ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
APA-318-G-K
APA-318-G-K
1+6.04902
Increments of 1
99FI95-LI-4JADAPTOR PLUG-*Active---------------
ICO-326-S8-T
ICO-326-S8-T
88SC9F-E5O-GPCONN IC DIP SOCKET 32POS TINTubeICOObsoleteDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin-Phosphor BronzePolyester, Glass Filled-65°C ~ 105°C
510-87-184-17-081101
510-87-184-17-081101
72+6.91639
Increments of 72
Leadtime
2-3 weeks		CE7I-QE-8ROCONN SOCKET PGA 184POS GOLDBulk510ActivePGA184 17 x 17 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
104-13-308-41-770000
104-13-308-41-770000
50+11.402
250+3.26306
500+2.06618
Increments of 50
Leadtime
2-3 weeks		O6-C1US-KZOCONN IC DIP SOCKET 8POS GOLDTube104ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
SIP1X20-011BLF
SIP1X20-011BLF
Leadtime
2-3 weeks		WXHC-RF5D-N7CONN SOCKET SIP 20POS GOLDBulkSIP1xObsoleteSIP20 1 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled-
714-43-264-31-018000
714-43-264-31-018000
1+11.7549
10+10.9167
100+9.51667
500+8.67696
1000+7.97721
Increments of 1
Leadtime
2-3 weeks		GP-8X2D-K6MCONN IC DIP SOCKET 64POS GOLDBulk714ActiveDIP, 0.1 2.54mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
Z8R-AZC2-6M
Z8R-AZC2-6M
1+10.3725
10+9.27647
100+7.6398
500+6.03912
1000+5.18418
Increments of 1
Leadtime
2-3 weeks		A4EML-S51-JNVCONN SOCKET SIP 61POS GOLDBulk346ActiveSIP61 1 x 61 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
KQ33O-HWSH-GG3
KQ33O-HWSH-GG3
190+2.65759
Increments of 190
Leadtime
2-3 weeks		LQ8A7-JSWZ-BXFCONN IC DIP SOCKET 40POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
14-822-90
14-822-90
14+7.53501
Increments of 14
Leadtime
2-3 weeks		H57-H7E-VLSCONN IC DIP SOCKET 14POS GOLDBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
48-6508-20
48-6508-20
5+15.0745
Increments of 5
Leadtime
2-3 weeks		0L5F-EYOG-NNCONN IC DIP SOCKET 48POS GOLDBulk508ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
714-43-208-31-018000
714-43-208-31-018000
1+4.02941
10+3.73922
100+3.25941
500+2.97182
1000+2.73216
Increments of 1
Leadtime
2-3 weeks		O8-ZZ-COFCONN IC DIP SOCKET 8POS GOLDBulk714ActiveDIP, 0.1 2.54mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
30-PLS16022-12
30-PLS16022-12
2+51.4167
Increments of 2
22EY8-UHT2-1VCONN SOCKET PGA ZIF GOLDBulkPLSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
130-024-050
130-024-050
Leadtime
2-3 weeks		PH8-7J7-AICONN IC DIP SOCKET 24POS GOLDBulk100ObsoleteDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold8µin 0.20µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm GoldFlashBrassPolyphenylene Sulfide PPS , Glass Filled-65°C ~ 125°C
10-6503-31
10-6503-31
15+7.41961
Increments of 15
Leadtime
2-3 weeks		AT7V8-SOC1-SSCONN IC DIP SOCKET 10POS GOLDBulk503ActiveDIP, 0.6 15.24mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
16-C280-11
16-C280-11
22+5.41176
Increments of 22
Leadtime
2-3 weeks		VPBL7-CBQV-6LCONN IC DIP SOCKET 16POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
346-93-134-41-013000
346-93-134-41-013000
1+6.37255
10+5.69902
100+4.69343
500+3.71002
1000+3.1848
Increments of 1
Leadtime
2-3 weeks		DMWG-9LG-4XOCONN SOCKET SIP 34POS GOLDBulk346ActiveSIP34 1 x 34 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
ENPRR-BMW-MK
ENPRR-BMW-MK
1+2.7549
10+2.29216
50+1.91039
100+1.69804
250+1.4858
Increments of 1
Leadtime
2-3 weeks		FQ5-IXFP-59BCONN SOCKET PLCC 44POS TINTube540ActivePLCC44 4 x 11 0.050 1.27mm Tin150µin 3.81µm -Surface MountClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm -Polyphenylene Sulfide PPS -
550-80-132-14-071101
550-80-132-14-071101
45+13.1224
Increments of 45
Leadtime
2-3 weeks		C6XJH-WQY-HQPGA SOLDER TAILBulk550ActivePGA132 14 x 14 0.100 2.54mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
15J-8LE-9G
15J-8LE-9G
Leadtime
2-3 weeks		OO-OH6-B4CONN SOCKET PLCC 20POS TINTubeD830ObsoletePLCC20 4 x 5 0.050 1.27mm Tin-Phosphor BronzeSurface MountBoard Guide, Closed FrameSolder0.050 1.27mm Tin-Phosphor BronzePolyphenylene Sulfide PPS -50°C ~ 105°C
20-0508-30
20-0508-30
16+7.16054
Increments of 16
Leadtime
2-3 weeks		RS-X1N-SSGCONN SOCKET SIP 20POS GOLDBulk508ActiveSIP20 1 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
5L56M-OXW-LD
5L56M-OXW-LD
1+10.3725
10+9.27647
100+7.6398
500+6.03912
1000+5.18418
Increments of 1
2222-CJ-9HCONN SOCKET SIP 61POS GOLDBulk346ActiveSIP61 1 x 61 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
546-83-145-15-081135
546-83-145-15-081135
28+15.875
Increments of 28
Leadtime
2-3 weeks		V9B-SM-UXKCONN SOCKET PGA 145POS GOLDBulk546ActivePGA145 15 x 15 0.050 1.27mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BronzePolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-43-320-41-801000
110-43-320-41-801000
1+4.92157
10+4.07059
50+3.39216
100+3.05294
250+2.81549
Increments of 1
Leadtime
2-3 weeks		XPIBD-87-R6XCONN IC DIP SOCKET 20POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
614-93-308-41-001000
614-93-308-41-001000
50+11.4312
250+3.28584
500+2.08676
Increments of 50
22BX8-H7-H7CONN IC DIP SOCKET 8POS GOLDTube614ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
2-822064-4
2-822064-4
Leadtime
2-3 weeks		SEKZB-QBW-JBCONN SOCKET PQFP 100POS TIN-LEADTube-ObsoleteQFP100 4 x 25 0.025 0.64mm Tin-Lead200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameSolder0.025 0.64mm Tin-Lead200µin 5.08µm Phosphor BronzeLiquid Crystal Polymer LCP -