ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
163-PGM15067-10T
163-PGM15067-10T
2+45.951
Increments of 2
Leadtime
2-3 weeks		0W5Z-BOU-EXCONN SOCKET PGA TINBulkPGMActivePGA-0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
20-3508-20
20-3508-20
12+8.95588
Increments of 12
Leadtime
2-3 weeks		OK31-MVL-XBCONN IC DIP SOCKET 20POS GOLDBulk508ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
18-6823-90T
18-6823-90T
12+8.70915
Increments of 12
Leadtime
2-3 weeks		RQ4-685-4VCONN IC DIP SOCKET 18POS TINBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing18 2 x 9 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
346-43-159-41-013000
346-43-159-41-013000
1+10.0882
10+9.02451
100+7.43196
500+5.87476
1000+5.04311
Increments of 1
Leadtime
2-3 weeks		U4F2-ICLL-N7OCONN SOCKET SIP 59POS GOLDBulk346ActiveSIP59 1 x 59 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
110-87-314-41-005101
110-87-314-41-005101
841+0.531127
Increments of 841
55P3-RIKO-CXCONN IC DIP SOCKET 14POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
117-43-620-41-005000
117-43-620-41-005000
420+2.01153
Increments of 420
Leadtime
2-3 weeks		D3-ZLL-UNCONN IC DIP SOCKET 20POS GOLDTube117ActiveDIP, 0.6 15.24mm Row Spacing20 2 x 10 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
ICO-316-SST
ICO-316-SST
1+1.86275
Increments of 1
Leadtime
2-3 weeks		TR97I-V7-4AUCONN IC DIP SOCKET 16POS GOLDBulkICOActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
22-6511-10
22-6511-10
26+4.32353
Increments of 26
Leadtime
2-3 weeks		DA-NR-GOCONN IC DIP SOCKET 22POS TINBulk511ActiveDIP, 0.6 15.24mm Row Spacing22 2 x 11 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
AR18-HZW T
AR18-HZW T
849849-38IM-Z29CONN IC DIP SOCKET 18POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold-Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
346-43-120-41-013000
346-43-120-41-013000
1+4.58823
10+4.10196
100+3.37784
500+2.67014
1000+2.29214
Increments of 1
11SW-D3BC-XPNCONN SOCKET SIP 20POS GOLDBulk346ActiveSIP20 1 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
18-1518-10H
18-1518-10H
55+2.02941
Increments of 55
Leadtime
2-3 weeks		ZJJBH-O3B-Z0CONN IC DIP SOCKET 18POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
123-93-320-41-001000
123-93-320-41-001000
1+4.12745
10+3.41667
50+2.84706
100+2.56235
250+2.36306
Increments of 1
Leadtime
2-3 weeks		FY-MCWI-GSSCONN IC DIP SOCKET 20POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
16-6810-90T
16-6810-90T
11+9.47059
Increments of 11
Leadtime
2-3 weeks		KWD-XF1J-VKCONN IC DIP SOCKET 16POS TINBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing16 2 x 8 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
168-PLS17011-12
168-PLS17011-12
2+66.9265
Increments of 2
66K00I-RK-XWCONN SOCKET PGA ZIF GOLDBulkPLSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
A06-LCG-T
A06-LCG-T
Leadtime
2-3 weeks		LZ-2QKE-8D7CONN IC DIP SOCKET 6POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold--Through HoleOpen FrameSolder0.100 2.54mm Gold--Polybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
AR08-HZL 01-TT
AR08-HZL 01-TT
Leadtime
2-3 weeks		H257C-MZ-D23CONN IC DIP SOCKET 8POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
80-PRL15072-12
80-PRL15072-12
2+52.9265
Increments of 2
Leadtime
2-3 weeks		PCTM-NPSD-4YCONN SOCKET PGA ZIF GOLDBulkPRLActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
110-43-210-10-002000
110-43-210-10-002000
1+2.20588
10+1.83431
50+1.52863
100+1.35882
250+1.18898
Increments of 1
Leadtime
2-3 weeks		XGN-Q23P-XSGCONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 , 8 Loaded0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
16-1518-10H
16-1518-10H
61+1.83092
Increments of 61
Leadtime
2-3 weeks		MT3SQ-BLKD-7PCONN IC DIP SOCKET 16POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing16 2 x 8 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
3-1437537-0
3-1437537-0
Leadtime
2-3 weeks		E6Z-U4W-WW4CONN IC DIP SOCKET 14POS TINLEADTube800ObsoleteDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin-Lead-Copper AlloySurface MountOpen FrameSolder0.100 2.54mm ---Polyester-55°C ~ 105°C
04-7375-10
04-7375-10
60+4.80392
Increments of 60
Leadtime
2-3 weeks		IVV2-MB8-QC1CONN SOCKET SIP 4POS TINBulk700 Elevator Strip-Line™ActiveSIP4 1 x 4 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
40-0518-11H
40-0518-11H
15+7.28824
Increments of 15
Leadtime
2-3 weeks		YS1-2Q-56WCONN SOCKET SIP 40POS GOLDBulk518ActiveSIP40 1 x 40 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
299-83-612-10-002101
299-83-612-10-002101
170+3.29262
Increments of 170
66AJ-5O-P5CONN IC DIP SOCKET 12POS GOLDTube299ActiveDIP, 0.6 15.24mm Row Spacing12 2 x 6 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
210-43-314-41-001000
210-43-314-41-001000
1+1.64706
10+1.37157
50+1.14275
100+1.01569
250+0.888745
Increments of 1
Leadtime
2-3 weeks		ID-9IMR-Q4CONN IC DIP SOCKET 14POS GOLDTube210ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
317-43-116-41-005000
317-43-116-41-005000
1+8.94118
10+8.16078
50+6.99529
100+6.21804
250+5.6351
Increments of 1
Leadtime
2-3 weeks		A0O-B9Q-3FCONN SOCKET 16POS .070 STR GOLDBulk317ActiveSIP16 1 x 16 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Solder0.070 1.78mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C