ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
06-2513-10
06-2513-10
99+1.12497
Increments of 99
Leadtime
2-3 weeks		TTH-FT-QHSCONN IC DIP SOCKET 6POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.2 5.08mm Row Spacing6 2 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
08-6810-90
08-6810-90
15+7.37647
Increments of 15
Leadtime
2-3 weeks		BR009-I87U-9MCONN IC DIP SOCKET 8POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing8 2 x 4 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
APA-318-T-K
APA-318-T-K
1+2.57843
Increments of 1
Leadtime
2-3 weeks		DMCDA-9C6-1FAADAPTOR PLUG-*Active---------------
30-1508-20
30-1508-20
11+10.1702
Increments of 11
Leadtime
2-3 weeks		HL0ZA-S3R-K8CONN IC DIP SOCKET 30POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing30 2 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
14-3513-11H
14-3513-11H
50+3.72549
Increments of 50
Leadtime
2-3 weeks		NAV3H-NAG-WGHCONN IC DIP SOCKET 14POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
40-6823-90T
40-6823-90T
6+15.2827
Increments of 6
Leadtime
2-3 weeks		P4TR-OHF-TFCCONN IC DIP SOCKET 40POS TINBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
86-GUY6-639
86-GUY6-639
120+4.41904
Increments of 120
Leadtime
2-3 weeks		SU5M-O1-5BCONN IC DIP SOCKET 50POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
117-87-642-41-005101
117-87-642-41-005101
1+2.40196
10+2.18039
100+1.86922
500+1.55767
1000+1.33515
Increments of 1
Leadtime
2-3 weeks		Q1UBZ-69XV-8QCONN IC DIP SOCKET 42POS GOLDTube117ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.070 1.78mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
08-1508-21
08-1508-21
20+5.56471
Increments of 20
Leadtime
2-3 weeks		KD-FBHK-B3BCONN IC DIP SOCKET 8POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing8 2 x 4 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
D01-9972442
D01-9972442
2400+0.882549
Increments of 2400
Leadtime
2-3 weeks		U04P6-V8-4IUCONN SOCKET SIP 24POS GOLDBulkD01-997ActiveSIP24 1 x 24 0.100 2.54mm GoldFlashBeryllium CopperThrough Hole-Solder0.100 2.54mm Tin196.8µin 5.00µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Glass Filled-55°C ~ 125°C
24-C212-30
24-C212-30
7+13.6162
Increments of 7
Leadtime
2-3 weeks		XH6GT-KJN-ZLYCONN IC DIP SOCKET 24POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
1-2199298-4
1-2199298-4
1+0.186275
10+0.178431
25+0.152549
50+0.133529
100+0.12402
Increments of 1
663663C9-03-JU16P,DIP SKT,300 CL,LDR,PB FREE-*Active---------------
SIP050-1X16-157BLF
SIP050-1X16-157BLF
7575FX-Z9-5VCONN SOCKET SIP 16POS TINBulkSIP050-1xObsoleteSIP16 1 x 16 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-
110-83-628-41-005101
110-83-628-41-005101
252+1.77536
Increments of 252
Leadtime
2-3 weeks		URART-N0J-C4CONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
546-87-168-17-101135
546-87-168-17-101135
36+16.0044
Increments of 36
1515M-2A7-39CONN SOCKET PGA 168POS GOLDBulk546ActivePGA168 17 x 17 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BronzePolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-93-640-41-008000
116-93-640-41-008000
50+13.2855
100+10.695
250+6.54918
Increments of 50
66N3-FU1-Q6KCONN IC DIP SOCKET 40POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
08-2822-90C
08-2822-90C
22+5.36453
Increments of 22
Leadtime
2-3 weeks		S2-RICX-4WCONN IC DIP SOCKET 8POS GOLDBulkVertisockets™ 800ActiveDIP, 0.2 5.08mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
44-3571-11
44-3571-11
4+23.4559
Increments of 4
Leadtime
2-3 weeks		AW6-KUKB-WNLCONN IC DIP SOCKET ZIF 44POS GLDBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing44 2 x 22 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
10-81250-610C
10-81250-610C
16+6.75123
Increments of 16
Leadtime
2-3 weeks		HM7JQ-D2QM-RRCONN IC DIP SOCKET 10POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
110-87-628-41-105191
110-87-628-41-105191
400+1.96351
Increments of 400
Leadtime
2-3 weeks		PPQQ-CZ9-GLCONN IC DIP SOCKET 28POS GOLDTape & Reel TR 110ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
16-6513-11H
16-6513-11H
22+5.55303
Increments of 22
Leadtime
2-3 weeks		TAS0E-5Z-5PKCONN IC DIP SOCKET 16POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.6 15.24mm Row Spacing16 2 x 8 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
44-6554-18
44-6554-18
7+98.4804
Increments of 7
Leadtime
2-3 weeks		WTG-S12-35CONN IC DIP SOCKET ZIF 44POSBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing44 2 x 22 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyetheretherketone PEEK , Glass Filled-55°C ~ 250°C
1-1903401-4
1-1903401-4
Leadtime
2-3 weeks		LHZP3-163-MLCONN SOCKET PGA 638POS GOLDTape & Reel TR -ObsoletePGA638 26 x 26 0.050 1.27mm GoldFlashCopper AlloySurface MountOpen FrameSolder0.050 1.27mm Gold-Copper AlloyThermoplastic-
822114-3
822114-3
Leadtime
2-3 weeks		OF34-Q71-49CONN SOCKET PQFP 144POS TIN-LEADTube-ObsoleteQFP144 4 x 36 0.050 1.27mm Tin-Lead200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Tin-Lead200µin 5.08µm Phosphor BronzeLiquid Crystal Polymer LCP -
116-93-950-41-008000
116-93-950-41-008000
56+15.2365
112+10.9736
280+7.74398
Increments of 56
Leadtime
2-3 weeks		HI-08-GZCONN IC DIP SOCKET 50POS GOLDTube116ActiveDIP, 0.9 22.86mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C