ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
4-1571552-9
4-1571552-9
1+2.92157
10+2.8049
50+2.45412
100+2.33716
250+2.04502
Increments of 1
99F6-3H7X-SGHCONN IC DIP SOCKET 28POS GOLDTube800ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold20µin 0.51µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold20µin 0.51µm CopperPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 105°C
25-7750-10
25-7750-10
9+11.9608
Increments of 9
Leadtime
2-3 weeks		N2LI-4QO-GHRCONN SOCKET SIP 25POS TINBulk700 Elevator Strip-Line™ActiveSIP25 1 x 25 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
1C0-707-HFB
1C0-707-HFB
7+13.7997
Increments of 7
Leadtime
2-3 weeks		EV4-IWI-MJ6CONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
SZ5-DI-6V
SZ5-DI-6V
2+50.2206
Increments of 2
Leadtime
2-3 weeks		KI82F-T9VQ-SJMCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
115-43-632-41-001000
115-43-632-41-001000
1+3.68627
10+3.05392
50+2.5451
100+2.29059
250+2.11243
Increments of 1
Leadtime
2-3 weeks		SW6P-I2-VXCONN IC DIP SOCKET 32POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
558-10-420M26-001101
558-10-420M26-001101
15+125.148
Increments of 15
Leadtime
2-3 weeks		WF-SYJV-S8PGA SOLDER TAIL 1.27MMBulk558ActivePGA420 26 x 26 0.050 1.27mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
01-0517-90C
01-0517-90C
278+0.352941
Increments of 278
Leadtime
2-3 weeks		DV-PKCG-ISSCONN SOCKET SIP 1POS GOLDBulk0517ActiveSIP1 1 x 1 -Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle-Solder-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
122-83-648-41-001101
122-83-648-41-001101
112+4.73337
Increments of 112
99CE-OI-4CBCONN IC DIP SOCKET 48POS GOLDTube122ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
14-8501-310C
14-8501-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks		C6BUN-NR-IM3CONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
558-10-520M31-001101
558-10-520M31-001101
13+154.945
Increments of 13
Leadtime
2-3 weeks		WF-F12J-BPMPGA SOLDER TAIL 1.27MMBulk558ActivePGA520 31 x 31 0.050 1.27mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
40-7350-10
40-7350-10
7+13.6667
Increments of 7
Leadtime
2-3 weeks		SV-6RMA-RCCONN SOCKET SIP 40POS TINBulk700 Elevator Strip-Line™ActiveSIP40 1 x 40 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
O3L-7GA7-7Q
O3L-7GA7-7Q
10+9.12353
Increments of 10
66ZF-JKI-SSCONN IC DIP SOCKET 18POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-87-628-41-006101
116-87-628-41-006101
315+1.57034
Increments of 315
Leadtime
2-3 weeks		Y5-QI-75MCONN IC DIP SOCKET 28POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
48-6518-01
48-6518-01
7+14.4314
Increments of 7
Leadtime
2-3 weeks		0M-4QDV-5D6CONN IC DIP SOCKET 48POS GOLDBulk518ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
510-83-081-12-071101
510-83-081-12-071101
102+5.05536
Increments of 102
242242D-HJ-UYCONN SOCKET PGA 81POS GOLDBulk510ActivePGA81 12 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-83-312-41-105191
110-83-312-41-105191
550+1.25651
Increments of 550
11RIDX-Y2S-IGCONN IC DIP SOCKET 12POS GOLDTape & Reel TR 110ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-87-100-13-062101
510-87-100-13-062101
128+3.9568
Increments of 128
66ZC-4FO-T5DCONN SOCKET PGA 100POS GOLDBulk510ActivePGA100 13 x 13 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
37-PGM10012-11
37-PGM10012-11
8+13.3922
Increments of 8
4949FG-8JN-C2CONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
APA-640-G-C
APA-640-G-C
1+14.1961
Increments of 1
Leadtime
2-3 weeks		NEF-YWD-D73ADAPTOR PLUG-*Active---------------
12-0503-21
12-0503-21
14+7.72059
Increments of 14
Leadtime
2-3 weeks		Z9-E1TX-953CONN SOCKET SIP 12POS GOLDBulk0503ActiveSIP12 1 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA , Nylon, Glass Filled-
28-3513-10T
28-3513-10T
36+3.79412
Increments of 36
Leadtime
2-3 weeks		GRRG-B8X7-DFRCONN IC DIP SOCKET 28POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
121-83-318-41-001101
121-83-318-41-001101
276+1.74041
Increments of 276
11JVF7-1J-7YCONN IC DIP SOCKET 18POS GOLDTube121ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
02-0513-10
02-0513-10
313+0.313725
Increments of 313
Leadtime
2-3 weeks		R6UN-9WP-HQECONN SOCKET SIP 2POS GOLDBulk0513ActiveSIP2 1 x 2 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
40-8625-610C
40-8625-610C
5+15.9118
Increments of 5
Leadtime
2-3 weeks		C66F-AS-Z2CONN IC DIP SOCKET 40POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
24-3518-101H
24-3518-101H
22+5.41176
Increments of 22
Leadtime
2-3 weeks		BK2-BA64-NACONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-