ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
346-93-156-41-013000
346-93-156-41-013000
1+9.38235
10+8.39608
100+6.91422
500+5.46549
1000+4.69176
Increments of 1
Leadtime
2-3 weeks		TI-7WV-VIZCONN SOCKET SIP 56POS GOLDBulk346ActiveSIP56 1 x 56 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
17-0501-21
17-0501-21
10+9.88529
Increments of 10
5656PG-7N17-OOFCONN SOCKET SIP 17POS GOLDBulk501ActiveSIP17 1 x 17 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
24-4518-10H
24-4518-10H
20+5.41373
Increments of 20
Leadtime
2-3 weeks		EAD-NF35-GX3CONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
20-8685-310C
20-8685-310C
10+9.79412
Increments of 10
66Z-OIXJ-4BCONN IC DIP SOCKET 20POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
O3L-7GA7-7Q
O3L-7GA7-7Q
10+9.12353
Increments of 10
Leadtime
2-3 weeks		T64-36-QGCONN IC DIP SOCKET 18POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
123-13-306-41-001000
123-13-306-41-001000
67+10.7812
134+7.19059
536+2.74559
Increments of 67
Leadtime
2-3 weeks		M7S0A-ZLD3-HHCONN IC DIP SOCKET 6POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
124-93-964-41-002000
124-93-964-41-002000
54+19.8132
108+14.184
270+11.1749
Increments of 54
Leadtime
2-3 weeks		W26-BUEI-II3CONN IC DIP SOCKET 64POS GOLDTube124ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
18-1508-30
18-1508-30
17+6.47059
Increments of 17
Leadtime
2-3 weeks		AE4I-FA-NPCONN IC DIP SOCKET 18POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing18 2 x 9 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
110-83-632-41-105191
110-83-632-41-105191
400+2.96975
Increments of 400
88T5Z-C44-M57CONN IC DIP SOCKET 32POS GOLDTape & Reel TR 110ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
224-1275-00-0602J
224-1275-00-0602J
1+18.7549
10+17.4167
25+15.6298
50+15.1833
100+13.3971
Increments of 1
Leadtime
2-3 weeks		R89-29B-RAOCONN IC DIP SOCKET ZIF 24POS GLDBulkTextool™ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperConnectorClosed FramePress-Fit0.100 2.54mm Gold30µin 0.76µm Beryllium CopperPolysulfone PSU , Glass Filled-55°C ~ 125°C
S1RRY-FUP-AN
S1RRY-FUP-AN
11+23.9537
Increments of 11
Leadtime
2-3 weeks		JI20-69-9PCONN IC DIP SOCKET ZIF 24POSBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
3-1571586-2
3-1571586-2
1200+4.62714
Increments of 1200
11WRIY-YX6E-L95CONN IC DIP SOCKET 40POS GOLDTube800ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold25µin 0.63µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold25µin 0.63µm CopperPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 105°C
04-1508-30
04-1508-30
68+1.63235
Increments of 68
Leadtime
2-3 weeks		Y9-HZ-IWNCONN IC DIP SOCKET 4POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing4 2 x 2 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
4-1437531-1
4-1437531-1
600+7.24279
Increments of 600
Leadtime
2-3 weeks		0GVFT-4BE-QLCONN IC DIP SOCKET 16POS GOLDTube500ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold-Copper AlloyThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold-Copper Alloy--55°C ~ 125°C
48-6511-10
48-6511-10
20+6.10392
Increments of 20
Leadtime
2-3 weeks		B4-YI-5FCONN IC DIP SOCKET 48POS TINBulk511ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
48-3574-11
48-3574-11
7+24.5294
Increments of 7
39000000039E7-8NZJ-G1XCONN IC DIP SOCKET ZIF 48POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
126-93-650-41-001000
126-93-650-41-001000
56+15.7976
112+11.5019
280+8.21778
Increments of 56
Leadtime
2-3 weeks		T7X-61W7-HOCONN IC DIP SOCKET 50POS GOLDTube126ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
124-93-964-41-002000
124-93-964-41-002000
54+19.8132
108+14.184
270+11.1749
Increments of 54
33HH-MA-6MCONN IC DIP SOCKET 64POS GOLDTube124ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
116-87-422-41-008101
116-87-422-41-008101
266+1.8449
Increments of 266
11CKH6-KW5-TG8CONN IC DIP SOCKET 22POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
10-7500-10
10-7500-10
13+8.29714
Increments of 13
Leadtime
2-3 weeks		IC-NJ-4Z4CONN SOCKET SIP 10POS TINBulk700 Elevator Strip-Line™ActiveSIP10 1 x 10 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-83-304-41-007101
116-83-304-41-007101
1296+0.345176
Increments of 1296
Leadtime
2-3 weeks		YXCO-LA6-6TCONN IC DIP SOCKET 4POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
124-93-648-41-002000
124-93-648-41-002000
56+16.8459
112+13.3522
280+9.10189
Increments of 56
Leadtime
2-3 weeks		FFL-29LH-13QCONN IC DIP SOCKET 48POS GOLDTube124ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
116-83-424-41-004101
116-83-424-41-004101
136+3.76442
Increments of 136
Leadtime
2-3 weeks		0MNH-OWCJ-67CONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
JEC3L-2L-IL9
JEC3L-2L-IL9
1+4.56863
10+3.77843
50+3.14902
100+2.83412
250+2.61369
Increments of 1
Leadtime
2-3 weeks		QFLE-WJW-SPCONN IC DIP SOCKET 40POS GOLDTube115ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
BT-ODL-16
BT-ODL-16
54+13.2262
108+9.1496
270+5.59815
Increments of 54
Leadtime
2-3 weeks		VBS-2A0-FLCONN IC DIP SOCKET 22POS GOLDTube126ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C