ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
8080-1G37
8080-1G37
55E-Q0IL-HGCONN TRANSIST-*Obsolete---------------
31-0518-10
31-0518-10
39+2.86777
Increments of 39
44O9U-ATD-2FCONN SOCKET SIP 31POS GOLDBulk518ActiveSIP31 1 x 31 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
14-3513-10
14-3513-10
75+1.67647
Increments of 75
Leadtime
2-3 weeks		ZV-TED6-M5CONN IC DIP SOCKET 14POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
2-641600-4
2-641600-4
Leadtime
2-3 weeks		Z93X-YR-UJUCONN IC DIP SOCKET 16POS GOLDTubeDiplomate DLObsoleteDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
10-0501-30
10-0501-30
24+7.22549
Increments of 24
Leadtime
2-3 weeks		OBR0-KGKH-Z2YCONN SOCKET SIP 10POS TINBulk501ActiveSIP10 1 x 10 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
510-87-114-13-062101
510-87-114-13-062101
112+4.51076
Increments of 112
Leadtime
2-3 weeks		WTKWS-CF-HUCONN SOCKET PGA 114POS GOLDBulk510ActivePGA114 13 x 13 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
816-AG12D-ES-LF
816-AG12D-ES-LF
1+2.62745
10+2.38627
50+2.14235
100+2.045
250+1.8502
Increments of 1
88LWAE-8QX-CYCONN IC DIP SOCKET 16POS TINTube800ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-CopperPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 105°C
2AV-KEY-OH
2AV-KEY-OH
210+2.443
Increments of 210
Leadtime
2-3 weeks		GMR6-I8H-KNCONN IC DIP SOCKET 40POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-87-428-41-006101
116-87-428-41-006101
315+1.57034
Increments of 315
Leadtime
2-3 weeks		XBE2-1KJ-QZZCONN IC DIP SOCKET 28POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
AR 32 HZL-TT
AR 32 HZL-TT
14+1.37815
Increments of 14
Leadtime
2-3 weeks		RQ33-C6KN-43TIC SOCKET 32 PIN MACH CONT-*Active---------------
26-6822-90C
26-6822-90C
10+9.70392
Increments of 10
Leadtime
2-3 weeks		MIY-7F5X-N4CONN IC DIP SOCKET 26POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing26 2 x 13 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
TW6V-HN5-8B
TW6V-HN5-8B
44UB-JEVI-IR5CONN IC DIP SOCKET 28POS TINTubeDiplomate DLObsoleteDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin-Phosphor BronzeThermoplastic-55°C ~ 105°C
25-0518-10
25-0518-10
47+2.36024
Increments of 47
Leadtime
2-3 weeks		J7-5N-AZCONN SOCKET SIP 25POS GOLDBulk518ActiveSIP25 1 x 25 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
608-CG1T
608-CG1T
900+5.01444
Increments of 900
Leadtime
2-3 weeks		M99-UEN9-HARADAPTER PLUG ASSY-*Active---------------
18-6810-90TWR
18-6810-90TWR
10+9.84902
Increments of 10
Leadtime
2-3 weeks		XSV-PO-3ZCONN IC DIP SOCKET 18POS TINBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing18 2 x 9 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
MVAS-114-ZSGT-13
MVAS-114-ZSGT-13
500+5.69814
Increments of 500
44J-E8-G57CONN SOCKET PGA 114POS GOLDBulkMVASActivePGA114 13 x 13 0.100 2.54mm Gold30µin 0.76µm -Through HoleOpen FrameSolder0.100 2.54mm Gold30µin 0.76µm ---
300-PLS20006-12
300-PLS20006-12
1+91.6569
Increments of 1
Leadtime
2-3 weeks		CK0-5M6W-0TCONN SOCKET PGA ZIF GOLDBulkPLSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
514-87-356M26-001148
514-87-356M26-001148
15+70.1091
Increments of 15
Leadtime
2-3 weeks		WK-SMJ4-T3DCONN SOCKET BGA 356POS GOLDBulk514ActiveBGA356 26 x 26 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
14-81000-310C
14-81000-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks		RR5-OTP7-OCCONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
110-13-432-41-001000
110-13-432-41-001000
60+12.2709
120+8.21503
300+4.97206
Increments of 60
22OB00-HH07-FKCCONN IC DIP SOCKET 32POS GOLDTube110ActiveDIP, 0.4 10.16mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
4820-3000-CP
4820-3000-CP
1+0.598039
10+0.558824
25+0.503137
50+0.447059
100+0.428431
Increments of 1
Leadtime
2-3 weeks		XO-HIZ6-99SCONN IC DIP SOCKET 20POS TINTube4800ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Tin35µin 0.90µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin35µin 0.90µm Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
14-8860-310C
14-8860-310C
13+8.13272
Increments of 13
88A-G6DE-7ERCONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
25-0518-10H
25-0518-10H
40+2.77941
Increments of 40
3333-TVG-LNCONN SOCKET SIP 25POS GOLDBulk518ActiveSIP25 1 x 25 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
110-87-320-41-001151
110-87-320-41-001151
700+0.654647
Increments of 700
Leadtime
2-3 weeks		SSZTZ-XLK-8N9CONN IC DIP SOCKET 20POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen Frame, No Center BarSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
346-93-119-41-013000
346-93-119-41-013000
1+4.31373
10+3.86078
100+3.17922
500+2.51312
1000+2.15734
Increments of 1
Leadtime
2-3 weeks		EQSTF-8YMM-9UOCONN SOCKET SIP 19POS GOLDBulk346ActiveSIP19 1 x 19 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C