ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
104-13-424-41-770000
104-13-424-41-770000
64+12.2866
128+8.23024
256+4.98529
Increments of 64
Leadtime
2-3 weeks		E9-NW9-QMCONN IC DIP SOCKET 24POS GOLDTube104ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Gold10µin 0.25µm Brass AlloyThermoplastic-
07-0511-11
07-0511-11
25+9.52941
Increments of 25
Leadtime
2-3 weeks		QMEY-0KVA-9LCONN SOCKET SIP 7POS GOLDBulk511ActiveSIP7 1 x 7 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
346-43-102-41-013000
346-43-102-41-013000
1+2.04902
10+1.82941
100+1.50676
500+1.19108
1000+1.02246
Increments of 1
Leadtime
2-3 weeks		IUEO-SQ-TPNCONN SOCKET SIP 2POS GOLDBulk346ActiveSIP2 1 x 2 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
40-3513-10H
40-3513-10H
20+8.29706
Increments of 20
Leadtime
2-3 weeks		Y1PD-Q6-L0NCONN IC DIP SOCKET 40POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
14-8510-310C
14-8510-310C
13+8.13272
Increments of 13
Leadtime
2-3 weeks		G2-5T1Z-8AVCONN IC DIP SOCKET 14POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
517-87-299-16-091111
517-87-299-16-091111
36+16.5482
Increments of 36
Leadtime
2-3 weeks		CV41Z-7S-9ECONN SOCKET PGA 299POS GOLDBulk517ActivePGA299 16 x 16 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
4600
4600
1+2.28431
10+1.48431
50+1.33294
100+1.27235
250+1.15118
Increments of 1
Leadtime
2-3 weeks		B5-N63-02CONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 Oval -Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
940-44-044-17-400000
940-44-044-17-400000
1+1.71569
10+1.33039
50+1.12745
100+1.01471
250+0.856863
Increments of 1
Leadtime
2-3 weeks		V3LW8-WOS-UXCONN SOCKET PLCC 44POS TINTube940ActivePLCC44 4 x 11 0.050 1.27mm Tin150µin 3.81µm Beryllium CopperSurface MountClosed FrameSolder0.050 1.27mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
10-0518-11H
10-0518-11H
47+2.38235
Increments of 47
Leadtime
2-3 weeks		YC-TB-576CONN SOCKET SIP 10POS GOLDBulk518ActiveSIP10 1 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
116-83-636-41-004101
116-83-636-41-004101
154+5.36427
Increments of 154
5656-78B-OSCONN IC DIP SOCKET 36POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
AR20-HZL 07-TT-R
AR20-HZL 07-TT-R
6000+1.54598
Increments of 6000
Leadtime
2-3 weeks		PXS2-1Z-75CONN IC DIP SOCKET 20POS GOLDTube-ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
SIP1X20-011BLF
SIP1X20-011BLF
Leadtime
2-3 weeks		G3A-XVY-AVGCONN SOCKET SIP 20POS GOLDBulkSIP1xObsoleteSIP20 1 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled-
AR20-HZL 01-TT
AR20-HZL 01-TT
Leadtime
2-3 weeks		C66OY-B3-TUCONN IC DIP SOCKET 20POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
40-3553-16
40-3553-16
56+40.1751
Increments of 56
Leadtime
2-3 weeks		PFW-EUG5-88CONN IC DIP SOCKET ZIF 40POSBulk55ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing40 2 x 20 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
346-93-119-41-013000
346-93-119-41-013000
1+4.31373
10+3.86078
100+3.17922
500+2.51312
1000+2.15734
Increments of 1
Leadtime
2-3 weeks		N52IS-M9S-VLCONN SOCKET SIP 19POS GOLDBulk346ActiveSIP19 1 x 19 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
36-6556-20
36-6556-20
7+14.3922
Increments of 7
Leadtime
2-3 weeks		XNPHR-M5-7CSCONN IC DIP SOCKET 36POS GOLDBulk6556ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled-
8KE6W CNU B1
8KE6W CNU B1
13+8.29714
Increments of 13
Leadtime
2 3 weeks		ND5FD-NSA-TI5CONN SOCKET SIP 10POS TINBulk700 Elevator Strip Line™ActiveSIP10 1 x 10 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled 55°C ~ 105°C
E7AQ4 S5S NRL
E7AQ4 S5S NRL
91+6.29121
Increments of 91
Leadtime
2 3 weeks		DU-8UP-B7CONN SOCKET PGA 159POS GOLDBulk510ActivePGA159 16 x 16 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled 55°C ~ 125°C
ICO-308-LTT
ICO-308-LTT
1+1.09804
Increments of 1
99A-FI-J5DCONN IC DIP SOCKET 8POS TINBulkICOActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolyester, Glass Filled-55°C ~ 105°C
D01-9500742
D01-9500742
Leadtime
2-3 weeks		0S-C8-T7CONN SOCKET SIP 7POS GOLDBulkD01-950ObsoleteSIP7 1 x 7 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevatedSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Glass Filled-55°C ~ 125°C
11-0513-11
11-0513-11
47+2.36024
Increments of 47
Leadtime
2-3 weeks		EU1-4G-KBCONN SOCKET SIP 11POS GOLDBulk0513ActiveSIP11 1 x 11 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
550-80-296-19-131135
550-80-296-19-131135
20+37.5681
Increments of 20
Leadtime
2-3 weeks		NE448-L5-NL0PGA SOLDER TAILBulk550ActivePGA296 19 x 19 0.050 1.27mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-83-304-41-013101
116-83-304-41-013101
648+0.809637
Increments of 648
99GBHU-OGS4-EGCONN IC DIP SOCKET 4POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
146-83-310-41-035101
146-83-310-41-035101
492+1.01781
Increments of 492
Leadtime
2-3 weeks		S5H-D2HN-SLKCONN IC DIP SOCKET 10POS GOLDTube146ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
20-0513-10
20-0513-10
42+2.64706
Increments of 42
77L2-YLD-9Y4CONN SOCKET SIP 20POS GOLDBulk0513ActiveSIP20 1 x 20 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-