ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
33-0501-31
33-0501-31
7+14.7003
Increments of 7
22R-XEQ-46GCONN SOCKET SIP 33POS GOLDBulk501ActiveSIP33 1 x 33 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
116-93-320-41-001000
116-93-320-41-001000
60+11.9327
120+7.88522
300+4.68235
Increments of 60
55EV-XGK-F8TCONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
32-3574-10
32-3574-10
10+13.2588
Increments of 10
Leadtime
2-3 weeks		NOE-BEKI-010CONN IC DIP SOCKET ZIF 32POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing32 2 x 16 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
40-6501-21
40-6501-21
9+13.8998
Increments of 9
Leadtime
2-3 weeks		YZ-XOU-AVNCONN IC DIP SOCKET 40POS GOLDBulk501ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
614-83-225-17-061112
614-83-225-17-061112
24+26.3133
Increments of 24
77GOH-256-8JKCONN SOCKET PGA 225POS GOLDBulk614ActivePGA225 17 x 17 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
127-93-668-41-003000
127-93-668-41-003000
56+19.215
112+13.6627
280+10.6893
Increments of 56
8181M1-2S23-NZCONN IC DIP SOCKET 68POS GOLDTube127ActiveDIP, 0.6 15.24mm Row Spacing68 2 x 34 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.070 1.78mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
100-020-050
100-020-050
Leadtime
2-3 weeks		QI3E-2E-EZCONN IC DIP SOCKET 20POS GOLDBulk100ObsoleteDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold8µin 0.20µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm GoldFlashBrassPolyphenylene Sulfide PPS , Glass Filled-65°C ~ 125°C
110-83-312-41-005101
110-83-312-41-005101
578+0.782647
Increments of 578
Leadtime
2-3 weeks		D1HLW-JH2-YCCONN IC DIP SOCKET 12POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-304-41-004101
116-83-304-41-004101
864+0.548961
Increments of 864
Leadtime
2-3 weeks		Y1ED-AS2-TNFCONN IC DIP SOCKET 4POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
APA-632-G-Q
APA-632-G-Q
1+17.3137
Increments of 1
Leadtime
2-3 weeks		XKNRH-BS-GNADAPTOR PLUG-*Active---------------
115-87-328-41-001101
115-87-328-41-001101
448+1.08813
Increments of 448
Leadtime
2-3 weeks		GM1-IXP-Q9WCONN IC DIP SOCKET 28POS GOLDTube115ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-87-069-11-001101
510-87-069-11-001101
190+2.73019
Increments of 190
Leadtime
2-3 weeks		BT5V-IDV-JWCONN SOCKET PGA 69POS GOLDBulk510ActivePGA69 11 x 11 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
EQ-QX-3UR
EQ-QX-3UR
8+17.5882
Increments of 8
3232SJB-PO-UWOCONN IC DIP SOCKET ZIF 32POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing32 2 x 16 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
2-1814654-7
2-1814654-7
Leadtime
2-3 weeks		JDHI-711W-L6WCONN IC DIP SOCKET 28POS GOLDTube-ObsoleteDIP, 0.4 10.16mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm --BronzeThermoplastic, Polyester-55°C ~ 125°C
12-6810-90C
12-6810-90C
1+9.9902
25+8.68627
100+6.94902
500+5.86324
1000+5.5375
Increments of 1
Leadtime
2-3 weeks		G0E6C-69Y-E5LCONN IC DIP SOCKET 12POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6 15.24mm Row Spacing12 2 x 6 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
510-83-085-11-044101
510-83-085-11-044101
95+5.58421
Increments of 95
Leadtime
2-3 weeks		ZIPH5-PK97-W6CONN SOCKET PGA 85POS GOLDBulk510ActivePGA85 11 x 11 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-636-41-013101
116-83-636-41-013101
66+7.69236
Increments of 66
4646ZV-J77-6ESCONN IC DIP SOCKET 36POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-87-624-41-006101
116-87-624-41-006101
357+1.34597
Increments of 357
2828GI-QNZ-K5ICONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
127-93-448-41-002000
127-93-448-41-002000
60+15.0062
120+11.4444
300+7.54941
Increments of 60
Leadtime
2-3 weeks		ARCZ-WR-QRICONN IC DIP SOCKET 48POS GOLDTube127ActiveDIP, 0.4 10.16mm Row Spacing48 2 x 24 0.070 1.78mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.070 1.78mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
612-87-652-41-001101
612-87-652-41-001101
343+2.58509
Increments of 343
Leadtime
2-3 weeks		UW5X-ZN-S9CONN IC DIP SOCKET 52POS GOLDBulk612ActiveDIP, 0.6 15.24mm Row Spacing52 2 x 26 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
APA-628-T-B
APA-628-T-B
1+5.90196
Increments of 1
Leadtime
2-3 weeks		U1X-0PUH-A6ADAPTOR PLUG-*Active---------------
116-87-420-41-007101
116-87-420-41-007101
315+1.55058
Increments of 315
77TL0-JSP-JSCONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
HIC-764-SST
HIC-764-SST
1+5.95098
Increments of 1
Leadtime
2-3 weeks		JF-0KR-49UCONN IC DIP SOCKET 64POS GOLDTubeHICActiveDIP, 0.75 19.05mm Row Spacing64 2 x 32 0.070 1.78mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Gold200µin 5.08µm BrassPolyester, Glass Filled-
14-822-90TWR
14-822-90TWR
14+7.59734
Increments of 14
Leadtime
2-3 weeks		VA-K2-SYCONN IC DIP SOCKET 14POS TINBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6-
09-0503-31
09-0503-31
18+6.10403
Increments of 18
Leadtime
2-3 weeks		G8MY-V3OX-8XRCONN SOCKET SIP 9POS GOLDBulk0503ActiveSIP9 1 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA , Nylon, Glass Filled-