ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
2DCB RR7I NLP
2DCB RR7I NLP
2+35.6716
Increments of 2
Leadtime
2 3 weeks		VCO-SAN-EFCONN IC DIP SOCKET 40POS GOLDBulk6556ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder Cup0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled
123-93-322-41-001000
123-93-322-41-001000
54+11.8402
108+7.79557
270+4.60294
Increments of 54
Leadtime
2-3 weeks		WPT-CM3-WMBCONN IC DIP SOCKET 22POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
532-AG10D
532-AG10D
1+10.8431
10+9.8598
50+8.87353
100+8.38059
250+7.64114
Increments of 1
55R8-QDE-2ACONN IC DIP SOCKET 32POS GOLDTube500ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleClosed FrameSolder0.100 2.54mm Gold25µin 0.63µm Copper AlloyPolyester-55°C ~ 125°C
146-93-624-41-012000
146-93-624-41-012000
64+11.3954
128+7.59689
256+4.22059
Increments of 64
Leadtime
2-3 weeks		PBAJN-020-FL0CONN IC DIP SOCKET 24POS GOLDTube146ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
32-C182-31
32-C182-31
4+18.4706
Increments of 4
33I-V5VE-GMCONN IC DIP SOCKET 32POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
116-83-640-41-007101
116-83-640-41-007101
120+4.18439
Increments of 120
Leadtime
2-3 weeks		Q9E-QUJ-X8YCONN IC DIP SOCKET 40POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
1-1437537-1
1-1437537-1
Leadtime
2-3 weeks		BL8C-OH-C8PCONN IC DIP SOCKET 8POS GOLDTube800ObsoleteDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold25µin 0.63µm Copper AlloySurface MountOpen FrameSolder0.100 2.54mm --BrassThermoplastic-55°C ~ 125°C
YA-JCZD-PQN
YA-JCZD-PQN
Leadtime
2-3 weeks		OF-UK-TM8CONN IC DIP SOCKET 20POS GOLDBulk100ObsoleteDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold8µin 0.20µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm GoldFlashBrassPolyphenylene Sulfide PPS , Glass Filled-65°C ~ 125°C
24-3513-11
24-3513-11
24+5.60008
Increments of 24
Leadtime
2-3 weeks		QV2I-1MH-7RCONN IC DIP SOCKET 24POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
ZXRJ J1V KVA
ZXRJ J1V KVA
72+7.33946
Increments of 72
Leadtime
2 3 weeks		OQ-EO1M-6LPGA SOLDER TAILBulk550ActivePGA68 11 x 11 0.100 2.54mm Tin Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled 55°C ~ 125°C
550-10-296-19-131135
550-10-296-19-131135
10+49.3618
Increments of 10
Leadtime
2-3 weeks		K0L-O66-BYPGA SOLDER TAILBulk550ActivePGA296 19 x 19 0.050 1.27mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
32-C300-20
32-C300-20
5+15.1176
Increments of 5
Leadtime
2-3 weeks		Z7-0ES-Y4YCONN IC DIP SOCKET 32POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
4606
4606
1+2.08824
10+1.41275
50+1.26824
100+1.21059
250+1.09529
Increments of 1
77SX-RNQ-A9SCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 Rectangular -Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
917-93-104-41-005000
917-93-104-41-005000
1+1.7549
10+1.3598
25+1.26706
50+1.15196
100+1.03676
Increments of 1
Leadtime
2-3 weeks		BHH-6X-JNCONN TRANSIST TO-5 4POS GOLDTube917ActiveTransistor, TO-54 Round -Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder-Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
126-93-422-41-002000
126-93-422-41-002000
54+13.2262
108+9.1496
270+5.59815
Increments of 54
Leadtime
2-3 weeks		UUQ-FA9-DKCONN IC DIP SOCKET 22POS GOLDTube126ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
2-2129710-5
2-2129710-5
1+36.2745
10+32.7451
50+29.4118
100+28.4314
250+26.8627
Increments of 1
33M6H-YP-7NLEFT SIDE LGA3647-0 SOCKET- P0-*Active---------------
614-87-312-41-001101
614-87-312-41-001101
782+0.577157
Increments of 782
44C3XX-1O-3DCONN IC DIP SOCKET 12POS GOLDBulk614ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
DILB16P-223TLF
DILB16P-223TLF
1+0.27451
10+0.260784
25+0.223922
50+0.190196
100+0.182745
Increments of 1
Leadtime
2-3 weeks		T979-5N70-KJUCONN IC DIP SOCKET 16POS TINTube-ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Tin100µin 2.54µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm Tin100µin 2.54µm Copper AlloyPolyamide PA , Nylon-55°C ~ 105°C
S0SL5-PD8-8B
S0SL5-PD8-8B
80+10.9689
160+7.06195
560+2.71176
Increments of 80
4444RA-P9-9FFCONN IC DIP SOCKET 10POS GOLDTube126ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester 55°C ~ 125°C
26-8984-310C
26-8984-310C
8+13.549
Increments of 8
505V-AB9-H0TCONN IC DIP SOCKET 26POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing26 2 x 13 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
546-87-182-14-001135
546-87-182-14-001135
30+15.852
Increments of 30
Leadtime
2-3 weeks		YXXJ8-BDT-FPXCONN SOCKET PGA 182POS GOLDBulk546ActivePGA182 14 x 14 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BronzePolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-6571-10
24-6571-10
12+10.411
Increments of 12
Leadtime
2-3 weeks		U07-04-077CONN IC DIP SOCKET ZIF 24POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
546-87-168-17-101135
546-87-168-17-101135
36+16.0044
Increments of 36
Leadtime
2-3 weeks		WA-J8-56CONN SOCKET PGA 168POS GOLDBulk546ActivePGA168 17 x 17 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BronzePolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-3518-10H
24-3518-10H
32+4.65441
Increments of 32
1414CPR-XL0I-6DBCONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
06-3513-11H
06-3513-11H
60+2.19608
Increments of 60
Leadtime
2-3 weeks		NWFLY-P4-7ZWCONN IC DIP SOCKET 6POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-