ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
116-83-420-41-001101
116-83-420-41-001101
210+2.54337
Increments of 210
Leadtime
2-3 weeks		B0O-QF-1UMCONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
15J-8LE-9G
15J-8LE-9G
Leadtime
2-3 weeks		JQ5GG-LBDA-PTCONN SOCKET PLCC 20POS TINTubeD830ObsoletePLCC20 4 x 5 0.050 1.27mm Tin-Phosphor BronzeSurface MountBoard Guide, Closed FrameSolder0.050 1.27mm Tin-Phosphor BronzePolyphenylene Sulfide PPS -50°C ~ 105°C
48-3553-11
48-3553-11
54+18.4764
Increments of 54
Leadtime
2-3 weeks		QCA-32A-H33CONN IC DIP SOCKET ZIF 48POS GLDBulk55ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing48 2 x 24 0.100 2.54mm Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold-Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
816-AG11D
816-AG11D
4800+2.31423
Increments of 4800
Leadtime
2-3 weeks		PK6VO-YCJ3-FCWCONN IC DIP SOCKET 16POS GOLDTube800ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm ---Polyester-55°C ~ 105°C
E6-V0-DT4
E6-V0-DT4
5760+3.48206
Increments of 5760
Leadtime
2-3 weeks		PRVG-RKC-NACONN SOCKET SIP 20POS GOLDBulk500ActiveSIP20 1 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium Copper--
08-3501-21
08-3501-21
23+5.17647
Increments of 23
Leadtime
2-3 weeks		0W-B1-FTCONN IC DIP SOCKET 8POS GOLDBulk501ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
40-C300-21
40-C300-21
4+22.3529
Increments of 4
Leadtime
2-3 weeks		A9-5K-NTCONN IC DIP SOCKET 40POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
104-13-636-41-780000
104-13-636-41-780000
55+13.5861
110+10.4838
275+6.7297
Increments of 55
Leadtime
2-3 weeks		AX7-PW4V-4YECONN IC DIP SOCKET 36POS GOLDTube104ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
18-3513-00
18-3513-00
40+3.92647
Increments of 40
11L3-24-5TCONN IC DIP SOCKET 18POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
382441-3
382441-3
Leadtime
2-3 weeks		OX-T5-BWJCONN SOCKET SIP 7POS TINTrayDiplomate DLObsoleteSIP7 1 x 7 0.100 2.54mm Tin-Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
02-1518-11H
02-1518-11H
200+0.551471
Increments of 200
33Q764-GSQD-TZCONN IC DIP SOCKET 2POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing2 1 x 2 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
40-6822-90C
40-6822-90C
7+13.133
Increments of 7
Leadtime
2-3 weeks		HSPY-3T-G1CONN IC DIP SOCKET 40POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
A06-LCG-T-R
A06-LCG-T-R
Leadtime
2-3 weeks		VXD3-WVX-67CONN IC DIP SOCKET 6POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold--Through HoleOpen FrameSolder0.100 2.54mm Gold--Polybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
3AF-TQ-8CR
3AF-TQ-8CR
4+18.4706
Increments of 4
Leadtime
2-3 weeks		D8-MP83-PACONN SOCKET SIP 39POS GOLDBulk511ActiveSIP39 1 x 39 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
DAHQW-03I-UT
DAHQW-03I-UT
50+10.6476
Increments of 50
Leadtime
2-3 weeks		BC000-L8H-CUCONN SOCKET PGA 299POS GOLDBulk510ActivePGA299 20 x 20 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-8844-310C
24-8844-310C
8+12.7647
Increments of 8
Leadtime
2-3 weeks		NH8-6M-8PICONN IC DIP SOCKET 24POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
03-0518-11H
03-0518-11H
148+0.75
Increments of 148
55P6DQ-CQ-IECONN SOCKET SIP 3POS GOLDBulk518ActiveSIP3 1 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
110-83-312-01-680101
110-83-312-01-680101
782+0.577323
Increments of 782
33T-LUH-W3CCONN IC DIP SOCKET 12POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 , 6 Loaded0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
16-0513-10H
16-0513-10H
38+2.95588
Increments of 38
Leadtime
2-3 weeks		N8-4R-OEDCONN SOCKET SIP 16POS GOLDBulk0513ActiveSIP16 1 x 16 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
34-7XXXX-10
34-7XXXX-10
8+12.6275
Increments of 8
22D-92-Z19CONN SOCKET SIP 34POS TINBulk700 Elevator Strip-Line™ActiveSIP34 1 x 34 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
A-CCS84-Z
A-CCS84-Z
Leadtime
2-3 weeks		DOFI-1WC-LECONN SOCKET PLCC 84POS TINTube-ObsoletePLCC84 4 x 21 0.050 1.27mm Tin150µin 3.81µm Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
116-83-632-41-001101
116-83-632-41-001101
130+4.06938
Increments of 130
Leadtime
2-3 weeks		QZD6-Y1F-HKNCONN IC DIP SOCKET 32POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
18-6501-20
18-6501-20
20+5.99608
Increments of 20
Leadtime
2-3 weeks		LET2O-ZG-67NCONN IC DIP SOCKET 18POS TINBulk501ActiveDIP, 0.6 15.24mm Row Spacing18 2 x 9 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-87-628-41-006101
116-87-628-41-006101
315+1.57034
Increments of 315
Leadtime
2-3 weeks		LUSL-639-2P5CONN IC DIP SOCKET 28POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
558-10-652M35-001101
558-10-652M35-001101
11+176.063
Increments of 11
Leadtime
2-3 weeks		0XR-6QOI-BPFPGA SOLDER TAIL 1.27MMBulk558ActivePGA652 35 x 35 0.050 1.27mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C