ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
K4Z2-0S-HK
K4Z2-0S-HK
54+13.7168
108+9.62827
270+6.0033
Increments of 54
Leadtime
2-3 weeks		BJ-DS4D-VMCONN IC DIP SOCKET 30POS GOLDTube127ActiveDIP, 0.4 10.16mm Row Spacing30 2 x 15 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.070 1.78mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
2-1814655-5
2-1814655-5
Leadtime
2-3 weeks		DXP0U-NY4-CDDCONN SOCKET SIP 32POS GOLDBulk-ObsoleteSIP32 1 x 32 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold29.5µin 0.75µm BrassThermoplastic, Polyester-55°C ~ 125°C
233-68
233-68
532+0.794118
Increments of 532
5151O-98S7-9PCONN SOCKET PLCC 68POS TINTube-ActivePLCC68 4 x 17 0.050 1.27mm Tin-Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Tin-Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
10-2823-90T
10-2823-90T
17+6.49192
Increments of 17
55HY-ARS-6U2CONN IC DIP SOCKET 10POS TINBulkVertisockets™ 800ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
44-3554-11
44-3554-11
50+17.6427
Increments of 50
11X8F-J69-VXXCONN IC DIP SOCKET ZIF 44POS GLDBulk55ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing44 2 x 22 0.100 2.54mm Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold-Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
42-6571-10
42-6571-10
6+15.7337
Increments of 6
Leadtime
2-3 weeks		END34-AZ-N9CONN IC DIP SOCKET ZIF 42POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
08-8770-310C
08-8770-310C
20+5.54314
Increments of 20
Leadtime
2-3 weeks		PO8-O7H8-K0TCONN IC DIP SOCKET 8POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
A16-LCG
A16-LCG
Leadtime
2-3 weeks		VB-94C-PFLCONN IC DIP SOCKET 16POS GOLD--ObsoleteDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold--Through HoleOpen Frame-0.100 2.54mm Gold----
550-10-652M35-001166
550-10-652M35-001166
11+127.954
Increments of 11
Leadtime
2-3 weeks		ID330-6U-NFPBGA PIN ADAPTER 1.27MM SMDBulk550ActiveBGA652 35 x 35 0.050 1.27mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
614-87-952-41-001101
614-87-952-41-001101
350+2.50092
Increments of 350
Leadtime
2-3 weeks		GM3VM-4V-ZZCONN IC DIP SOCKET 52POS GOLDBulk614ActiveDIP, 0.9 22.86mm Row Spacing52 2 x 26 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-87-328-41-003101
116-87-328-41-003101
270+1.76718
Increments of 270
6464LCI-5KF-6DRCONN IC DIP SOCKET 28POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
WMS-080Z
WMS-080Z
1+0.431373
10+0.402941
50+0.322353
100+0.308922
250+0.282078
Increments of 5000
9999-W4PI-BKCONN IC DIP SOCKET 8POS GOLDTubeWMSActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen Frame, Wash AwaySolder0.100 2.54mm Tin200µin 5.08µm Brass--40°C ~ 105°C
15-0513-11H
15-0513-11H
36+3.13235
Increments of 36
33UHKX-U4-3E1CONN SOCKET SIP 15POS GOLDBulk0513ActiveSIP15 1 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
80-PRS21027-12
80-PRS21027-12
2+67.9951
Increments of 2
Leadtime
2-3 weeks		YLAL2-UJP-E1CONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
SIP050-1X30-157BLF
SIP050-1X30-157BLF
Leadtime
2-3 weeks		A7Q8-65-9KOCONN SOCKET SIP 30POS TINBulkSIP050-1xObsoleteSIP30 1 x 30 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-
03-0513-11
03-0513-11
167+0.661794
Increments of 167
Leadtime
2-3 weeks		0CV-LN-PI3CONN SOCKET SIP 3POS GOLDBulk0513ActiveSIP3 1 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
110-44-648-41-001000
110-44-648-41-001000
1+2.83333
10+2.35098
50+1.95882
100+1.74118
250+1.52353
Increments of 1
Leadtime
2-3 weeks		GU-DXG-F69CONN IC DIP SOCKET 48POS TINTube110ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin100µin 2.54µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
510-83-114-13-062101
510-83-114-13-062101
80+7.11495
Increments of 80
Leadtime
2-3 weeks		K4U8Y-43X5-WICONN SOCKET PGA 114POS GOLDBulk510ActivePGA114 13 x 13 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-312-41-002101
116-83-312-41-002101
385+1.24222
Increments of 385
Leadtime
2-3 weeks		IPL-44-29CONN IC DIP SOCKET 12POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
146-87-428-41-036101
146-87-428-41-036101
210+2.41237
Increments of 210
Leadtime
2-3 weeks		V461C-DNJC-X3TCONN IC DIP SOCKET 28POS GOLDTube146ActiveDIP, 0.4 10.16mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
299-83-628-10-002101
299-83-628-10-002101
75+7.29882
Increments of 75
Leadtime
2-3 weeks		DHCX-DJ-3NUCONN IC DIP SOCKET 28POS GOLDTube299ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
14-8510-10
14-8510-10
50+3
Increments of 50
Leadtime
2-3 weeks		AKZ-DPAC-WBCONN IC DIP SOCKET 14POS TINBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
29-0518-10H
29-0518-10H
35+3.1986
Increments of 35
Leadtime
2-3 weeks		P5ZT-00-0SCONN SOCKET SIP 29POS GOLDBulk518ActiveSIP29 1 x 29 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
510-87-069-11-001101
510-87-069-11-001101
190+2.73019
Increments of 190
Leadtime
2-3 weeks		FZPL-5H7S-N2LCONN SOCKET PGA 69POS GOLDBulk510ActivePGA69 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
08-2501-20
08-2501-20
32+3.55147
Increments of 32
Leadtime
2-3 weeks		0F-1J82-NKSCONN IC DIP SOCKET 8POS TINBulk501ActiveDIP, 0.2 5.08mm Row Spacing8 2 x 4 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C