ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
1050282031
1050282031
800+1.422
1600+1.21288
2400+1.17106
5600+1.11251
8000+1.08741
Increments of 800
Leadtime
2-3 weeks		YR4HX-T20K-9ECONN CAMERA SOCKET 32POS GOLDTape & Reel TR 105028ActiveCamera Socket32 4 x 8 0.035 0.90mm Gold3µin 0.08µm Copper AlloySurface MountOpen FrameSolder0.035 0.90mm GoldFlashCopper AlloyPlastic-
4818-3000-CP
4818-3000-CP
1+0.568627
10+0.529412
25+0.476471
50+0.423529
100+0.405882
Increments of 1
Leadtime
2-3 weeks		QFKW-IZ6-W9YCONN IC DIP SOCKET 18POS TINTube4800ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Tin35µin 0.90µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin35µin 0.90µm Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
3OUB-2JL-DV3
3OUB-2JL-DV3
1+0.941176
10+0.731373
25+0.681961
50+0.620196
100+0.558137
Increments of 1
Leadtime
2-3 weeks		C4FQ-YT-OFUCONN IC DIP SOCKET 8POS TIN-LEADTube214ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Tin-Lead100µin 2.54µm Beryllium CopperSurface MountClosed FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
20-7905-10
20-7905-10
10+9.25
Increments of 10
33NAW3-ZQ-8I6CONN SOCKET SIP 20POS TINBulk700 Elevator Strip-Line™ActiveSIP20 1 x 20 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-87-306-41-008101
116-87-306-41-008101
994+0.463412
Increments of 994
Leadtime
2-3 weeks		DQ-CTB-372CONN IC DIP SOCKET 6POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
32-3574-18
32-3574-18
10+87.0755
Increments of 10
Leadtime
2-3 weeks		N8SD-TXP-2ICONN IC DIP SOCKET ZIF 32POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing32 2 x 16 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
F0F-7CNP-W31
F0F-7CNP-W31
54+12.1049
108+6.9616
270+3.92869
Increments of 54
Leadtime
2-3 weeks		VG-WLCU-U3CONN IC DIP SOCKET 42POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
110-93-640-41-105000
110-93-640-41-105000
60+12.5694
120+8.87753
300+5.1148
Increments of 60
55TPB-HY-Q0CONN IC DIP SOCKET 40POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
510-83-100-13-061101
510-83-100-13-061101
80+6.56985
Increments of 80
Leadtime
2-3 weeks		S5-PB-K6CONN SOCKET PGA 100POS GOLDBulk510ActivePGA100 13 x 13 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
01-0517-90C
01-0517-90C
278+0.352941
Increments of 278
99A657-26G-TI9CONN SOCKET SIP 1POS GOLDBulk0517ActiveSIP1 1 x 1 -Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle-Solder-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
614-83-432-31-012101
614-83-432-31-012101
180+2.7902
Increments of 180
77VUUK-N58-SNCONN IC DIP SOCKET 32POS GOLDBulk614ActiveDIP, 0.4 10.16mm Row Spacing32 2 x 16 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
111-93-648-41-001000
111-93-648-41-001000
56+12.5368
112+8.84261
280+5.08778
Increments of 56
Leadtime
2-3 weeks		WZTW-2AE-WWCONN IC DIP SOCKET 48POS GOLDTube111ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
42-6572-11
42-6572-11
4+22.6912
Increments of 4
Leadtime
2-3 weeks		TKNP-FJG-9WVCONN IC DIP SOCKET ZIF 42POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing42 2 x 21 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
50-9508-21
50-9508-21
3+35.9869
Increments of 3
88DQ0-ILA-XNOCONN IC DIP SOCKET 50POS GOLDBulk508ActiveDIP, 0.9 22.86mm Row Spacing50 2 x 25 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
116-93-432-41-001000
116-93-432-41-001000
60+13.9755
120+9.88047
300+6.21794
Increments of 60
44RTS8-F901-B1CONN IC DIP SOCKET 32POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
110-87-314-10-002101
110-87-314-10-002101
841+0.524833
Increments of 841
Leadtime
2-3 weeks		RC-GCCP-7VYCONN IC DIP SOCKET 14POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 , 8 Loaded0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
8468-21B1-RK-TR-Cut
8468-21B1-RK-TR
Leadtime
2-3 weeks		M1KKV-1L-D32CONN SOCKET PLCC 68POS TINCut Tape CT 84000PLCC68 4 x 17 0.050 1.27mm Tin160µin 4.06µm Copper AlloySurface MountClosed FrameSolder0.050 1.27mm Tin160µin 4.06µm Copper AlloyPolybutylene Terephthalate PBT , Glass Filled-40°C ~ 105°C
614-87-306-41-001101
614-87-306-41-001101
1518+0.263843
Increments of 1518
Leadtime
2-3 weeks		O0FT7-P8-YPFCONN IC DIP SOCKET 6POS GOLDBulk614ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
APA-316-T-K
APA-316-T-K
1+2.46078
Increments of 1
Leadtime
2-3 weeks		PVC-5VP-FOADAPTOR PLUG-*Active---------------
AR18-HZL 07-TT
AR18-HZL 07-TT
Leadtime
2-3 weeks		V2L9H-XXK-XUHCONN IC DIP SOCKET 18POS GOLDTube-ObsoleteDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
12-3513-10T
12-3513-10T
77+1.43379
Increments of 77
Leadtime
2-3 weeks		I96-YO0-F5WCONN IC DIP SOCKET 12POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
48-6621-30
48-6621-30
5+16.5
Increments of 5
Leadtime
2-3 weeks		FYR1-SI-EWRCONN IC DIP SOCKET 48POS TINBulk6621ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Bottom Entry; Through BoardClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
111-43-640-41-001000
111-43-640-41-001000
300+2.77968
Increments of 300
Leadtime
2-3 weeks		IOLQ-CDQ5-CG2CONN IC DIP SOCKET 40POS GOLDTube111ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
S1-RA94-O1H
S1-RA94-O1H
22+5.55303
Increments of 22
Leadtime
2-3 weeks		IL-DWV-HW2CONN IC DIP SOCKET 10POS GOLDBulk511ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
12-4513-10
12-4513-10
60+1.85294
Increments of 60
Leadtime
2-3 weeks		SFLB0-YW-LBCONN IC DIP SOCKET 12POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.4 10.16mm Row Spacing12 2 x 6 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-