ManufacturerSeriesPart StatusConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Convert From (Adapter ...
Convert To (Adapter ...
Number of Pins
Pitch - Mating
Contact Finish - ...
Mounting Type
Termination
Pitch - Post
Contact Finish - ...
Housing Material
Board Material
YP2-OQ-U2N
YP2-OQ-U2N
220+11.9961
Increments of 220
Leadtime
2 3 weeks		WIQ-PHZ4-S1SOCKET ADAPT SOIC W TO 16DIP 0.3Correct A Chip® 35W000ActiveSOIC WDIP, 0.3 7.62mm Row Spacing160.050 1.27mm Through HoleSolder0.100 2.54mm Gold FR4 Epoxy Glass
KTZ-D0-T2S
KTZ-D0-T2S
16+15.2537
Increments of 16
Leadtime
2-3 weeks		YGQKX-KKF-LESOCKET ADAPTER SSOP TO 24DIP 0.3Correct-A-Chip® 351000ActiveSSOPDIP, 0.3 7.62mm Row Spacing240.026 0.65mm -Through HoleSolder0.100 2.54mm Tin-Lead-FR4 Epoxy Glass
NZ5 7T YFQ
NZ5 7T YFQ
154+13.0765
Increments of 154
77DTTX-2J-PDSOCKET ADAPTER SOIC TO 28DIP 0.3Correct A Chip® 350000ActiveSOICDIP, 0.3 7.62mm Row Spacing280.050 1.27mm Through HoleSolder0.100 2.54mm Gold FR4 Epoxy Glass
OG-GX2-A24
OG-GX2-A24
1+29.3627
10+26.5069
25+25.3961
50+23.8088
100+23.0152
Increments of 1
Leadtime
2 3 weeks		NSL2Y-A5-X7RECEPTACLE DIP SOCKET 64POS .9 Textool™Active Gold GoldPolysulfone PSU , Glass Filled
DJO-HFG9-X4
DJO-HFG9-X4
154+4.93334
Increments of 154
Leadtime
2-3 weeks		G8LQ-UQ04-MGWSOCKET ADAPTER SOIC TO 14DIP 0.3Correct-A-Chip® 350000ActiveSOICDIP, 0.3 7.62mm Row Spacing140.050 1.27mm TinThrough HoleSolder0.100 2.54mm Tin-Lead-Polyimide PI
WJW0-3UBF-XDT
WJW0-3UBF-XDT
84+29.9779
Increments of 84
6464-3F9-2NSOCKET ADAPTER SOIC TO 28DIP 0.6Correct A Chip® 650000ActiveSOICDIP, 0.6 15.24mm Row Spacing280.050 1.27mm GoldThrough HoleSolder0.100 2.54mm Gold FR4 Epoxy Glass
RT-0K-XM
RT-0K-XM
1+5.31373
25+4.1251
100+3.3
500+2.75
1000+2.43833
Increments of 1
Leadtime
2 3 weeks		CD-D7VL-7NSOCKET ADAPTER SOIC W TO 20DIPCorrect A Chip®ActiveSOIC WDIP, 0.6 15.24mm Row Spacing200.050 1.27mm Through HoleSolder0.100 2.54mm GoldPolyesterFR4 Epoxy Glass
LCQT-SOIC8-8
LCQT-SOIC8-8
1+3.0098
25+2.31882
100+1.8549
500+1.48392
1000+1.3448
Increments of 1
Leadtime
2-3 weeks		EK3-G9-K9SOCKET ADAPTER SOIC TO 8DIPCorrect-A-Chip®ActiveSOICDIP, 0.3 7.62mm Row Spacing80.050 1.27mm -Through HoleSolder0.100 2.54mm GoldPolyesterFR4 Epoxy Glass
LCQT-QFP0.5-40
LCQT-QFP0.5-40
17+8.0173
Increments of 17
22UZ-DXC-5MESOCKET ADAPTER MULT PKG TO 40QFPCorrect-A-Chip®ActiveMultiple PackagesQFP400.020 0.50mm -Through HoleSolder0.100 2.54mm GoldPolyesterFR4 Epoxy Glass
9YK8-IH8S-CLP
9YK8-IH8S-CLP
72+27.2647
Increments of 72
88S-P1-Y98SOCKET ADAPTER PLCC TO 68PGACorrect-A-Chip® 505ActivePLCCPGA680.050 1.27mm -Through HoleSolder0.050 1.27mm Tin-Lead-FR4 Epoxy Glass
AV63 S0T0 48
AV63 S0T0 48
7+14.2353
Increments of 7
Leadtime
2 3 weeks		S9S-PU-7R5SOCKET ADAPTER DIP TO 40DIP 0.3Correct A Chip® 1107254ActiveDIP, 0.6 15.24mm Row SpacingDIP, 0.3 7.62mm Row Spacing400.100 2.54mm GoldThrough HoleSolder0.100 2.54mm TinPolyamide PA46 , Nylon 4 6, Glass Filled
ROQ-7K-609
ROQ-7K-609
1+19.6078
Increments of 1
Leadtime
