ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
122-13-424-41-001000
122-13-424-41-001000
64+13.3485
128+9.26808
256+5.69907
Increments of 64
Leadtime
2-3 weeks		P2I3A-F7-T2CONN IC DIP SOCKET 24POS GOLDTube122ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
D2814-42
D2814-42
1+1.13725
10+1
25+0.941176
50+0.901961
100+0.862745
Increments of 1
Leadtime
2-3 weeks		HBYVI-AFDN-DBCONN IC DIP SOCKET 14POS GOLDTubeD2ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin196.8µin 5.00µm BrassPlastic-55°C ~ 125°C
24-6511-11
24-6511-11
20+10.2324
Increments of 20
Leadtime
2-3 weeks		D0LC-CEUB-14PCONN IC DIP SOCKET 24POS GOLDBulk511ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
84-536-11
84-536-11
88YF-GDW1-IBPCONN SOCKET PLCC ZIF 84POS GOLD-536ObsoletePLCC, ZIF ZIP 84 4 x 21 0.050 1.27mm Gold12µin 0.30µm -Through HoleOpen Frame-------
IU68-MF6-EG8
IU68-MF6-EG8
32+15.7656
Increments of 32
Leadtime
2-3 weeks		YZ-7RX-EL1CONN SOCKET PGA 144POS GOLDBulk546ActivePGA144 13 x 130.050 1.27mmGold29.5µin 0.75µmBeryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mmTin-BronzePolycyclohexylenedimethylene Terephthalate PCT, Polyester, Glass Filled-55°C ~ 125°C
06-0513-10
06-0513-10
139+0.794118
Increments of 139
Leadtime
2-3 weeks		AMB3-2J-ZMQCONN SOCKET SIP 6POS GOLDBulk0513ActiveSIP6 1 x 6 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
WMS-480Z
WMS-480Z
5000+1.07182
Increments of 5000
Leadtime
2-3 weeks		NN5Y-Y2P-YZCONN IC DIP SOCKET 48POS GOLDTubeWMSActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen Frame, Wash AwaySolder0.100 2.54mm Tin200µin 5.08µm Brass--40°C ~ 105°C
514-83-292M20-001148
514-83-292M20-001148
19+70.8302
Increments of 19
Leadtime
2-3 weeks		HQY3-3C9C-RJCONN SOCKET BGA 292POS GOLDBulk514ActiveBGA292 20 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
110-87-316-01-822101
110-87-316-01-822101
950+0.462343
Increments of 950
Leadtime
2-3 weeks		U45JW-3C-RRKCONN IC DIP SOCKET 16POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 , 4 Loaded0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
FO-80-WM
FO-80-WM
1+2.86275
10+2.36961
50+1.97451
100+1.77706
250+1.63886
Increments of 1
Leadtime
2-3 weeks		AVJ-IV-DBCONN IC DIP SOCKET 28POS TINTube214ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin100µin 2.54µm Beryllium CopperSurface MountClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
614-87-325-18-111144
614-87-325-18-111144
11+50.0668
Increments of 11
Leadtime
2-3 weeks		PFW-P69L-50CONN SOCKET PGA 325POS GOLDBulk614ActivePGA325 18 x 18 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
06-6513-10H
06-6513-10H
47+2.36024
Increments of 47
Leadtime
2-3 weeks		WVG-GR6P-6JGCONN IC DIP SOCKET 6POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.6 15.24mm Row Spacing6 2 x 3 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
110-43-210-10-002000
110-43-210-10-002000
1+2.20588
10+1.83431
50+1.52863
100+1.35882
250+1.18898
Increments of 1
Leadtime
2-3 weeks		AV-VNB7-4XMCONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.2 5.08mm Row Spacing10 2 x 5 , 8 Loaded0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
SA286000
SA286000
1+1.27451
10+1.12255
50+1.01255
100+0.968431
250+0.880392
Increments of 1
Leadtime
2-3 weeks		AB93-UM96-I9ACONN IC DIP SOCKET 28POS GOLDTubeSAActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassThermoplastic, Polyester, Glass Filled-40°C ~ 105°C
299-93-324-11-001000
299-93-324-11-001000
160+5.53836
Increments of 160
Leadtime
2-3 weeks		SEAZ-RZ9Y-5YCONN IC DIP SOCKET 24POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
F82R4-40-XA
F82R4-40-XA
832+0.546696
Increments of 832
Leadtime
2-3 weeks		BC0-BQ-KOCONN IC DIP SOCKET 8POS GOLDBulk612ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
122-87-306-41-001101
122-87-306-41-001101
1136+0.385118
Increments of 1136
Leadtime
2-3 weeks		WZB-CO-NLKCONN IC DIP SOCKET 6POS GOLDTube122ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
6WPZ-Y9-CBD
6WPZ-Y9-CBD
1+1.43137
10+1.29902
100+1.11382
500+0.928196
1000+0.795588
Increments of 1
Leadtime
2-3 weeks		YI8-P7DG-G82-WAY IC SKT 5.08 FUSE HOLDER-*Active---------------
GZM9-CQAZ-AI
GZM9-CQAZ-AI
16+7.48407
Increments of 16
Leadtime
2-3 weeks		MBX-LPR1-YGYCONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
GJ 2HXK 2R
GJ 2HXK 2R
Leadtime
2 3 weeks		NQU3Q-GS-9DCONN SOCKET PLCC 28POS TINTube ObsoletePLCC28 4 x 7 0.050 1.27mm Tin150µin 3.81µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm Phosphor BronzePolyphenylene Sulfide PPS 55°C ~ 125°C
05-0517-90C
05-0517-90C
62+1.78684
Increments of 62
Leadtime
2-3 weeks		YE38F-AI-XR7CONN SOCKET SIP 5POS GOLDBulk0517ActiveSIP5 1 x 5 -Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle-Solder-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
26-0508-31
26-0508-31
7+13.6499
Increments of 7
Leadtime
2-3 weeks		F1ED2-SK0D-L7ACONN SOCKET SIP 26POS GOLDBulk508ActiveSIP26 1 x 26 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
O4-IR6U-2TT
O4-IR6U-2TT
4343-N9M-WKCONN SOCKET PLCC 44POS TINTubeD830ObsoletePLCC44 4 x 11 0.050 1.27mm Tin-Phosphor BronzeSurface MountBoard Guide, Closed FrameSolder0.050 1.27mm Tin-Phosphor BronzePolyphenylene Sulfide PPS -50°C ~ 105°C
08-2822-90C
08-2822-90C
22+5.36453
Increments of 22
Leadtime
2-3 weeks		DBTC-R4-02CONN IC DIP SOCKET 8POS GOLDBulkVertisockets™ 800ActiveDIP, 0.2 5.08mm Row Spacing8 2 x 4 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
146-83-318-41-035101
146-83-318-41-035101
264+1.83196
Increments of 264
Leadtime
2-3 weeks		XTIG-Y1G-JFCONN IC DIP SOCKET 18POS GOLDTube146ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C