ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
115-83-308-41-003101
115-83-308-41-003101
988+0.457971
Increments of 988
55B5E8-WT-3LCONN IC DIP SOCKET 8POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-640-41-008101
116-83-640-41-008101
120+4.4692
Increments of 120
55T-RFYR-6OICONN IC DIP SOCKET 40POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
12-3503-21
12-3503-21
13+8.33861
Increments of 13
Leadtime
2-3 weeks		L17-08O9-2KCONN IC DIP SOCKET 12POS GOLDBulk503ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
346-43-142-41-013000
346-43-142-41-013000
1+7.68627
10+6.87843
100+5.6648
500+4.47788
1000+3.84396
Increments of 1
Leadtime
2-3 weeks		XR-FTD-V1CONN SOCKET SIP 42POS GOLDBulk346ActiveSIP42 1 x 42 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
48X-OEZ5-J7J
48X-OEZ5-J7J
Leadtime
2-3 weeks		DB-30KM-01BCONN IC DIP SOCKET 28POS GOLDTubeDiplomate DLObsoleteDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
34-7550-10
34-7550-10
8+12.6275
Increments of 8
Leadtime
2-3 weeks		M7-1P60-WYCONN SOCKET SIP 34POS TINBulk700 Elevator Strip-Line™ActiveSIP34 1 x 34 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
122-83-640-41-001101
122-83-640-41-001101
130+3.94465
Increments of 130
Leadtime
2-3 weeks		ODP-XGEI-RVCONN IC DIP SOCKET 40POS GOLDTube122ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
68-PGM11033-10H
68-PGM11033-10H
9+12.0196
Increments of 9
Leadtime
2-3 weeks		F9CR-3GCO-YSJCONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
517-87-411-20-111111
517-87-411-20-111111
20+21.7069
Increments of 20
Leadtime
2-3 weeks		RFLK-C1U-NDCONN SOCKET PGA 411POS GOLDBulk517ActivePGA411 20 x 20 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-87-142-15-081101
510-87-142-15-081101
98+5.61865
Increments of 98
Leadtime
2-3 weeks		PML0-5UE-TD0CONN SOCKET PGA 142POS GOLDBulk510ActivePGA142 15 x 15 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
F9-91B-0PQ
F9-91B-0PQ
80+11.2446
160+7.32709
560+2.91912
Increments of 80
Leadtime
2-3 weeks		YRFGY-J8R-TBGCONN IC DIP SOCKET 10POS GOLDTube126ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
18-8465-310C
18-8465-310C
10+9.12353
Increments of 10
Leadtime
2-3 weeks		YIKS-ZZDQ-72CONN IC DIP SOCKET 18POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
410-83-228-10-002101
410-83-228-10-002101
600+1.39091
Increments of 600
55B-JMX-6UCONN ZIG-ZAG 28POS GOLDTube410ActiveZig-Zag, Right Stackable28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
ICO-316-SGT
ICO-316-SGT
1+2.2549
Increments of 1
Leadtime
2-3 weeks		QFSB-RPM-883LOW PROFILE DIP SOCKETS-*Active---------------
VL-JXKW-XT
VL-JXKW-XT
841+0.531127
Increments of 841
Leadtime
2-3 weeks		BTJ-7SO1-9E7CONN IC DIP SOCKET 14POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
514-83-256M16-000148
514-83-256M16-000148
24+62.098
Increments of 24
11ZD7-ILJ2-0CFCONN SOCKET BGA 256POS GOLDBulk514ActiveBGA256 16 x 16 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
20-7354-10
20-7354-10
10+9.25
Increments of 10
Leadtime
2-3 weeks		QT1-ECC-97CONN SOCKET SIP 20POS TINBulk700 Elevator Strip-Line™ActiveSIP20 1 x 20 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
614-87-325-18-111144
614-87-325-18-111144
11+50.0668
Increments of 11
Leadtime
2-3 weeks		PBI-YE-LCCONN SOCKET PGA 325POS GOLDBulk614ActivePGA325 18 x 18 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
AW127-14 Z-T
AW127-14 Z-T
200+0.640588
Increments of 200
Leadtime
2-3 weeks		T9RST-R5-TJSOCKET 14 CONTACTS SINGLE ROW--Active---------------
16-71000-10
16-71000-10
11+10.2736
Increments of 11
Leadtime
2-3 weeks		W9MY-6GRU-BRXCONN SOCKET SIP 16POS TINBulk700 Elevator Strip-Line™ActiveSIP16 1 x 16 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-93-314-41-007000
116-93-314-41-007000
56+10.9205
112+7.01488
280+3.74412
Increments of 56
Leadtime
2-3 weeks		KFYA8-FX-S7BCONN IC DIP SOCKET 14POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
APA-628-T-C
APA-628-T-C
1+4.63725
Increments of 1
Leadtime
2-3 weeks		IISO4-XDK-AVADAPTOR PLUG-*Active---------------
16-3508-211
16-3508-211
8+13.4118
Increments of 8
55Q-D9FU-WZ2CONN IC DIP SOCKET 16POS GOLDBulk508ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
40-9503-21
40-9503-21
4+20.25
Increments of 4
44X-XA-ZPRCONN IC DIP SOCKET 40POS GOLDBulk503ActiveDIP, 0.9 22.86mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
510-83-068-09-001101
510-83-068-09-001101
115+4.46743
Increments of 115
Leadtime
2-3 weeks		BU-G16-R00CONN SOCKET PGA 68POS GOLDBulk510ActivePGA68 9 x 9 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C