ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
10-2513-10H
10-2513-10H
38+2.91176
Increments of 38
Leadtime
2-3 weeks		R28W-QHFQ-4DCONN IC DIP SOCKET 10POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
05-0518-10T
05-0518-10T
193+0.573559
Increments of 193
44P3-IZ9-YI6CONN SOCKET SIP 5POS GOLDBulk518ActiveSIP5 1 x 5 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
540AG12DES
540AG12DES
Leadtime
2-3 weeks		GZNO-EDT-HRCONN IC DIP SOCKET 40POS TINLEADBulk500ObsoleteDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Tin-Lead-Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm --Brass--55°C ~ 105°C
510-83-281-19-081101
510-83-281-19-081101
33+16.1533
Increments of 33
Leadtime
2-3 weeks		CY0AQ-WI-XICONN SOCKET PGA 281POS GOLDBulk510ActivePGA281 19 x 19 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
40-0501-31
40-0501-31
6+16.0327
Increments of 6
77N5X-MY-CTXCONN SOCKET SIP 40POS GOLDBulk501ActiveSIP40 1 x 40 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
APA-648-G-J
APA-648-G-J
1+9.71569
Increments of 1
Leadtime
2-3 weeks		LSX2Z-JH3-NRADAPTOR PLUG-*Active---------------
NBCJ8-553-ZC2
NBCJ8-553-ZC2
1+0.45098
10+0.426471
25+0.383922
50+0.341176
100+0.326961
Increments of 1
Leadtime
2-3 weeks		I1MQ-4GJ2-XSCONN IC DIP SOCKET 28POS TINTube-ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin-Phosphor BronzePolybutylene Terephthalate PBT -55°C ~ 85°C
124-93-432-41-002000
124-93-432-41-002000
60+14.4332
120+11.3743
300+6.96706
Increments of 60
Leadtime
2-3 weeks		HOO-OH-WERCONN IC DIP SOCKET 32POS GOLDTube124ActiveDIP, 0.4 10.16mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
510-87-132-13-002101
510-87-132-13-002101
96+5.22304
Increments of 96
Leadtime
2-3 weeks		OX1E-HNZY-8HCONN SOCKET PGA 132POS GOLDBulk510ActivePGA132 13 x 13 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-87-076-11-041101
510-87-076-11-041101
171+3.00723
Increments of 171
Leadtime
2-3 weeks		B8X9M-05-UHCONN SOCKET PGA 76POS GOLDBulk510ActivePGA76 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
16-8700-610C
16-8700-610C
12+9.32679
Increments of 12
Leadtime
2-3 weeks		R8I-08-P1CONN IC DIP SOCKET 16POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing16 2 x 8 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
510-83-100-13-061101
510-83-100-13-061101
80+6.56985
Increments of 80
55KDI-GAQS-90CONN SOCKET PGA 100POS GOLDBulk510ActivePGA100 13 x 13 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
7-1437539-7
7-1437539-7
Leadtime
2-3 weeks		TNM-4X-71CONN IC DIP SOCKET 24POS GOLDTube800ObsoleteDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold5µin 0.127µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm ---Polyester-55°C ~ 105°C
8432-21A1-RK-TP
8432-21A1-RK-TP
1+1.37255
10+1.24902
25+1.17255
50+1.12157
100+1.07059
Increments of 1
77IG-IY3A-O4CONN SOCKET PLCC 32POS TINTube8400ActivePLCC32 2 x 7, 2 x 9 0.050 1.27mm Tin160µin 4.06µm Copper AlloySurface MountClosed FrameSolder0.050 1.27mm Tin160µin 4.06µm Copper AlloyPolybutylene Terephthalate PBT , Glass Filled-40°C ~ 105°C
D2820-42
D2820-42
1+1.55882
10+1.41765
25+1.33059
50+1.27255
100+1.21471
Increments of 1
44Y-UD9-SXCONN IC DIP SOCKET 20POS GOLDTubeD2ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin196.8µin 5.00µm BrassPlastic-55°C ~ 125°C
614-83-628-41-001101
614-83-628-41-001101
238+2.1312
Increments of 238
44MSE5-7EG-73CONN IC DIP SOCKET 28POS GOLDBulk614ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-83-314-41-105191
110-83-314-41-105191
550+1.428
Increments of 550
99EO0-K5S-H3CONN IC DIP SOCKET 14POS GOLDTape & Reel TR 110ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
122-83-308-41-001101
122-83-308-41-001101
636+0.710108
Increments of 636
Leadtime
2-3 weeks		X5S-SWW-RECONN IC DIP SOCKET 8POS GOLDTube122ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-93-642-41-003000
116-93-642-41-003000
54+13.8887
108+10.2878
270+6.22788
Increments of 54
Leadtime
2-3 weeks		DFDAR-J1A-QSCONN IC DIP SOCKET 42POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
XR3G-6401
XR3G-6401
10+15.4657
Increments of 10
Leadtime
2-3 weeks		OUI-H1-11WCONN IC SOCKET 64POS--Active---------------
2-1437532-2
2-1437532-2
99OX-HS7C-PO5CONN IC DIP SOCKET 24POS-500ObsoleteDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm ---Through HoleClosed Frame-------
XR2A-2815
XR2A-2815
17+6.4977
Increments of 17
Leadtime
2-3 weeks		NIRJ-XUDI-WC9CONN IC DIP SOCKET 28POS GOLDBulkXR2ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolybutylene Terephthalate PBT , Glass Filled-55°C ~ 125°C
20-8400-610C
20-8400-610C
10+10.0118
Increments of 10
Leadtime
2-3 weeks		HSUH-QIBM-ZP9CONN IC DIP SOCKET 20POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
122-13-420-41-001000
122-13-420-41-001000
60+12.5453
120+8.48243
300+5.03235
Increments of 60
Leadtime
2-3 weeks		BE-NIT-DWGCONN IC DIP SOCKET 20POS GOLDTube122ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
5ES-PE9-9Y9
5ES-PE9-9Y9
13+8.44118
Increments of 13
Leadtime
2-3 weeks		N4-JXA-WHCONN IC DIP SOCKET 24POS GOLDBulk503ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C