ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
IZO2P-ZDTB-X48
IZO2P-ZDTB-X48
13+8.35897
Increments of 13
Leadtime
2-3 weeks		Z7Z1-GJM-NNCONN SOCKET SIP 13POS GOLDBulk0503ActiveSIP13 1 x 13 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA , Nylon, Glass Filled-
111-93-328-41-001000
111-93-328-41-001000
56+11.0868
112+7.28624
280+3.95735
Increments of 56
Leadtime
2-3 weeks		ZAE9-HI1-6SCONN IC DIP SOCKET 28POS GOLDTube111ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
110-87-642-41-005101
110-87-642-41-005101
279+1.72995
Increments of 279
22X52-6QO-W3CONN IC DIP SOCKET 42POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
643640-8
643640-8
Leadtime
2-3 weeks		LTN-9TDF-EGCONN SOCKET SIP 8POS TINTubeDiplomate DLObsoleteSIP8 1 x 8 0.100 2.54mm Tin-Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
236-6225-50-0602
236-6225-50-0602
20+40
Increments of 20
66D-38N-54SOCKET ZIP IN-LINE 36POS--Active---------------
PD7-O0BQ-6GO
PD7-O0BQ-6GO
299+1.59161
Increments of 299
Leadtime
2-3 weeks		HM-L1L-P7CONN IC DIP SOCKET 18POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-516-11S
24-516-11S
15+9.84836
Increments of 15
11HQ-7F7-781CONN IC DIP SOCKET ZIF 24POS GLDBulk516ActiveDIP, ZIF ZIP 24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolyamide PA46 , Nylon 4 6, Glass Filled-
239-5605-52-0602
239-5605-52-0602
20+34.8574
Increments of 20
Leadtime
2-3 weeks		PL1-7IW-47WCONN SOCKET 39POS ZIP STRIP--Active---------------
06-6513-10H
06-6513-10H
47+2.36024
Increments of 47
Leadtime
2-3 weeks		FU-LE-D5CONN IC DIP SOCKET 6POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.6 15.24mm Row Spacing6 2 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
16-3511-10WR
16-3511-10WR
69+2.01961
Increments of 69
Leadtime
2-3 weeks		K02C-LACP-TERCONN IC DIP SOCKET 16POS TINBulk511ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
510-87-241-18-071101
510-87-241-18-071101
55+9.059
Increments of 55
Leadtime
2-3 weeks		SSQC-GK-KIGCONN SOCKET PGA 241POS GOLDBulk510ActivePGA241 18 x 18 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
18-3503-31
18-3503-31
9+11.9608
Increments of 9
44EGP-72-A7CONN IC DIP SOCKET 18POS GOLDBulk503ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
08-8900-310C
08-8900-310C
20+5.54314
Increments of 20
88F4X-43TC-KKYCONN IC DIP SOCKET 8POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
7-1437537-6
7-1437537-6
Leadtime
2-3 weeks		PCZ4-HI-6JJCONN IC DIP SOCKET 20POS GOLDTube800ObsoleteDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm ---Polyester-55°C ~ 105°C
510-87-209-17-062101
510-87-209-17-062101
72+7.85607
Increments of 72
Leadtime
2-3 weeks		0P-87XI-YLCONN SOCKET PGA 209POS GOLDBulk510ActivePGA209 17 x 17 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
30-0508-20
30-0508-20
11+10.1702
Increments of 11
Leadtime
2-3 weeks		FGN2-LOWC-915CONN SOCKET SIP 30POS GOLDBulk508ActiveSIP30 1 x 30 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
820-AG11D
820-AG11D
3840+3.0685
Increments of 3840
23023-RQ-DSCONN IC DIP SOCKET 20POS GOLDTube800ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
540-99-052-17-400000
540-99-052-17-400000
Leadtime
2-3 weeks		CN-V9K-YH6CONN SOCKET PLCC 52POS TIN-LEADTube540ObsoletePLCC52 4 x 13 0.050 1.27mm Tin-Lead200µin 5.08µm -Surface MountClosed FrameSolder0.050 1.27mm Tin-Lead200µin 5.08µm -Polyphenylene Sulfide PPS -
22-81250-610C
22-81250-610C
9+11.7059
Increments of 9
22O-LG-MZRCONN IC DIP SOCKET 22POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
40-C300-21
40-C300-21
4+22.3529
Increments of 4
Leadtime
2-3 weeks		WIDS-RYQN-M3CONN IC DIP SOCKET 40POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
346-93-151-41-013000
346-93-151-41-013000
1+8.69608
10+7.78333
100+6.40941
500+5.06651
1000+4.34927
Increments of 1
Leadtime
2-3 weeks		IU-DVD-L6RCONN SOCKET SIP 51POS GOLDBulk346ActiveSIP51 1 x 51 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
A20-LCG
A20-LCG
Leadtime
2-3 weeks		WF-FL-KSRCONN IC DIP SOCKET 20POS GOLD--ObsoleteDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold--Through HoleOpen Frame-0.100 2.54mm Gold----
116-93-328-41-001000
116-93-328-41-001000
56+13.2931
112+9.2149
280+5.65357
Increments of 56
Leadtime
2-3 weeks		S95Q-NWDE-UVCONN IC DIP SOCKET 28POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
08-8300-210C
08-8300-210C
18+6.23312
Increments of 18
66V57-GQ3D-2Y6CONN IC DIP SOCKET 8POS GOLDBulk8ActiveDIP, 0.2 5.08mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
DWGF-5Z-KM
DWGF-5Z-KM
3+29.4869
Increments of 3
Leadtime
2-3 weeks		J6MQ-HH-2JZCONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C