ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
20-8975-310C
20-8975-310C
10+9.79412
Increments of 10
33QAKC-12-2HVCONN IC DIP SOCKET 20POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
AR64-HZW T-R
AR64-HZW T-R
Leadtime
2-3 weeks		TNOY7-EXGC-83CONN IC DIP SOCKET 64POS GOLDTube-ObsoleteDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold-Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
20-4508-31
20-4508-31
6+16.1993
Increments of 6
Leadtime
2-3 weeks		MUFO-2FZ2-9LCONN IC DIP SOCKET 20POS GOLDBulk508ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
38-1518-10T
38-1518-10T
30+3.79412
Increments of 30
Leadtime
2-3 weeks		QJX-RP-VNGCONN IC DIP SOCKET 38POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing38 2 x 19 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
APA-322-T-D
APA-322-T-D
1+4.09804
Increments of 1
99ZQ0-PL2-6J9ADAPTOR PLUG-*Active---------------
ICO-316-M-TT
ICO-316-M-TT
1+1.65686
Increments of 1
Leadtime
2-3 weeks		XR-YEX-VLCONN IC DIP SOCKET 16POS TINBulkICOActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolyester, Glass Filled-55°C ~ 105°C
110-87-424-41-105101
110-87-424-41-105101
323+1.50689
Increments of 323
Leadtime
2-3 weeks		HFA7-HH-SHCONN IC DIP SOCKET 24POS GOLDTube110ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
APA-648-T-B
APA-648-T-B
1+9.67647
Increments of 1
Leadtime
2-3 weeks		OCEZ-KY-H4ADAPTOR PLUG-*Active---------------
26-0501-21
26-0501-21
7+12.5336
Increments of 7
77AVAZ-60I1-A4HCONN SOCKET SIP 26POS GOLDBulk501ActiveSIP26 1 x 26 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
116-87-318-41-012101
116-87-318-41-012101
368+1.29427
Increments of 368
77YBX-8Z-QPCONN IC DIP SOCKET 18POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-87-310-41-105161
110-87-310-41-105161
738+0.637549
Increments of 738
Leadtime
2-3 weeks		0MVDR-TE-VPBCONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
3-822516-7-Cut
3-822516-7
Leadtime
2-3 weeks		IP-GL1-P1CONN SOCKET PLCC 32POS TINCut Tape CT -ObsoletePLCC32 2 x 7, 2 x 9 0.050 1.27mm Tin100µin 2.54µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin100µin 2.54µm Phosphor BronzeThermoplastic-
TVY9N-UNP-DN
TVY9N-UNP-DN
54+12.0626
108+6.73094
270+3.85705
Increments of 54
Leadtime
2-3 weeks		H3BR-GMOR-V3CONN IC DIP SOCKET 22POS GOLDTube111ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
TCC05DCSN-S1403
TCC05DCSN-S1403
1+11.5882
10+10.902
50+9.88
100+9.53922
250+8.85784
Increments of 1
Leadtime
2-3 weeks		WGN41-KL24-8GCONN TRANSIST TO-220 TO-247 5POSBulk-ActiveTransistor, TO-220 and TO-2475 Rectangular -Gold30µin 0.76µm Beryllium CopperThrough Hole-Solder-Gold30µin 0.76µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 175°C
116-83-210-41-008101
116-83-210-41-008101
462+1.06152
Increments of 462
Leadtime
2-3 weeks		P5V-BJ8A-MMDCONN IC DIP SOCKET 10POS GOLDTube116ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
5S6JG-WHSD-EV7
5S6JG-WHSD-EV7
1000+0.433598
Increments of 1000
Leadtime
2-3 weeks		KBJ-6CH-LOCONN IC DIP SOCKET 8POS GOLDTape & Reel TR 114ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm GoldFlashBeryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
100-006-000
100-006-000
Leadtime
2-3 weeks		CDA-3P-K3CONN IC DIP SOCKET 6POS GOLDBulk100ObsoleteDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Gold8µin 0.20µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm GoldFlashBrassPolyphenylene Sulfide PPS , Glass Filled-65°C ~ 125°C
30-PRS16020-12
30-PRS16020-12
2+51.4167
Increments of 2
Leadtime
2-3 weeks		Z4-M77-BZFCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
14-0518-10H
14-0518-10H
68+1.63235
Increments of 68
Leadtime
2-3 weeks		HC919-YU-X50CONN SOCKET SIP 14POS GOLDBulk518ActiveSIP14 1 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
10-18-2031
10-18-2031
2525TR-CX-XPECONN SOCKET TRANSIST TO-220 3POS-4038ObsoleteTransistor, TO-2203 Rectangular 0.100 2.54mm Tin-BrassThrough HoleClosed FrameSolder0.100 2.54mm Tin100µin 2.54µm BrassPolyester, Glass Filled-
612-83-652-41-001101
612-83-652-41-001101
126+4.06076
Increments of 126
Leadtime
2-3 weeks		YMPY0-0UU-N4CONN IC DIP SOCKET 52POS GOLDBulk612ActiveDIP, 0.6 15.24mm Row Spacing52 2 x 26 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
104-13-210-41-780000
104-13-210-41-780000
80+10.7527
160+6.85331
320+3.98888
Increments of 80
66SKR-2SY-JVCONN IC DIP SOCKET 10POS GOLDTube104ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
217-93-764-41-005000
217-93-764-41-005000
56+13.8918
112+10.7512
280+7.09933
Increments of 56
Leadtime
2-3 weeks		KD1-0GE2-QZCONN IC DIP SOCKET 64POS GOLDTube217ActiveDIP, 0.75 19.05mm Row Spacing64 2 x 32 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.070 1.78mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
123-13-320-41-801000
123-13-320-41-801000
60+13.889
120+10.8029
300+6.9998
Increments of 60
99RX-FRV-NRCONN IC DIP SOCKET 20POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
28-6552-10
28-6552-10
54+8.91848
Increments of 54
Leadtime
2-3 weeks		SNBY-FS3-QG1CONN IC DIP SOCKET ZIF 28POS TINBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-