ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
1437522-8
1437522-8
528+47.1059
Increments of 528
Leadtime
2-3 weeks		OS-MC2-GFSTAMPED PIN-*Active---------------
2-822064-4
2-822064-4
Leadtime
2-3 weeks		RFA5P-9T5-KTCONN SOCKET PQFP 100POS TIN-LEADTube-ObsoleteQFP100 4 x 25 0.025 0.64mm Tin-Lead200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameSolder0.025 0.64mm Tin-Lead200µin 5.08µm Phosphor BronzeLiquid Crystal Polymer LCP -
AR40-HZW T
AR40-HZW T
Leadtime
2-3 weeks		KPR5D-XKJB-O2CONN IC DIP SOCKET 40POS GOLDTube-ObsoleteDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold-Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
SIP050-1X32-160BLF
SIP050-1X32-160BLF
44L-RO-5Y4CONN SOCKET SIP 32POS GOLDBulkSIP050-1xObsoleteSIP32 1 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-
116-83-642-41-008101
116-83-642-41-008101
110+4.69278
Increments of 110
Leadtime
2-3 weeks		EQ6P-3DF-A9CONN IC DIP SOCKET 42POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
APA-322-T-D
APA-322-T-D
1+4.09804
Increments of 1
55TL-TKO-S7ADAPTOR PLUG-*Active---------------
614-87-650-41-001101
614-87-650-41-001101
184+2.7484
Increments of 184
Leadtime
2-3 weeks		UBWT-TDXN-YCCONN IC DIP SOCKET 50POS GOLDBulk614ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
5-1437504-0
5-1437504-0
Leadtime
2-3 weeks		Z3B8I-LJH-UXTRANSISTOR SOCKET ASSY-*Obsolete---------------
116-83-304-41-008101
116-83-304-41-008101
1188+0.368775
Increments of 1188
Leadtime
2-3 weeks		EXK8T-1P76-CHCONN IC DIP SOCKET 4POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-81000-610C
24-81000-610C
8+12.5098
Increments of 8
Leadtime
2-3 weeks		E2-PAFC-D9CONN IC DIP SOCKET 24POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
510-83-169-13-000101
510-83-169-13-000101
48+10.8252
Increments of 48
Leadtime
2-3 weeks		VG5R7-IMK-9GCONN SOCKET PGA 169POS GOLDBulk510ActivePGA169 13 x 13 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
14-8565-310C
14-8565-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks		B0GMP-WY2O-SW6CONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
240-PRS20014-12
240-PRS20014-12
1+85.0882
Increments of 1
Leadtime
2-3 weeks		VP8-G9UL-U6KCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
1814655-2
1814655-2
303S-R8J-ZACONN SOCKET SIP 4POS TINBulk-ObsoleteSIP4 1 x 4 0.100 2.54mm Tin196.8µin 5.00µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin196.8µin 5.00µm BrassThermoplastic, Polyester-55°C ~ 125°C
1-1814655-3
1-1814655-3
Leadtime
2-3 weeks		ZJPY-ON-FICONN SOCKET SIP 20POS GOLDBulk-ObsoleteSIP20 1 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold29.5µin 0.75µm BrassThermoplastic, Polyester-55°C ~ 125°C
116-83-624-41-008101
116-83-624-41-008101
187+2.68161
Increments of 187
Leadtime
2-3 weeks		0RQ0W-VUR-45CONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
546-87-420-19-111147
546-87-420-19-111147
10+44.7422
Increments of 10
Leadtime
2-3 weeks		LZP6R-ZTKH-OFCONN SOCKET PGA 420POS GOLDBulk546ActivePGA420 19 x 19 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BronzePolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-6574-10
24-6574-10
1+11.2549
25+9.84824
100+8.72255
500+7.31569
1000+7.03431
Increments of 1
55OLYC-0D-VF2CONN IC DIP SOCKET ZIF 24POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
1109042
1109042
2+42.2206
Increments of 2
Leadtime
2-3 weeks		R5T3-IJ5X-LCT537 ZIF TEST SCKT LIVE BUG TYPE--Active---------------
116-83-320-41-002101
116-83-320-41-002101
231+2.17919
Increments of 231
Leadtime
2-3 weeks		JA2G-2F4-XQCONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
550-10-192M16-001152
550-10-192M16-001152
22+54.0856
Increments of 22
Leadtime
2-3 weeks		DE1-E0E-ULTBGA SOLDER TAILBulk550ActiveBGA192 16 x 16 0.050 1.27mm Gold10µin 0.25µm BrassThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
4609
4609
1+2.73529
Increments of 1
Leadtime
2-3 weeks		HN-UEA-LOCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 Rectangular -Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
ZX1-2UW-JP
ZX1-2UW-JP
7+38.7059
Increments of 7
Leadtime
2-3 weeks		TX-DXB-YGCONN IC DIP SOCKET ZIF 48POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
14-6503-21
14-6503-21
11+9.73797
Increments of 11
66SP-410-DK8CONN IC DIP SOCKET 14POS GOLDBulk503ActiveDIP, 0.6 15.24mm Row Spacing14 2 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
110-87-312-41-105101
110-87-312-41-105101
646+0.713882
Increments of 646
5555-88C-YG7CONN IC DIP SOCKET 12POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C