ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
714-43-232-31-018000
714-43-232-31-018000
1+7.70588
10+7.15686
100+6.23902
500+5.68851
1000+5.22976
Increments of 1
Leadtime
2-3 weeks		CR-AV-E0CONN IC DIP SOCKET 32POS GOLDBulk714ActiveDIP, 0.1 2.54mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
643642-8
643642-8
Leadtime
2-3 weeks		PV-335-ZOCONN SOCKET SIP 10POS TINTubeDiplomate DLObsoleteSIP10 1 x 10 0.100 2.54mm Tin-Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
14-8550-310C
14-8550-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks		ZXA-HQ0B-4I7CONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
643650-6
643650-6
Leadtime
2-3 weeks		WKV-3UY-74CONN SOCKET SIP 18POS TINTubeDiplomate DLObsoleteSIP18 1 x 18 0.100 2.54mm Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
115-87-420-41-003101
115-87-420-41-003101
560+0.809451
Increments of 560
Leadtime
2-3 weeks		E4-OD-8KCONN IC DIP SOCKET 20POS GOLDTube115ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
04-0518-10
04-0518-10
250+0.392157
Increments of 250
66AT-WQKG-T2TCONN SOCKET SIP 4POS GOLDBulk518ActiveSIP4 1 x 4 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
24-C300-11
24-C300-11
16+6.83701
Increments of 16
77I7-P1LG-ZL2CONN IC DIP SOCKET 24POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
SIP1X07-011BLF
SIP1X07-011BLF
Leadtime
2-3 weeks		RJR0L-CC-1ACONN SOCKET SIP 7POS GOLDBulkSIP1xObsoleteSIP7 1 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled-
614-83-299-20-001112
614-83-299-20-001112
20+34.9676
Increments of 20
Leadtime
2-3 weeks		RIE6-CJ9-NMCONN SOCKET PGA 299POS GOLDBulk614ActivePGA299 20 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
115-43-314-41-003000
115-43-314-41-003000
1+1.92157
10+1.59314
50+1.32804
100+1.18039
250+1.03286
Increments of 1
Leadtime
2-3 weeks		RY-XZ69-Q7TCONN IC DIP SOCKET 14POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
28-6508-311
28-6508-311
5+16.4706
Increments of 5
Leadtime
2-3 weeks		YEQ55-G4W-I3JCONN IC DIP SOCKET 28POS GOLDBulk508ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
5-5916783-5
5-5916783-5
7272GB-LXWX-PPECONN SOCKET PGA ZIF 370POS GOLDTray-ObsoletePGA, ZIF ZIP 370 19 x 19 0.100 2.54mm Gold15µin 0.38µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm Gold15µin 0.38µm Copper AlloyLiquid Crystal Polymer LCP -
67G5M-ZKT-Y3
67G5M-ZKT-Y3
5+16.5882
Increments of 5
77PNB-JDE6-KOECONN IC DIP SOCKET 64POS GOLDBulk503ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-83-316-41-013101
116-83-316-41-013101
156+3.59879
Increments of 156
55V5MY-NTS-A91CONN IC DIP SOCKET 16POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
666-XP-CV
666-XP-CV
1+2.47059
10+2.2402
50+2.01137
100+1.9199
250+1.73702
Increments of 1
Leadtime
2-3 weeks		FM-7J-1HMCONN IC DIP SOCKET 14POS GOLDTube500ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold25µin 0.63µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold25µin 0.63µm NickelPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
28-C212-10
28-C212-10
21+5.76471
Increments of 21
Leadtime
2-3 weeks		F6HG8-XPW-0VCONN IC DIP SOCKET 28POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
26-1518-11
26-1518-11
32+3.50735
Increments of 32
Leadtime
2-3 weeks		UYX-M99H-92CONN IC DIP SOCKET 26POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing26 2 x 13 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
614-83-424-31-012101
614-83-424-31-012101
255+1.83103
Increments of 255
Leadtime
2-3 weeks		HF8-ZX7-9QXCONN IC DIP SOCKET 24POS GOLDBulk614ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
U6-TDB-8F
U6-TDB-8F
1+18.7549
10+17.4167
25+15.6298
50+15.1833
100+13.3971
Increments of 1
Leadtime
2-3 weeks		JR-4M-3ZCONN IC DIP SOCKET ZIF 24POS GLDBulkTextool™ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperConnectorClosed FramePress-Fit0.100 2.54mm Gold30µin 0.76µm Beryllium CopperPolysulfone PSU , Glass Filled-55°C ~ 125°C
16-8625-610C
16-8625-610C
12+9.32679
Increments of 12
5151-1OB-VUCONN IC DIP SOCKET 16POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing16 2 x 8 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
APA-308-T-C
APA-308-T-C
1+1.42157
Increments of 1
Leadtime
2-3 weeks		FFG-3JQM-BJ7ADAPTOR PLUG-*Active---------------
123-43-318-41-001000
123-43-318-41-001000
1+4.36274
10+3.60686
50+3.00588
100+2.70529
250+2.4949
Increments of 1
Leadtime
2-3 weeks		QD7J-OX7-VUYCONN IC DIP SOCKET 18POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
48-6553-16
48-6553-16
54+47.4501
Increments of 54
Leadtime
2-3 weeks		K8-WFT-UFWCONN IC DIP SOCKET ZIF 48POSBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
110-87-312-01-680101
110-87-312-01-680101
952+0.460784
Increments of 952
Leadtime
2-3 weeks		VYNE-LG4-N4CONN IC DIP SOCKET 12POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 , 6 Loaded0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
123-93-318-41-001000
123-93-318-41-001000
1+3.87255
10+3.20196
50+2.66863
100+2.40176
250+2.21498
Increments of 1
Leadtime
2-3 weeks		MBT-HI-0IECONN IC DIP SOCKET 18POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C