ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
28-6501-30
28-6501-30
26+6.86275
Increments of 26
Leadtime
2-3 weeks		LWV-XL-8VGCONN IC DIP SOCKET 28POS TINBulk501ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
200-6313-9UN-1900
200-6313-9UN-1900
1+43.3824
10+40.8314
25+39.5553
50+37.0035
100+34.9619
Increments of 1
Leadtime
2-3 weeks		YD-OSQ-BOTCONN SOCKET PGA ZIF 169POS GOLDBulkTextool™ActivePGA, ZIF ZIP 169 13 x 13 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold30µin 0.76µm Beryllium CopperPolyethersulfone PES -55°C ~ 150°C
22-3513-11H
22-3513-11H
15+7.46275
Increments of 15
Leadtime
2-3 weeks		APD-8Q7R-TNCONN IC DIP SOCKET 22POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
225-PRS15001-12
225-PRS15001-12
1+67.1176
25+62.3235
100+59.9265
Increments of 1
Leadtime
2-3 weeks		XBZW-KO-QGCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
22-0508-31
22-0508-31
8+13.6275
Increments of 8
Leadtime
2-3 weeks		ENW2-Q0-EBTCONN SOCKET SIP 22POS GOLDBulk508ActiveSIP22 1 x 22 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
APA-422-G-A
APA-422-G-A
1+6.37255
Increments of 1
Leadtime
2-3 weeks		S0-04M-CAADAPTOR PLUG-*Active---------------
514-87-321-19-121154
514-87-321-19-121154
20+21.5877
Increments of 20
Leadtime
2-3 weeks		O356-IGY-KRYCONN SOCKET PGA 321POS GOLDBulk514ActivePGA321 19 x 19 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
127-93-448-41-003000
127-93-448-41-003000
60+15.8995
120+12.3708
300+8.30252
Increments of 60
9090-32CC-HT8CONN IC DIP SOCKET 48POS GOLDTube127ActiveDIP, 0.4 10.16mm Row Spacing48 2 x 24 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.070 1.78mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
ICO-308-LTT
ICO-308-LTT
1+1.09804
Increments of 1
Leadtime
2-3 weeks		C95-9K1A-HTCONN IC DIP SOCKET 8POS TINBulkICOActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolyester, Glass Filled-55°C ~ 105°C
10-1508-20
10-1508-20
30+3.77223
Increments of 30
Leadtime
2-3 weeks		O0L5G-4UV-HJECONN IC DIP SOCKET 10POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
34-0518-10T
34-0518-10T
33+3.4192
Increments of 33
33T-JNR-MUCONN SOCKET SIP 34POS GOLDBulk518ActiveSIP34 1 x 34 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
RWH9-1A-2JI
RWH9-1A-2JI
Leadtime
2-3 weeks		DBFMO-TTUT-ZGCONN IC DIP SOCKET 8POS GOLD--ObsoleteDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold--Through HoleOpen Frame-0.100 2.54mm Gold----
44-6575-18
44-6575-18
1+117.775
Increments of 1
Leadtime
2-3 weeks		UAV-4D3F-F7YCONN IC DIP SOCKET ZIF 44POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing44 2 x 22 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
15-0508-30
15-0508-30
20+5.41373
Increments of 20
8686Z-M5NR-D0CONN SOCKET SIP 15POS GOLDBulk508ActiveSIP15 1 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
1B9-JN76-FE
1B9-JN76-FE
22+28.0463
Increments of 22
Leadtime
2-3 weeks		I5CFD-6J8C-9DCONN SOCKET PGA 369POS GOLDBulk517ActivePGA369 18 x 18 0.050 1.27mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
16-8325-311C
16-8325-311C
11+10.2736
Increments of 11
66N6-PHEH-E5CONN IC DIP SOCKET 16POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
APA-322-T-P
APA-322-T-P
1+4.90196
Increments of 1
66F8W-1Z-SJRADAPTOR PLUG-*Active---------------
196-PLS14001-16
196-PLS14001-16
1+106.451
Increments of 1
Leadtime
2-3 weeks		GRK-NQ41-X0ECONN SOCKET PGA ZIF GOLDBulkPLSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Nickel Bronze50µin 1.27µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 200°C
123-93-640-41-001000
123-93-640-41-001000
1+7.09804
10+6.00294
50+5.18412
100+4.63833
250+4.09267
Increments of 1
Leadtime
2-3 weeks		T3XR-TOL-OS3CONN IC DIP SOCKET 40POS GOLDTube123ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
299-83-316-11-001101
299-83-316-11-001101
156+3.3454
Increments of 156
7575DTT-UT-2GRCONN IC DIP SOCKET 16POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
124-93-964-41-002000
124-93-964-41-002000
54+19.8132
108+14.184
270+11.1749
Increments of 54
33Z-7N-O9ICONN IC DIP SOCKET 64POS GOLDTube124ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
AR20-HZW T
AR20-HZW T
Leadtime
2-3 weeks		NU-CBB-IVXCONN IC DIP SOCKET 20POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold-Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
123-13-420-41-001000
123-13-420-41-001000
60+13.0428
120+8.96871
300+5.44461
Increments of 60
Leadtime
2-3 weeks		KT7Y-HMO-2ZNCONN IC DIP SOCKET 20POS GOLDTube123ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
510-87-161-14-051101
510-87-161-14-051101
90+6.37037
Increments of 90
Leadtime
2-3 weeks		KZ-727-OHCONN SOCKET PGA 161POS GOLDBulk510ActivePGA161 14 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
40-3573-16
40-3573-16
7+35.1176
Increments of 7
Leadtime
2-3 weeks		R6N-DP-QLCONN IC DIP SOCKET ZIF 40POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing40 2 x 20 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-