ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
346-43-116-41-013000
346-43-116-41-013000
1+4.01961
10+3.59706
100+2.96206
500+2.34147
1000+2.00999
Increments of 1
Leadtime
2-3 weeks		PJXA5-8P-5Y0CONN SOCKET SIP 16POS GOLDBulk346ActiveSIP16 1 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
06-0501-31
06-0501-31
17+6.59976
Increments of 17
22Y8-O5K-BZCONN SOCKET SIP 6POS GOLDBulk501ActiveSIP6 1 x 6 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
18-811250-610C
18-811250-610C
10+9.3049
Increments of 10
Leadtime
2-3 weeks		X9O-UKP-0TCONN IC DIP SOCKET 18POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
114-93-650-41-117000
114-93-650-41-117000
56+13.0215
112+8.91098
280+5.49576
Increments of 56
Leadtime
2-3 weeks		EQ-KYL-AWLCONN IC DIP SOCKET 50POS GOLDTube114ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
714-43-162-31-018000
714-43-162-31-018000
1+12.3039
10+11.4284
100+9.96353
500+9.08439
1000+8.35178
Increments of 1
66S-SL-WXKCONN SOCKET SIP 62POS GOLDBulk714ActiveSIP62 1 x 62 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
25-0501-30
25-0501-30
18+9.28649
Increments of 18
Leadtime
2-3 weeks		CA242-AGL-CFPCONN SOCKET SIP 25POS TINBulk501ActiveSIP25 1 x 25 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
122-87-316-41-001101
122-87-316-41-001101
416+1.18258
Increments of 416
Leadtime
2-3 weeks		SL5C-AH67-88CONN IC DIP SOCKET 16POS GOLDTube122ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
614-83-964-31-012101
614-83-964-31-012101
90+5.58039
Increments of 90
Leadtime
2-3 weeks		L8FZ-VTT-Q41CONN IC DIP SOCKET 64POS GOLDBulk614ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-93-324-41-001000
110-93-324-41-001000
1+2.45098
10+2.03333
50+1.69412
100+1.50588
250+1.31765
Increments of 1
Leadtime
2-3 weeks		WN2-U5-2RCONN IC DIP SOCKET 24POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
14-6621-30
14-6621-30
10+9.52255
Increments of 10
88WWA9-PLIJ-66CONN IC DIP SOCKET 14POS TINBulk6621ActiveDIP, 0.6 15.24mm Row Spacing14 2 x 7 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Bottom Entry; Through BoardClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-87-422-41-004101
116-87-422-41-004101
190+2.87002
Increments of 190
3838-NJF-EDGCONN IC DIP SOCKET 22POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
242-1293-00-0602J
242-1293-00-0602J
1+25.3333
10+22.8725
25+21.9137
50+20.5441
100+19.8593
Increments of 1
Leadtime
2-3 weeks		ECMUN-L3R-Q57CONN IC DIP SOCKET ZIF 42POS GLDBulkTextool™ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing42 2 x 21 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperConnectorClosed FramePress-Fit0.100 2.54mm Gold30µin 0.76µm Beryllium CopperPolysulfone PSU , Glass Filled-55°C ~ 125°C
317-43-108-41-005000
317-43-108-41-005000
1+8.89216
10+7.52745
50+6.50098
100+5.81667
250+5.13235
Increments of 1
Leadtime
2-3 weeks		S2U-RGUG-3BCONN SOCKET 8POS .070 STR GOLDBulk317ActiveSIP8 1 x 8 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Solder0.070 1.78mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
04-0518-11H
04-0518-11H
117+0.948549
Increments of 117
55WN-NCX-KLCONN SOCKET SIP 4POS GOLDBulk518ActiveSIP4 1 x 4 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
116-87-432-41-018101
116-87-432-41-018101
260+1.75668
Increments of 260
Leadtime
2-3 weeks		OM9VX-2MG-1RCONN IC DIP SOCKET 32POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing32 2 x 16 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
34-0518-10
34-0518-10
36+3.13235
Increments of 36
Leadtime
2-3 weeks		KD9N-9G-5QLCONN SOCKET SIP 34POS GOLDBulk518ActiveSIP34 1 x 34 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
D0840-42
D0840-42
840+3.38265
Increments of 840
4040DB-56-9QCONN IC DIP SOCKET 40POS GOLDBulkD0ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin196.8µin 5.00µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Glass Filled-55°C ~ 125°C
3-1571586-2
3-1571586-2
1200+4.62714
Increments of 1200
Leadtime
2-3 weeks		RY-C8-46CONN IC DIP SOCKET 40POS GOLDTube800ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold25µin 0.63µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold25µin 0.63µm CopperPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 105°C
123-93-322-41-001000
123-93-322-41-001000
54+11.8402
108+7.79557
270+4.60294
Increments of 54
Leadtime
2-3 weeks		CMJ-Y1-8W0CONN IC DIP SOCKET 22POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
20-6822-90C
20-6822-90C
11+10.0882
Increments of 11
1515O-VQ-45LCONN IC DIP SOCKET 20POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
22-6823-90C
22-6823-90C
11+9.42959
Increments of 11
Leadtime
2-3 weeks		WHU-OYL9-RXCONN IC DIP SOCKET 22POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
2-5916783-5
2-5916783-5
1350+5.50861
Increments of 1350
Leadtime
2-3 weeks		RC9-4P-GQCONN SOCKET PGA ZIF 370POS GOLDTray-ActivePGA, ZIF ZIP 370 19 x 19 0.100 2.54mm Gold15µin 0.38µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm Gold15µin 0.38µm Copper AlloyLiquid Crystal Polymer LCP -
612-87-424-41-001101
612-87-424-41-001101
714+1.19316
Increments of 714
707-7R-N9CONN IC DIP SOCKET 24POS GOLDBulk612ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
917-87-108-41-053101
917-87-108-41-053101
490+0.974333
Increments of 490
Leadtime
2-3 weeks		FQLY8-QK-7PCONN TRANSIST TO-5 8POS GOLDBulk917ActiveTransistor, TO-58 Round -GoldFlashBeryllium CopperThrough Hole-Solder-Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
299-87-308-10-001101
299-87-308-10-001101
371+1.34864
Increments of 371
4444U-RH-C1CONN IC DIP SOCKET 8POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm GoldFlashBeryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C