ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
8080-1G36
8080-1G36
Leadtime
2-3 weeks		R4G-K85Q-9OCONN TRANSIST-*Obsolete---------------
110-87-306-41-105191
110-87-306-41-105191
1400+0.548804
Increments of 1400
Leadtime
2-3 weeks		TEW-H0-GHLCONN IC DIP SOCKET 6POS GOLDTape & Reel TR 110ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
614-87-314-31-012101
614-87-314-31-012101
551+0.823157
Increments of 551
754754-Q8GP-TQVCONN IC DIP SOCKET 14POS GOLDBulk614ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
1109800-18
1109800-18
5+16.7216
Increments of 5
Leadtime
2-3 weeks		PY-H2-GRCONN IC DIP SOCKET 18POS GOLDBulkCorrect-A-Chip® 1109800ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleProgrammableSolder0.100 2.54mm Tin-Lead200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
09-0511-10
09-0511-10
40+4.94118
Increments of 40
Leadtime
2-3 weeks		G4-MH4-KZCONN SOCKET SIP 9POS TINBulk511ActiveSIP9 1 x 9 0.100 2.54mm Tin50µin 1.27µm Phosphor BronzeThrough Hole-Solder0.100 2.54mm Tin50µin 1.27µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
5916716-1
5916716-1
Leadtime
2-3 weeks		ZP9PD-RL4J-GC2CONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF ZIP 321 19 x 19 0.100 2.54mm Gold30µin 0.76µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm Gold30µin 0.76µm Copper AlloyThermoplastic-
ICA-628-SGG
ICA-628-SGG
1+5.29412
Increments of 1
Leadtime
2-3 weeks		EK-4WV5-3R4CONN IC DIP SOCKET 28POS GOLDBulkICAActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold30µin 0.76µm BrassPolyester, Glass Filled-55°C ~ 125°C
2-641610-1
2-641610-1
2929AS-CT3-42ACONN IC DIP SOCKET 16POS TIN-Diplomate DLObsoleteDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-Beryllium Copper--
110-99-642-41-001000
110-99-642-41-001000
54+11.5793
108+6.45488
270+3.48438
Increments of 54
2727-6P8-GQNCONN IC DIP SOCKET 42POS TINLEADTube110ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Tin-Lead200µin 5.08µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
2TG-7L-KTW
2TG-7L-KTW
187+2.68161
Increments of 187
Leadtime
2-3 weeks		AZI-CA-OC5CONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-320-41-018101
116-83-320-41-018101
315+1.60398
Increments of 315
44B-QQ5-2PCONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
66-PRS11054-12
66-PRS11054-12
2+47.201
Increments of 2
22KD-2K4J-GQICONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
SIP050-1X17-160BLF
SIP050-1X17-160BLF
Leadtime
2-3 weeks		KC9-5R-RICONN SOCKET SIP 17POS GOLDBulkSIP050-1xObsoleteSIP17 1 x 17 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-
110-87-322-41-001101
110-87-322-41-001101
630+0.720186
Increments of 630
11D8-LCTI-FKBCONN IC DIP SOCKET 22POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
13-0518-11
13-0518-11
61+1.83092
Increments of 61
Leadtime
2-3 weeks		RJ4N-YA22-H8ECONN SOCKET SIP 13POS GOLDBulk518ActiveSIP13 1 x 13 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
1825088-6
1825088-6
55W-AL3O-11YCONN IC DIP SOCKET 20POS GOLDTube500ObsoleteDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold20µin 0.51µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm --BrassThermoplastic-55°C ~ 125°C
IZO2P-ZDTB-X48
IZO2P-ZDTB-X48
13+8.35897
Increments of 13
Leadtime
2-3 weeks		NA4CG-RZ-YQWCONN SOCKET SIP 13POS GOLDBulk0503ActiveSIP13 1 x 13 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA , Nylon, Glass Filled-
OXLJ1-LDT-ML
OXLJ1-LDT-ML
1+1.66667
10+1.38431
50+1.15373
100+1.02549
250+0.897294
Increments of 1
Leadtime
2-3 weeks		0YB-OR-EV9CONN IC DIP SOCKET 20POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
10-7350-10
10-7350-10
13+8.29714
Increments of 13
Leadtime
2-3 weeks		M8Q4-EZ-6P5CONN SOCKET SIP 10POS TINBulk700 Elevator Strip-Line™ActiveSIP10 1 x 10 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-83-210-41-018101
116-83-210-41-018101
600+0.759775
Increments of 600
Leadtime
2-3 weeks		Q5N-R39-74ECONN IC DIP SOCKET 10POS GOLDTube116ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-87-223-18-094101
510-87-223-18-094101
66+8.3825
Increments of 66
Leadtime
2-3 weeks		WFQP-0JT-TQFCONN SOCKET PGA 223POS GOLDBulk510ActivePGA223 18 x 18 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
20-3518-10
20-3518-10
1+1.91176
25+1.47059
100+1.17647
500+0.941176
1000+0.852941
Increments of 1
Leadtime
2-3 weeks		SY4-ODJT-G3CONN IC DIP SOCKET 20POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
20-7590-10
20-7590-10
10+9.25
Increments of 10
Leadtime
2-3 weeks		N0X-OZO-PNCONN SOCKET SIP 20POS TINBulk700 Elevator Strip-Line™ActiveSIP20 1 x 20 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
AR40-HZL 07-TT
AR40-HZL 07-TT
66UW9-FD4-1IUCONN IC DIP SOCKET 40POS GOLDTube-ObsoleteDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
346-43-102-41-013000
346-43-102-41-013000
1+2.04902
10+1.82941
100+1.50676
500+1.19108
1000+1.02246
Increments of 1
77H-Y03A-3Q0CONN SOCKET SIP 2POS GOLDBulk346ActiveSIP2 1 x 2 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C