSBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
14-C280-10T
14-C280-10T
37+3.04425
Increments of 37
Leadtime
2-3 weeks		V6-G8Z-CWBCONN IC DIP SOCKET 14POS TINBulkEJECT-A-DIP™ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
123-43-318-41-801000
123-43-318-41-801000
1+6.40196
10+5.41569
50+4.67745
100+4.185
250+3.69267
Increments of 1
Leadtime
2-3 weeks		Q9XL-RW4A-ZVCONN IC DIP SOCKET 18POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C