ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
24-6501-31
24-6501-31
15+9.68562
Increments of 15
Leadtime
2-3 weeks
PQ-GKLA-SKSCONN IC DIP SOCKET 24POS GOLDBulk501ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
2D 3Y OX
2D 3Y OX
255+1.80934
Increments of 255
22SV-WH6O-BECONN IC DIP SOCKET 24POS GOLDTube146ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FramePress Fit0.100 2.54mm Tin BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled 55°C ~ 125°C
14-8360-310C
14-8360-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks
00-RP-8S8CONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
32-6556-20
32-6556-20
8+13.549
Increments of 8
Leadtime
2-3 weeks
T6QXE-PQ-NUYCONN IC DIP SOCKET 32POS GOLDBulk6556ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled-
21-0513-10H
21-0513-10H
29+3.81609
Increments of 29
Leadtime
2-3 weeks
I5-KJ-5MCCONN SOCKET SIP 21POS GOLDBulk0513ActiveSIP21 1 x 21 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
1814655-7
1814655-7
1000+0.862853
Increments of 1000
44J-BZH-IGSIP IC SKT 10 SSR SN AU FLH ROHS-*Active---------------
APA-640-T-A
APA-640-T-A
1+4.98039
Increments of 1
33JM7-Z59L-BIXADAPTOR PLUG-*Active---------------
510-87-101-15-101101
510-87-101-15-101101
126+3.99642
Increments of 126
66I-MZN7-FJCONN SOCKET PGA 101POS GOLDBulk510ActivePGA101 15 x 15 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
532-AG10D
532-AG10D
1+10.8431
10+9.8598
50+8.87353
100+8.38059
250+7.64114
Increments of 1
Leadtime
2-3 weeks
FLO3X-SL-B8FCONN IC DIP SOCKET 32POS GOLDTube500ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleClosed FrameSolder0.100 2.54mm Gold25µin 0.63µm Copper AlloyPolyester-55°C ~ 125°C
115-83-640-41-003101
115-83-640-41-003101
200+2.61701
Increments of 200
Leadtime
2-3 weeks
RD-NZ3-ACCONN IC DIP SOCKET 40POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
20-7903-10
20-7903-10
10+9.25
Increments of 10
Leadtime
2-3 weeks
HIMT-Y3XG-OKCONN SOCKET SIP 20POS TINBulk700 Elevator Strip-Line™ActiveSIP20 1 x 20 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
36-6574-16
36-6574-16
3+33.4575
Increments of 3
Leadtime
2-3 weeks
0T5-QN-GQCONN IC DIP SOCKET ZIF 36POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
116-93-650-41-007000
116-93-650-41-007000
56+14.3046
112+11.1798
280+6.9578
Increments of 56
Leadtime
2-3 weeks
R4L-TF-MLHCONN IC DIP SOCKET 50POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
RWH9-1A-2JI
RWH9-1A-2JI
Leadtime
2-3 weeks
B2-YB9C-7ICONN IC DIP SOCKET 8POS GOLD--ObsoleteDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold--Through HoleOpen Frame-0.100 2.54mm Gold----
08-8900-310C
08-8900-310C
20+5.54314
Increments of 20
Leadtime
2-3 weeks
ST7LO-CU1-I2PCONN IC DIP SOCKET 8POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-87-424-41-007101
116-87-424-41-007101
272+1.86069
Increments of 272
Leadtime
2-3 weeks
GDX-76LK-BPCONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
10-6823-90C
10-6823-90C
19+5.95305
Increments of 19
Leadtime
2-3 weeks
CL-2RJA-PMCONN IC DIP SOCKET 10POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
08-8650-310C
08-8650-310C
20+5.54314
Increments of 20
Leadtime
2-3 weeks
Q5-H4C-VHQCONN IC DIP SOCKET 8POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
17-0508-21
17-0508-21
10+9.77647
Increments of 10
Leadtime
2-3 weeks
K7C-QRNH-8NECONN SOCKET SIP 17POS GOLDBulk508ActiveSIP17 1 x 17 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
ZRS X0 H1
ZRS X0 H1
2400+0.287549
Increments of 2400
Leadtime
2 3 weeks
R5Y-VU-O7UCONN TRANSIST TO 5 3POS GOLDBulk917ActiveTransistor, TO 53 Round GoldFlashBeryllium CopperThrough Hole Solder Tin BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled 55°C ~ 125°C
116-87-312-41-018101
116-87-312-41-018101
665+0.67752
Increments of 665
Leadtime
2-3 weeks
J6-U3Q-RYQCONN IC DIP SOCKET 12POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
127-93-648-41-003000
127-93-648-41-003000
55+15.8995
110+12.3708
275+8.30253
Increments of 55
Leadtime
2-3 weeks
KEB-DK-PQCONN IC DIP SOCKET 48POS GOLDTube127ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.070 1.78mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
APA-316-T-B
APA-316-T-B
1+3.5098
Increments of 1
77I-ENJQ-8TBADAPTOR PLUG-*Active---------------
9V-RZ2J-Y9
9V-RZ2J-Y9
11+10.0882
Increments of 11
Leadtime
2-3 weeks
NT-JAW-POCONN SOCKET SIP 14POS GOLDBulk501ActiveSIP14 1 x 14 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
514-83-388M26-001148
514-83-388M26-001148
15+94.117
Increments of 15
Leadtime
2-3 weeks
F5-3YIY-BCCONN SOCKET BGA 388POS GOLDBulk514ActiveBGA388 26 x 26 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C