2-3 weeks		EC-MODJ-W98ADAPTER 40TSSOP TO 40DIP-Active-----------
ETOA8-ZNM-QAX
ETOA8-ZNM-QAX
1+4.18627
25+3.25137
100+2.60118
500+2.16765
1000+1.92198
Increments of 1
Leadtime
2-3 weeks		W9T-N5H-O0SOCKET ADAPTER SOIC-W TO 16DIPCorrect-A-Chip®ActiveSOIC-WDIP, 0.6 15.24mm Row Spacing160.050 1.27mm -Through HoleSolder0.100 2.54mm GoldPolyesterFR4 Epoxy Glass
RWRLR-J8-SF9
RWRLR-J8-SF9
1+103.108
Increments of 1
Leadtime
2-3 weeks		0IP0E-1HE-3PSOCKET ADAPTER QFP TO 144PGACorrect-A-Chip® 97-68340ActiveQFPPGA1440.026 0.65mm TinThrough HoleSolder0.100 2.54mm Tin-FR4 Epoxy Glass
16-354W00-10
16-354W00-10
5+15.5451
Increments of 5
11KK-1Q3L-CKCONN ADAPTER 16PIN DIP TO SOWICCorrect-A-Chip® 354W00Active-----------
2NL-SX-ETN
2NL-SX-ETN
1+4.90196
Increments of 1
Leadtime
2-3 weeks		UR4UG-AZT-CKESOCKET ADAPTER SSOP TO 8DIP-ActiveSSOPDIP80.050 1.27mm -Through HoleSolder0.100 2.54mm ---
PA-TS1D6SM18-32
PA-TS1D6SM18-32
1+15.6863
Increments of 1
Leadtime
2-3 weeks		F7BK-0ZP-YS1ADAPTER 32TSOP TO 32DIP-Active-----------
GLRO-QX-GXB
GLRO-QX-GXB
1+6.62745
25+5.13961
100+4.11176
500+3.42647
1000+3.03814
Increments of 1
Leadtime
2-3 weeks		J00-QVX-60SOCKET ADAPTER TSSOP TO 28DIPCorrect-A-Chip®ActiveTSSOPDIP, 0.6 15.24mm Row Spacing280.026 0.65mm-Through HoleSolder0.100 2.54mmGoldPolyesterFR4 Epoxy Glass
LCQT-TSOP40
LCQT-TSOP40
24+5.84926
Increments of 24
44W-Q9-PHSOCKET ADAPTER TSOP TO 40DIPCorrect-A-Chip®ActiveTSOPDIP, 0.6 15.24mm Row Spacing400.020 0.50mm -Through HoleSolder0.100 2.54mm GoldPolyesterFR4 Epoxy Glass
LML4-LASV-2B
LML4-LASV-2B
3+34.1928
Increments of 3
Leadtime
2-3 weeks		WK6-YE-NZSOCKET ADAPTER QFP TO 132PGACorrect-A-Chip® 95-132I25ActiveQFPPGA1320.025 0.64mm TinThrough HoleSolder0.100 2.54mm Tin-Lead-FR4 Epoxy Glass
44-505-110
44-505-110
9+10.9412
Increments of 9
99FUST-HMKP-BASOCKET ADAPTER PLCC TO 44PGACorrect-A-Chip® 505ActivePLCCPGA440.050 1.27mm -Through HoleSolder0.050 1.27mm Tin-Lead-FR4 Epoxy Glass
C1X8N-S8-QE
C1X8N-S8-QE
1+4.18627
25+3.25137
100+2.60118
500+2.16765
1000+1.92198
Increments of 1
Leadtime
2-3 weeks		ED0WO-VGX-NBXSOCKET ADAPTER SOIC-W TO 16DIPCorrect-A-Chip®ActiveSOIC-WDIP, 0.6 15.24mm Row Spacing160.050 1.27mm -Through HoleSolder0.100 2.54mm GoldPolyesterFR4 Epoxy Glass
V0YV L79S 1R
V0YV L79S 1R
33+6.91771
Increments of 33
Leadtime
2 3 weeks		JDZPS-9ORK-KASOCKET ADAPTER SOIC TO 12DIP 0.3Correct A Chip® 350000ActiveSOICDIP, 0.3 7.62mm Row Spacing120.050 1.27mm TinThrough HoleSolder0.100 2.54mm Tin Lead Polyimide PI
BS-7H57-7F
BS-7H57-7F
1+6.62745
25+5.13961
100+4.11176
500+3.42647
1000+3.03814
Increments of 1
Leadtime
2-3 weeks		YRC-7E-BWHSOCKET ADAPTER TSSOP TO 28DIPCorrect-A-Chip®ActiveTSSOPDIP, 0.6 15.24mm Row Spacing280.026 0.65mm-Through HoleSolder0.100 2.54mmGoldPolyesterFR4 Epoxy Glass
RC2V2-9FR1-8P
RC2V2-9FR1-8P
1+18.1765
25+16.9647
100+15.7529
500+15.1471
Increments of 1
Leadtime
2 3 weeks		IVZCB-PUT4-IBSOCKET ADAPTER SOIC TO 28DIP 0.6Correct A Chip® 650000ActiveSOICDIP, 0.6 15.24mm Row Spacing280.050 1.27mm Through HoleSolder0.100 2.54mm Tin Lead FR4 Epoxy Glass